F931D226MBA Equivalent & Substitute Parts

Part Overview

The F931D226MBA is a 22 µF molded tantalum capacitor manufactured by KYOCERA AVX, rated for 20 V operation in a 1411 (3528 Metric) surface mount package. This component is classified as Active product status and is designed for general purpose applications requiring stable capacitance and low equivalent series resistance in compact form factors. Substitute parts are identified when equivalent electrical specifications, mechanical dimensions, and compliance certifications align with the original component, enabling direct replacement in circuit designs without functional degradation.

Substiute Parts

F931D226MBA

KYOCERA AVXIn Stock: 2918F931D226MBA Datasheet

Current PartRFQ

TMCMB1D226MTRF

Vishay SpragueIn Stock: 1511TMCMB1D226MTRF Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the F931D226MBA is determined by strict alignment of the following parameters:

• Electrical Specifications: Capacitance value (22 µF), tolerance (±20%), and rated voltage (20 V) must be identical
• Package Compatibility: Physical package designation 1411 (3528 Metric) and surface mount mounting type are mandatory
• Environmental Ratings: Operating temperature range (-55°C ~ 125°C) and moisture sensitivity level (MSL 1) must match or exceed the original specification
• Compliance Standards: RoHS3 compliance and REACH unaffected status must be maintained

The substitute part TMCMB1D226MTRF from Vishay Sprague meets all substitution criteria. Differences in ESR (1.7Ohm @ 100kHz versus 1.9Ohm @ 100kHz) and packaging format (Cut Tape versus Tape & Reel) do not preclude substitution, as these variations remain within acceptable operational parameters for general purpose applications.

Parameter Comparison

Engineering Selection Recommendations

The TMCMB1D226MTRF qualifies as a direct substitute for the F931D226MBA based on matching electrical ratings, identical package dimensions, and equivalent compliance certifications. Both components maintain Active product status and satisfy ROHS3 and REACH requirements for regulated applications. The lower ESR value of the substitute part (1.7Ohm versus 1.9Ohm) represents an operational advantage in high-frequency applications. The reduced seated height (2.10mm versus 2.30mm) presents no compatibility issues for standard PCB layouts designed for the 1411 package envelope. Selection between the original and substitute part may be determined by availability, packaging format preference (Tape & Reel versus Cut Tape), or procurement lead time requirements.

Frequently Asked Questions (FAQ)

Q: Can TMCMB1D226MTRF replace F931D226MBA in existing circuit designs?

A: Yes. Both components share identical capacitance (22 µF), voltage rating (20 V), tolerance (±20%), package designation (1411), and operating temperature range (-55°C ~ 125°C). Physical dimensions and mounting characteristics are compatible with standard PCB layouts.

Q: What is the significance of the ESR difference between the two parts?

A: The substitute part exhibits lower ESR (1.7Ohm @ 100kHz) compared to the original (1.9Ohm @ 100kHz). Lower ESR reduces heat generation and improves performance in high-frequency filtering applications. This difference does not prevent substitution and may provide operational benefits.

Q: Does the height difference affect PCB assembly?

A: No. The substitute part has a maximum seated height of 2.10mm compared to 2.30mm for the original. This 0.20mm reduction is within standard PCB design tolerances and does not require layout modifications.

Q: Are both parts compliant with regulatory requirements?

A: Yes. Both F931D226MBA and TMCMB1D226MTRF are ROHS3 compliant and REACH unaffected, meeting current environmental and hazardous substance regulations.

Q: What is the difference between Tape & Reel and Cut Tape packaging?

A: Tape & Reel packaging is supplied on continuous carrier tape for automated assembly equipment. Cut Tape packaging is supplied in shorter tape segments for manual or lower-volume assembly. Both formats contain identical components; packaging selection depends on assembly process requirements and order quantity.