FDG6304P_D87Z Equivalent & Substitute Parts

Part Overview

The FDG6304P_D87Z is a dual P-channel MOSFET array manufactured by onsemi, designed for surface mount applications in logic-level gate switching circuits. This component integrates two P-channel MOSFETs in a compact 6-TSSOP (SC-88) package, rated for 25V drain-to-source voltage and 410mA continuous drain current with 300mW maximum power dissipation.

The FDG6304P_D87Z carries an obsolete product status. Identifying equivalent and substitute parts is necessary to ensure design continuity, maintain supply chain reliability, and support ongoing production or repair requirements for legacy systems utilizing this component.

Substiute Parts

FDG6304P_D87Z

onsemiIn Stock: 797FDG6304P_D87Z Datasheet

Current PartRFQ

FDG6304P

onsemiIn Stock: 35246FDG6304P Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the FDG6304P_D87Z is determined by strict equivalence across all electrical and mechanical parameters. The substitute part must satisfy the following criteria:

Electrical Parameters (Must Match Exactly):

• Dual P-channel MOSFET configuration
• 25V drain-to-source voltage rating
• 410mA continuous drain current capability at 25°C
• 1.1Ohm maximum on-state resistance at 410mA, 4.5V gate-source voltage
• 1.5V maximum gate-source threshold voltage at 250µA drain current
• 1.5nC maximum gate charge at 4.5V
• 62pF maximum input capacitance at 10V
• 300mW maximum power dissipation
• Logic level gate operation

Mechanical Parameters (Must Match Exactly):

• 6-TSSOP (SC-88, SOT-363) surface mount package
• Operating temperature range of -55°C to 150°C (junction temperature)

Compliance Parameters:

• REACH Unaffected status
• EAR99 export classification
• HTSUS code 8541.21.0095

Parts meeting all these criteria are classified as direct electrical and mechanical equivalents.

Parameter Comparison

Engineering Selection Recommendations

The FDG6304P is a direct electrical and mechanical equivalent to the FDG6304P_D87Z. Both parts share identical electrical specifications, package configuration, and compliance certifications.

Primary Advantage: The FDG6304P carries an active product status, ensuring ongoing manufacturer support, availability, and supply chain continuity. The FDG6304P_D87Z is classified as obsolete, which presents long-term sourcing challenges.

Compliance Alignment: Both parts maintain REACH Unaffected status, EAR99 export classification, and identical HTSUS coding, ensuring regulatory equivalence for procurement and deployment.

Packaging Availability: The FDG6304P is supplied in Cut Tape (CT) and Digi-Reel® packaging formats, providing flexibility for both prototype and production-volume applications. The FDG6304P_D87Z packaging format is not specified in the provided data.

For new designs, repair operations, or production continuity, the FDG6304P is the appropriate selection due to its active status and confirmed availability.

Frequently Asked Questions (FAQ)

Q: Can the FDG6304P directly replace the FDG6304P_D87Z in existing circuit designs?

A: Yes. The FDG6304P is a direct electrical and mechanical equivalent. All electrical parameters, including voltage ratings, current capacity, on-state resistance, gate characteristics, and thermal specifications, are identical. The 6-TSSOP (SC-88) package footprint is identical, enabling direct PCB-level substitution without circuit modification.

Q: Why is the FDG6304P_D87Z listed as obsolete?

A: Product obsolescence is determined by the manufacturer based on market demand, technology evolution, and production decisions. The FDG6304P_D87Z has been superseded by the FDG6304P, which maintains identical specifications while offering active production status and improved supply availability.

Q: Are there any differences in gate-level logic operation between these parts?

A: No. Both parts feature logic level gate operation with identical gate-source threshold voltage specifications (1.5V maximum at 250µA). Gate drive requirements and logic compatibility are identical.

Q: What is the significance of the packaging format difference (Cut Tape vs. unspecified)?

A: The FDG6304P is available in Cut Tape (CT) and Digi-Reel® formats, supporting both small-quantity and high-volume procurement. Packaging format does not affect electrical performance or PCB-level compatibility. Selection of packaging format depends on production volume and assembly process requirements.

Q: Are thermal characteristics identical between these parts?

A: Yes. Both parts operate across the identical temperature range (-55°C to 150°C junction temperature) and share the same 300mW maximum power dissipation rating. Thermal performance in circuit applications is equivalent.

Q: Do these parts require different PCB layout or thermal management approaches?

A: No. Identical package geometry, power rating, and thermal specifications eliminate the need for layout or thermal management modifications when substituting the FDG6304P for the FDG6304P_D87Z.

Q: Is the FDG6304P suitable for new product designs?

A: Yes. The FDG6304P carries active product status, confirming ongoing manufacturer support and production availability. It is appropriate for both new designs and legacy system support.