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FDC6302P Equivalent & Substitute Parts
Part Overview
The FDC6302P is a dual P-channel MOSFET array manufactured by onsemi, designed for surface mount applications in logic-level gate switching circuits. This component features a 25V drain-to-source voltage rating with 120mA continuous drain current capability and 700mW maximum power dissipation in a SuperSOT-6 package.
The FDC6302P is classified as obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications currently utilizing this component.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Configuration | 2 P-Channel (Dual) | — |
| Drain to Source Voltage (Vdss) | 25 | V |
| Current - Continuous Drain (Id) @ 25°C | 120 | mA |
| Rds On (Max) @ Id, Vgs | 10 | Ohm @ 200mA, 4.5V |
| Vgs(th) (Max) @ Id | 1.5 | V @ 250µA |
| Gate Charge (Qg) (Max) @ Vgs | 0.31 | nC @ 4.5V |
| Input Capacitance (Ciss) (Max) @ Vds | 11 | pF @ 10V |
| Power - Max | 700 | mW |
| Operating Temperature Range | -55 to 150 | °C (TJ) |
| Mounting Type | Surface Mount | — |
| Package / Case | SOT-23-6 Thin, TSOT-23-6 | — |
| Technology | MOSFET (Metal Oxide) | — |
| FET Feature | Logic Level Gate | — |
| RoHS Status | ROHS3 Compliant | — |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | — |
Substitute Part Grouping Explanation
Substitution of the FDC6302P requires evaluation of the following critical parameters:
Configuration Match: The substitute must maintain dual P-channel MOSFET architecture to preserve circuit functionality.
Voltage Rating: The substitute must support the application's maximum drain-to-source voltage requirement. The FDC6302P operates at 25V Vdss; substitutes with equal or higher voltage ratings are acceptable.
Current Capability: The substitute must deliver continuous drain current equal to or exceeding the application's requirement. The FDC6302P provides 120mA; substitutes with higher current ratings accommodate the original specification.
On-Resistance (Rds On): Lower on-resistance values reduce power dissipation and heat generation, improving thermal performance. The FDC6302P specifies 10 Ohm maximum; substitutes with lower Rds On values are functionally superior.
Gate Threshold Voltage (Vgs(th)): Logic-level gate operation requires threshold voltages compatible with standard digital signal levels. Both parts maintain logic-level gate characteristics.
Package Compatibility: Physical package dimensions and pin configurations must accommodate the circuit board layout. Package differences may require board redesign.
Compliance & Availability: Product status, RoHS compliance, and inventory availability determine practical substitution feasibility.
Parameter Comparison
| Parameter | FDC6302P | NTJD4152PT1G | Unit |
|---|---|---|---|
| Manufacturer | onsemi | onsemi | — |
| Configuration | 2 P-Channel (Dual) | 2 P-Channel (Dual) | — |
| Technology | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) | — |
| FET Feature | Logic Level Gate | Logic Level Gate | — |
| Drain to Source Voltage (Vdss) | 25 | 20 | V |
| Current - Continuous Drain (Id) @ 25°C | 120 | 880 | mA |
| Rds On (Max) @ Id, Vgs | 10 @ 200mA, 4.5V | 0.26 @ 880mA, 4.5V | Ohm |
| Vgs(th) (Max) @ Id | 1.5 @ 250µA | 1.2 @ 250µA | V |
| Gate Charge (Qg) (Max) @ Vgs | 0.31 @ 4.5V | 2.2 @ 4.5V | nC |
| Input Capacitance (Ciss) (Max) @ Vds | 11 @ 10V | 155 @ 20V | pF |
| Power - Max | 700 | 272 | mW |
| Operating Temperature Range | -55 to 150 | -55 to 150 | °C (TJ) |
| Mounting Type | Surface Mount | Surface Mount | — |
| Package / Case | SOT-23-6 Thin, TSOT-23-6 | 6-TSSOP, SC-88, SOT-363 | — |
| Product Status | Obsolete | Active | — |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | — |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | — |
Engineering Selection Recommendations
NTJD4152PT1G as Substitute for FDC6302P
The NTJD4152PT1G is an active-status dual P-channel MOSFET array from onsemi that addresses the obsolescence of the FDC6302P. Both components share identical configuration, technology, gate feature classification, and operating temperature range.
Electrical Compatibility:
The NTJD4152PT1G provides superior electrical performance in key parameters. The continuous drain current rating of 880mA exceeds the FDC6302P's 120mA specification, delivering enhanced current-handling capacity. The on-resistance of 0.26 Ohm (at 880mA, 4.5V) is significantly lower than the FDC6302P's 10 Ohm specification, resulting in reduced power dissipation and improved thermal efficiency.
The NTJD4152PT1G operates at a 20V Vdss rating, which is 5V lower than the FDC6302P's 25V rating. This voltage difference requires circuit-level evaluation to confirm compatibility with the application's maximum voltage requirements. Applications operating below 20V experience no voltage-related constraint.
Compliance & Availability:
Both components maintain ROHS3 compliance and MSL Level 1 (Unlimited) moisture sensitivity ratings, ensuring equivalent environmental and handling requirements. The NTJD4152PT1G carries active product status with substantial inventory availability (75,757 pieces), providing reliable long-term supply compared to the obsolete FDC6302P.
Package Consideration:
The NTJD4152PT1G uses a 6-TSSOP/SC-88/SOT-363 package, which differs from the FDC6302P's SOT-23-6 package. This package difference requires physical board layout verification and potential PCB redesign to accommodate the alternative pinout and footprint.
Frequently Asked Questions (FAQ)
Q: Can the NTJD4152PT1G directly replace the FDC6302P without circuit modification?
A: Direct replacement depends on two factors: voltage rating compatibility and package footprint accommodation. If the application operates at voltages below 20V, the NTJD4152PT1G's electrical specifications are compatible. However, the different package type (6-TSSOP/SC-88/SOT-363 versus SOT-23-6) requires PCB footprint verification and potential redesign.
Q: What is the significance of the lower on-resistance in the NTJD4152PT1G?
A: The NTJD4152PT1G's on-resistance of 0.26 Ohm (versus 10 Ohm in the FDC6302P) reduces resistive power losses during switching operation. This lower resistance improves thermal performance and reduces heat generation, benefiting circuit reliability and efficiency.
Q: Does the 5V difference in Vdss rating affect substitution feasibility?
A: The NTJD4152PT1G's 20V Vdss rating is lower than the FDC6302P's 25V rating. Substitution is valid only for applications where the maximum drain-to-source voltage does not exceed 20V. Applications requiring 25V operation cannot use the NTJD4152PT1G without circuit redesign.
Q: Are there compliance or environmental differences between these components?
A: Both components maintain identical RoHS3 compliance status and MSL Level 1 moisture sensitivity ratings. No environmental or regulatory differences exist between the two parts.
Q: What is the impact of higher gate charge in the NTJD4152PT1G?
A: The NTJD4152PT1G specifies 2.2nC gate charge compared to the FDC6302P's 0.31nC. Higher gate charge increases the energy required to switch the transistor and may increase switching losses in high-frequency applications. Circuit-level analysis determines whether this difference affects performance.
Q: How does the higher input capacitance of the NTJD4152PT1G affect circuit operation?
A: The NTJD4152PT1G specifies 155pF input capacitance (at 20V) versus the FDC6302P's 11pF (at 10V). Higher input capacitance increases the capacitive load on gate-driving circuits and may affect switching speed and power consumption. Applications with high-frequency switching or current-limited gate drivers require evaluation of this parameter.
Q: Is the NTJD4152PT1G suitable for all applications currently using the FDC6302P?
A: The NTJD4152PT1G is suitable for applications where: (1) maximum drain-to-source voltage does not exceed 20V, (2) the package footprint can be accommodated or redesigned, and (3) the higher gate charge and input capacitance do not degrade circuit performance. Applications exceeding 20V operation or requiring the original package form factor require alternative substitutes.
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