FDC6301N_G Equivalent & Substitute Parts

Part Overview

The FDC6301N_G is a dual N-channel MOSFET array manufactured by onsemi, designed for surface mount applications in logic-level gate switching circuits. This component integrates two N-channel MOSFETs in a compact SuperSOT™-6 package, rated for 25V drain-to-source voltage and 220mA continuous drain current with 700mW maximum power dissipation.

The FDC6301N_G carries an obsolete product status. Identifying equivalent and substitute parts is necessary to ensure design continuity, maintain supply chain reliability, and support ongoing production or maintenance requirements for systems utilizing this component.

Substiute Parts

FDC6301N_G

onsemiIn Stock: 999FDC6301N_G Datasheet

Current PartRFQ

FDC6301N

onsemiIn Stock: 76318FDC6301N Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the FDC6301N_G is determined by strict equivalence across all electrical and mechanical parameters. The primary substitute identified is the FDC6301N, which maintains identical specifications across all critical parameters that define functional compatibility.

The substitution logic is based on the following key parameters:

• Configuration: Both parts are dual N-channel MOSFETs
• Voltage Rating (Vdss): Both rated at 25V
• Current Rating (Id): Both support 220mA continuous drain current at 25°C
• On-Resistance (Rds On): Both specify 4Ohm maximum at 400mA, 4.5V
• Gate Threshold Voltage (Vgs(th)): Both specify 1.5V maximum at 250µA
• Gate Charge (Qg): Both specify 0.7nC maximum at 4.5V
• Input Capacitance (Ciss): Both specify 9.5pF maximum at 10V
• Power Dissipation: Both rated at 700mW maximum
• Operating Temperature Range: Both operate from -55°C to 150°C (TJ)
• Package: Both use SOT-23-6 Thin / TSOT-23-6 SuperSOT™-6 surface mount package
• FET Feature: Both feature logic level gate operation

Parameter Comparison

Engineering Selection Recommendations

The FDC6301N serves as the direct substitute for the obsolete FDC6301N_G. Both parts are manufactured by onsemi and share identical electrical and mechanical specifications across all critical parameters.

Product Status Consideration: The FDC6301N_G is classified as obsolete, while the FDC6301N maintains active product status. This distinction makes the FDC6301N the appropriate selection for new designs and ongoing production requirements.

Compliance and Certifications: The FDC6301N carries ROHS3 compliance certification, whereas the FDC6301N_G does not specify RoHS status. Both parts maintain REACH Unaffected status and share identical ECCN (EAR99) and HTSUS (8541.21.0095) classifications, confirming regulatory equivalence.

Packaging and Availability: Both parts utilize the SuperSOT™-6 surface mount package (SOT-23-6 Thin, TSOT-23-6). The FDC6301N is available in Cut Tape (CT) and Digi-Reel® packaging formats, providing flexibility for both prototype and production-volume applications.

Moisture Sensitivity: Both parts carry MSL 1 (Unlimited) rating, indicating no moisture sensitivity constraints during storage or handling.

The FDC6301N is a direct, pin-for-pin, and functionally equivalent replacement for the FDC6301N_G with no design modifications required.

Frequently Asked Questions (FAQ)

Q: Can the FDC6301N be used as a direct replacement for the FDC6301N_G in existing designs?

A: Yes. The FDC6301N is a direct substitute with identical electrical specifications, gate characteristics, and package configuration. No circuit modifications or PCB layout changes are required.

Q: Are there any differences in the operating temperature range between these parts?

A: No. Both the FDC6301N_G and FDC6301N operate across the identical temperature range of -55°C to 150°C (junction temperature).

Q: What is the significance of the FDC6301N_G being obsolete?

A: The obsolete status of the FDC6301N_G indicates that onsemi has discontinued production of this specific part number variant. The FDC6301N, which maintains active status, is the current production equivalent and should be used for all new designs and ongoing supply requirements.

Q: Do both parts meet RoHS compliance requirements?

A: The FDC6301N is certified ROHS3 compliant. The FDC6301N_G does not specify RoHS status in available documentation. For applications requiring RoHS compliance, the FDC6301N is the appropriate selection.

Q: Are the packaging options different between these parts?

A: Both parts use the SuperSOT™-6 package (SOT-23-6 Thin, TSOT-23-6). The FDC6301N is available in Cut Tape (CT) and Digi-Reel® formats, providing options for different procurement and assembly workflows.

Q: What is the moisture sensitivity level for these MOSFETs?

A: Both parts carry MSL 1 (Unlimited) rating, meaning they have no moisture sensitivity constraints and do not require special moisture control during storage or handling.

Q: Are the electrical characteristics identical between FDC6301N_G and FDC6301N?

A: Yes. All electrical parameters are identical, including drain-to-source voltage (25V), continuous drain current (220mA), on-resistance (4Ohm @ 400mA, 4.5V), gate threshold voltage (1.5V @ 250µA), gate charge (0.7nC @ 4.5V), input capacitance (9.5pF @ 10V), and maximum power dissipation (700mW).

Q: Can these parts be used interchangeably in high-frequency switching applications?

A: Yes. Both parts feature identical gate charge and input capacitance specifications, which are the primary parameters affecting switching performance. The logic level gate feature in both parts ensures compatible gate drive requirements.

Q: What regulatory classifications apply to these MOSFETs?

A: Both parts share identical regulatory classifications: ECCN EAR99 and HTSUS 8541.21.0095. Both maintain REACH Unaffected status. The FDC6301N additionally carries ROHS3 compliance certification.