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FDB2710 Equivalent & Substitute Parts
Part Overview
The FDB2710 is an N-Channel MOSFET manufactured by onsemi, rated for 250V drain-to-source voltage and 50A continuous drain current in a Surface Mount D2PAK package. This device belongs to the PowerTrench® series and is classified as Active product status. The FDB2710 is designed for high-voltage switching applications requiring robust thermal performance and low on-resistance characteristics.
Substitute parts are identified when equivalent electrical and mechanical parameters allow direct replacement in circuit designs. Substitution becomes necessary due to inventory availability, supply chain considerations, or design flexibility requirements while maintaining functional compatibility within specified operating parameters.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Drain to Source Voltage (Vdss) | 250 | V |
| Continuous Drain Current (Id) @ 25°C | 50 | A (Tc) |
| On-Resistance (Rds On Max) @ 25A, 10V | 42.5 | mOhm |
| Gate Threshold Voltage (Vgs(th) Max) @ 250µA | 5 | V |
| Gate Charge (Qg Max) @ 10V | 101 | nC |
| Power Dissipation (Max) | 260 | W (Tc) |
| Operating Temperature Range | -55 to 150 | °C (TJ) |
| Package Type | TO-263-3 (D2PAK) | Surface Mount |
| RoHS Status | ROHS3 Compliant | - |
Substitute Part Grouping Explanation
Substitution analysis for the FDB2710 is based on the following critical electrical and mechanical parameters:
Voltage Rating Compatibility: The FDB2710 operates at 250V Vdss. Substitute parts must support equal or higher voltage ratings to ensure safe operation in the same circuit topology.
Current Handling Capability: The FDB2710 delivers 50A continuous drain current. Substitute parts must provide equal or greater current capacity to maintain thermal and electrical performance margins.
Package Compatibility: The FDB2710 uses the TO-263-3 (D2PAK) Surface Mount package. Substitute parts must use identical or mechanically compatible packages to ensure PCB layout compatibility without redesign.
On-Resistance Characteristics: The FDB2710 exhibits 42.5mOhm maximum on-resistance at specified conditions. Substitute parts with comparable or lower on-resistance values maintain switching efficiency and thermal performance.
Gate Charge and Threshold Voltage: These parameters affect gate drive requirements and switching speed. Substitute parts must operate within compatible gate voltage ranges and charge specifications to function with existing gate drive circuits.
Thermal Performance: The FDB2710 dissipates up to 260W. Substitute parts must support equivalent or greater power dissipation ratings to handle thermal loads in the application.
Compliance and Certifications: All substitute parts must maintain ROHS3 compliance, REACH unaffected status, and equivalent moisture sensitivity levels to ensure regulatory and environmental compatibility.
Parameter Comparison
| Parameter | FDB2710 (onsemi) | IRF540NSTRLPBF (Infineon) | Compatibility Notes |
|---|---|---|---|
| Manufacturer | onsemi | Infineon Technologies | Different manufacturers |
| FET Type | N-Channel | N-Channel | Identical |
| Technology | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) | Identical |
| Drain to Source Voltage (Vdss) | 250 V | 100 V | FDB2710 rated higher; IRF540N suitable for lower voltage applications only |
| Continuous Drain Current (Id) @ 25°C | 50 A (Tc) | 33 A (Tc) | FDB2710 provides higher current capacity |
| Drive Voltage (Max Rds On) | 10 V | 10 V | Identical |
| Rds On (Max) @ Id, Vgs | 42.5 mOhm @ 25A, 10V | 44 mOhm @ 16A, 10V | Comparable on-resistance; measured at different current levels |
| Vgs(th) (Max) @ Id | 5 V @ 250µA | 4 V @ 250µA | Similar threshold voltage characteristics |
| Gate Charge (Qg Max) @ Vgs | 101 nC @ 10 V | 71 nC @ 10 V | IRF540N exhibits lower gate charge |
| Vgs (Max) | ±30 V | ±20 V | FDB2710 supports higher gate voltage range |
| Input Capacitance (Ciss Max) @ Vds | 7280 pF @ 25 V | 1960 pF @ 25 V | FDB2710 exhibits higher input capacitance |
| Power Dissipation (Max) | 260 W (Tc) | 130 W (Tc) | FDB2710 rated for double the power dissipation |
| Operating Temperature Range | -55°C to 150°C (TJ) | -55°C to 175°C (TJ) | IRF540N supports higher maximum junction temperature |
| Mounting Type | Surface Mount | Surface Mount | Identical |
| Package Type | TO-263-3 (D2PAK) | TO-263-3 (D2PAK) | Identical package; direct PCB compatibility |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Identical compliance |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | Identical MSL rating |
| REACH Status | REACH Unaffected | REACH Unaffected | Identical regulatory status |
| Product Status | Active | Active | Both devices actively manufactured |
Engineering Selection Recommendations
Direct Substitution Limitations: The IRF540NSTRLPBF is not a direct substitute for the FDB2710 due to critical voltage and current rating differences. The IRF540N is rated for 100V Vdss and 33A continuous drain current, while the FDB2710 is rated for 250V and 50A. Applications requiring the full 250V voltage rating cannot use the IRF540N without circuit redesign.
Voltage-Constrained Applications: The IRF540NSTRLPBF is suitable only for applications operating at 100V or lower. In such applications, the IRF540N provides comparable on-resistance and gate threshold characteristics while offering lower gate charge and higher maximum junction temperature.
Package Compatibility: Both devices use identical TO-263-3 (D2PAK) Surface Mount packages, enabling direct PCB footprint compatibility when voltage and current requirements permit substitution.
Compliance and Regulatory Alignment: Both the FDB2710 and IRF540NSTRLPBF maintain ROHS3 compliance, REACH unaffected status, and identical moisture sensitivity levels (MSL 1). Both devices are classified as Active product status, ensuring continued manufacturing support and supply availability.
Thermal Considerations: The FDB2710 supports 260W power dissipation compared to the IRF540N's 130W rating. Applications with high thermal loads require the FDB2710 or equivalent high-power devices.
Gate Drive Circuit Compatibility: The IRF540N exhibits lower gate charge (71nC versus 101nC) and operates within a ±20V gate voltage range compared to the FDB2710's ±30V range. Existing gate drive circuits designed for the FDB2710 will function with the IRF540N, though gate charge differences may affect switching speed characteristics.
Frequently Asked Questions (FAQ)
Q: Can the IRF540NSTRLPBF directly replace the FDB2710 in all applications?
A: No. The IRF540NSTRLPBF is rated for 100V maximum drain-to-source voltage, while the FDB2710 is rated for 250V. Direct substitution is only possible in applications operating at 100V or lower. Applications requiring 250V operation must use the FDB2710 or equivalent 250V-rated devices.
Q: Are the packages mechanically compatible?
A: Yes. Both the FDB2710 and IRF540NSTRLPBF use the TO-263-3 (D2PAK) Surface Mount package. PCB footprints are identical, allowing direct component placement without layout modifications when electrical parameters permit substitution.
Q: What are the current handling differences?
A: The FDB2710 provides 50A continuous drain current at 25°C, while the IRF540NSTRLPBF provides 33A. Applications requiring current levels between 33A and 50A must use the FDB2710 or equivalent higher-current devices.
Q: How do gate charge characteristics affect circuit performance?
A: The IRF540NSTRLPBF exhibits lower gate charge (71nC) compared to the FDB2710 (101nC). Lower gate charge results in faster switching transitions and reduced gate drive power requirements. Existing gate drive circuits designed for the FDB2710 will function with the IRF540N, though switching speed may increase slightly.
Q: Are both devices RoHS compliant?
A: Yes. Both the FDB2710 and IRF540NSTRLPBF are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.
Q: What is the thermal performance difference?
A: The FDB2710 supports 260W maximum power dissipation, while the IRF540NSTRLPBF supports 130W. Applications with high thermal loads require the FDB2710 or equivalent high-power-rated devices.
Q: Can I use the IRF540NSTRLPBF in a 250V circuit?
A: No. The IRF540NSTRLPBF is rated for 100V maximum drain-to-source voltage. Using it in a 250V circuit will result in device failure due to voltage overstress.
Q: How do on-resistance values compare?
A: The FDB2710 exhibits 42.5mOhm on-resistance at 25A and 10V gate voltage. The IRF540NSTRLPBF exhibits 44mOhm on-resistance at 16A and 10V gate voltage. On-resistance values are comparable, though measured at different current levels due to different device ratings.
Q: What is the operating temperature range for each device?
A: The FDB2710 operates from -55°C to 150°C junction temperature. The IRF540NSTRLPBF operates from -55°C to 175°C junction temperature. The IRF540N supports a higher maximum junction temperature, which may be advantageous in high-temperature applications operating below 100V.
Q: Are both devices actively manufactured?
A: Yes. Both the FDB2710 and IRF540NSTRLPBF are classified as Active product status, indicating continued manufacturing support and supply availability from their respective manufacturers.
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