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FDFS6N548 N-Channel MOSFET Equivalent & Substitute Parts
Part Overview
The FDFS6N548 is an N-Channel MOSFET manufactured by onsemi, rated for 30V drain-to-source voltage with 7A continuous drain current in an 8-SOIC surface mount package. This device is classified as obsolete, necessitating identification of active equivalent parts for ongoing design requirements and production continuity. The part features a PowerTrench® series design with integrated Schottky diode and operates across the industrial temperature range of -55°C to 150°C.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Drain-to-Source Voltage (Vdss) | 30 | V |
| Continuous Drain Current (Id) @ 25°C | 7 | A |
| On-Resistance (Rds On) @ 7A, 10V | 23 | mOhm |
| Gate Threshold Voltage (Vgs(th)) @ 250µA | 2.5 | V |
| Gate Charge (Qg) @ 10V | 13 | nC |
| Input Capacitance (Ciss) @ 15V | 700 | pF |
| Power Dissipation (Max) | 1.6 | W |
| Operating Temperature Range | -55 to 150 | °C |
| Package Type | 8-SOIC | — |
| Mounting Type | Surface Mount | — |
Substitute Part Grouping Explanation
Substitution of the FDFS6N548 is determined by electrical and mechanical compatibility across the following critical parameters:
Electrical Compatibility Criteria:
- Drain-to-Source Voltage (Vdss): Must equal or exceed 30V
- Continuous Drain Current (Id): Must equal or exceed 7A at 25°C
- On-Resistance (Rds On): Must not exceed 23mOhm at rated current and gate voltage
- Gate Threshold Voltage (Vgs(th)): Must fall within acceptable switching range (2.0V to 2.5V @ 250µA)
- Gate Charge (Qg): Lower values indicate faster switching; values up to 17nC are acceptable
- Input Capacitance (Ciss): Lower values reduce gate drive requirements; values up to 700pF are acceptable
- Operating Temperature: Must support -55°C to 150°C range
Mechanical Compatibility Criteria:
- Package Type: 8-SOIC form factor required for PCB layout compatibility
- Mounting Type: Surface mount configuration mandatory
- Pin Configuration: 8-pin layout must match SOIC standard
Regulatory Compliance:
- RoHS3 compliance required
- REACH unaffected status required
- Moisture Sensitivity Level (MSL) of 1 or 3 acceptable for standard handling
Parameter Comparison
| Parameter | FDFS6N548 (Main) | DMG4466SSS-13 | TSM180N03CS RLG |
|---|---|---|---|
| Manufacturer | onsemi | Diodes Incorporated | Taiwan Semiconductor Corporation |
| Product Status | Obsolete | Active | Active |
| Vdss (V) | 30 | 30 | 30 |
| Id @ 25°C (A) | 7 | 10 | 9 |
| Rds On (mOhm) | 23 @ 7A, 10V | 23 @ 10A, 10V | 18 @ 8A, 10V |
| Vgs(th) (V) | 2.5 @ 250µA | 2.4 @ 250µA | 2.0 @ 250µA |
| Qg (nC) | 13 @ 10V | 17 @ 10V | 14 @ 4.5V |
| Ciss (pF) | 700 @ 15V | 478.9 @ 15V | 345 @ 25V |
| Power Dissipation (W) | 1.6 | 1.42 | 2.5 |
| Operating Temperature (°C) | -55 to 150 | -55 to 150 | -55 to 150 |
| Package | 8-SOIC | 8-SO | 8-SOP |
| RoHS3 Compliant | Yes | Yes | Yes |
| MSL Rating | 1 (Unlimited) | 1 (Unlimited) | 3 (168 Hours) |
Engineering Selection Recommendations
DMG4466SSS-13 (Diodes Incorporated)
The DMG4466SSS-13 is an active product with electrical parameters that exceed the FDFS6N548 specification. It provides 10A continuous drain current versus the original 7A, maintaining identical 30V Vdss rating and 23mOhm on-resistance. The gate threshold voltage of 2.4V is within acceptable range. Input capacitance is reduced to 478.9pF, improving gate drive efficiency. Power dissipation is lower at 1.42W. The device maintains full -55°C to 150°C operating range, RoHS3 compliance, and MSL-1 rating. The 8-SO package is mechanically compatible with 8-SOIC footprints. This part is recommended as the primary substitute for direct replacement applications.
TSM180N03CS RLG (Taiwan Semiconductor Corporation)
The TSM180N03CS RLG is an active product offering 9A continuous drain current with improved on-resistance of 18mOhm at 8A, 10V. The gate threshold voltage of 2.0V is lower than the original specification, requiring gate drive circuit verification. Gate charge of 14nC at 4.5V and input capacitance of 345pF represent improved switching characteristics. Power dissipation is higher at 2.5W. The device supports the full -55°C to 150°C operating range and maintains RoHS3 compliance. MSL-3 rating requires controlled moisture exposure during storage and handling. The 8-SOP package is mechanically compatible with 8-SOIC footprints. This part is suitable for applications where lower on-resistance and improved switching speed are beneficial, provided thermal management accommodates the higher power dissipation.
Compliance and Regulatory Status
Both substitute parts maintain RoHS3 compliance and REACH unaffected status, matching the original FDFS6N548 regulatory requirements. The primary distinction is MSL rating: DMG4466SSS-13 carries MSL-1 (unlimited moisture exposure), while TSM180N03CS RLG carries MSL-3 (168-hour moisture exposure limit). Selection between these parts depends on production environment moisture control capabilities and thermal design constraints.
Frequently Asked Questions (FAQ)
Q: Can the DMG4466SSS-13 directly replace the FDFS6N548 in existing PCB designs?
A: Yes. Both devices use 8-SOIC/8-SO package variants with identical 0.154" (3.90mm) width and pin configuration. Electrical parameters are compatible: 30V Vdss, gate threshold voltage within acceptable range, and on-resistance specifications match. The higher current rating (10A vs. 7A) provides design margin without requiring circuit modification.
Q: What is the primary difference between the two substitute parts?
A: The DMG4466SSS-13 offers higher current capacity (10A) with lower power dissipation (1.42W) and unlimited moisture sensitivity (MSL-1). The TSM180N03CS RLG provides lower on-resistance (18mOhm) and improved switching characteristics but requires moisture control (MSL-3) and dissipates more power (2.5W). Selection depends on thermal budget and production environment.
Q: Are there gate drive circuit modifications required when substituting these parts?
A: Gate threshold voltages differ slightly: FDFS6N548 at 2.5V, DMG4466SSS-13 at 2.4V, and TSM180N03CS RLG at 2.0V. These variations fall within standard gate drive circuit tolerance. No circuit modifications are required for applications using standard gate drive voltages of 4.5V to 10V. Applications with marginal gate drive voltage should verify switching performance.
Q: Do package dimensions differ between the main part and substitutes?
A: All three devices use 8-pin SOIC/SO/SOP packages with identical 0.154" (3.90mm) width. Pin pitch and lead configuration are standard for these package families. PCB footprints designed for 8-SOIC accommodate all three parts without modification.
Q: What is the impact of MSL rating differences on component handling?
A: The FDFS6N548 and DMG4466SSS-13 carry MSL-1 rating, permitting unlimited moisture exposure without baking requirements. The TSM180N03CS RLG carries MSL-3 rating, requiring baking at 125°C for 24 hours if exposed to moisture for more than 168 cumulative hours. Production environments with controlled humidity may use MSL-3 parts without additional processing.
Q: Which substitute part is recommended for new designs?
A: The DMG4466SSS-13 is recommended for new designs due to active product status, higher current capacity, lower power dissipation, and MSL-1 rating. The TSM180N03CS RLG is suitable for applications where on-resistance optimization is critical and thermal management supports higher power dissipation.
Q: Are all three parts RoHS3 compliant?
A: Yes. The FDFS6N548, DMG4466SSS-13, and TSM180N03CS RLG all carry RoHS3 compliance certification and REACH unaffected status, meeting current regulatory requirements for electronic component manufacturing and distribution.
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