ESQ-104-33-S-D Equivalent & Substitute Parts

Part Overview

The ESQ-104-33-S-D is an 8-position elevated socket connector manufactured by Samtec Inc., designed for board-to-board applications with 0.100" (2.54mm) pitch spacing. This through-hole solder-terminated connector features gold-plated mating contacts and is rated for 5.7A per contact at 550VAC. The part is currently active in production with 1122 units in stock and maintains ROHS3 compliance and UL94 V-0 flammability rating. Substitute parts are identified when equivalent electrical and mechanical parameters allow direct functional replacement while accommodating specific design requirements.

Substiute Parts

ESQ-104-33-S-D

Samtec Inc.In Stock: 1183ESQ-104-33-S-D Datasheet

Current PartRFQ

ESQ-104-23-G-D

Samtec Inc.In Stock: 704ESQ-104-23-G-D Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The ESQ-104-23-G-D qualifies as a direct substitute based on the following matching electrical and mechanical parameters:

• Connector type: Elevated Socket (identical)
• Position count: 8 positions (identical)
• Pitch spacing: 0.100" (2.54mm) mating pitch (identical)
• Row configuration: 2 rows at 0.100" spacing (identical)
• Mounting: Through hole solder termination (identical)
• Electrical ratings: 5.7A per contact, 550VAC (identical)
• Operating temperature range: -55°C ~ 125°C (identical)
• Contact material: Phosphor Bronze (identical)
• Insulation material: Liquid Crystal Polymer (LCP) (identical)
• Compliance: ROHS3 compliant, UL94 V-0 rated (identical)

Substitution is valid when design requirements do not mandate specific contact finish thickness, post length, or insulation height specifications.

Parameter Comparison

Engineering Selection Recommendations

Both ESQ-104-33-S-D and ESQ-104-23-G-D are active production parts with identical electrical performance and compliance certifications. Selection between these parts depends on mechanical fit requirements:

The ESQ-104-33-S-D features a shorter post length (0.090") and taller insulation height (0.635"), making it suitable for applications with limited PCB thickness or specific board-to-board spacing constraints.

The ESQ-104-23-G-D features a longer post length (0.190") and lower insulation height (0.535"), accommodating applications requiring extended contact engagement or reduced overall connector height.

Contact finish differences (tin post on ESQ-104-33-S-D versus gold post on ESQ-104-23-G-D) do not affect electrical performance at rated specifications but may influence solderability characteristics based on assembly process requirements.

Both parts maintain ROHS3 compliance and UL94 V-0 flammability rating, ensuring regulatory equivalence for applications subject to these standards.

Frequently Asked Questions (FAQ)

Q: Can ESQ-104-23-G-D replace ESQ-104-33-S-D in existing designs?

A: Direct replacement is possible when design specifications do not mandate the specific post length (0.090" vs 0.190") or insulation height (0.635" vs 0.535") of the original part. Verify PCB thickness and board-to-board spacing compatibility before substitution.

Q: What is the difference in contact finish between these parts?

A: ESQ-104-33-S-D uses tin-plated posts, while ESQ-104-23-G-D uses gold-plated posts. Both mating contacts are gold-plated. Post finish selection depends on soldering process compatibility and assembly requirements.

Q: Are both parts ROHS3 compliant?

A: Yes, both ESQ-104-33-S-D and ESQ-104-23-G-D are ROHS3 compliant and carry UL94 V-0 flammability ratings, ensuring regulatory equivalence.

Q: What electrical parameters remain constant between these substitutes?

A: Current rating (5.7A per contact), voltage rating (550VAC), operating temperature range (-55°C ~ 125°C), and contact material (Phosphor Bronze) are identical across both parts.

Q: How do insulation height differences affect connector selection?

A: Insulation height determines the overall connector profile. ESQ-104-33-S-D (0.635") provides greater height, while ESQ-104-23-G-D (0.535") offers a lower profile. Selection depends on available board-to-board spacing in the application.