ES3FBH Equivalent & Substitute Parts

Part Overview

The ES3FBH is a general-purpose rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 300 V DC reverse voltage and 3 A average rectified current. This surface mount component is packaged in DO-214AA (SMB) format and is classified as a fast recovery diode with a reverse recovery time of 35 nanoseconds. The part maintains Active product status and carries AEC-Q101 automotive qualification, making it suitable for automotive and industrial applications requiring reliable rectification at moderate voltage and current levels.

Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required due to inventory constraints, supply chain considerations, or design flexibility needs.

Substiute Parts

ES3FBH
Taiwan Semiconductor CorporationIn Stock: 783ES3FBH Datasheet
ES3FBH
Current Part
ES3FB
Taiwan Semiconductor CorporationIn Stock: 7051ES3FB Datasheet
ES3FB
Parametric Equivalent

Key Parameters

Parameter Value Unit
Voltage - DC Reverse (Vr) (Max) 300 V
Current - Average Rectified (Io) 3 A
Voltage - Forward (Vf) (Max) @ If 1.13 @ 3 A V
Reverse Recovery Time (trr) 35 ns
Current - Reverse Leakage @ Vr 10 @ 300 V µA
Capacitance @ Vr, F 41 @ 4V, 1MHz pF
Package / Case DO-214AA, SMB
Operating Temperature - Junction -55 to 150 °C
Technology Standard
Speed Classification Fast Recovery ≤ 500ns, > 200mA (Io)

Substitute Part Grouping Explanation

Substitution of the ES3FBH with the ES3FB is based on identical electrical and mechanical parameters across all critical performance criteria. Both parts share the same base product number (ES3F) and are manufactured by Taiwan Semiconductor Corporation.

The substitution logic is determined by the following key parameters:

  • Voltage - DC Reverse (Vr) (Max): 300 V
  • Current - Average Rectified (Io): 3 A
  • Voltage - Forward (Vf) (Max) @ If: 1.13 V @ 3 A
  • Reverse Recovery Time (trr): 35 ns
  • Current - Reverse Leakage @ Vr: 10 µA @ 300 V
  • Capacitance @ Vr, F: 41 pF @ 4V, 1MHz
  • Package / Case: DO-214AA, SMB
  • Operating Temperature - Junction: -55°C to 150°C
  • Technology: Standard
  • Speed Classification: Fast Recovery ≤ 500ns, > 200mA (Io)

Both parts are surface mount devices with identical mounting type, supplier device package designation, and thermal operating range. No electrical parameter variation exists between the main part and its substitute.

Parameter Comparison

Parameter ES3FBH ES3FB Match
Voltage - DC Reverse (Vr) (Max) 300 V 300 V Identical
Current - Average Rectified (Io) 3 A 3 A Identical
Voltage - Forward (Vf) (Max) @ If 1.13 V @ 3 A 1.13 V @ 3 A Identical
Reverse Recovery Time (trr) 35 ns 35 ns Identical
Current - Reverse Leakage @ Vr 10 µA @ 300 V 10 µA @ 300 V Identical
Capacitance @ Vr, F 41 pF @ 4V, 1MHz 41 pF @ 4V, 1MHz Identical
Package / Case DO-214AA, SMB DO-214AA, SMB Identical
Operating Temperature - Junction -55°C to 150°C -55°C to 150°C Identical
Mounting Type Surface Mount Surface Mount Identical
Technology Standard Standard Identical
Speed Classification Fast Recovery ≤ 500ns, > 200mA (Io) Fast Recovery ≤ 500ns, > 200mA (Io) Identical
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) Identical
REACH Status REACH Unaffected REACH Unaffected Identical

Engineering Selection Recommendations

Both ES3FBH and ES3FB are Active product status components manufactured by Taiwan Semiconductor Corporation with full AEC-Q101 automotive qualification. Selection between these parts is based on availability and supply chain requirements rather than electrical or mechanical differentiation.

The ES3FB offers higher inventory availability (6951 pieces in stock) compared to the ES3FBH (696 pieces in stock), making it the preferred selection when supply continuity is a consideration. Both parts maintain identical compliance certifications including ROHS3 compliance, REACH unaffected status, and automotive-grade qualification.

For applications requiring the DO-214AA (SMB) surface mount package with 300 V / 3 A rectification capability and fast recovery characteristics, either part number provides equivalent performance and reliability.

Frequently Asked Questions (FAQ)

Q: Can ES3FB be used as a direct replacement for ES3FBH in existing designs?

A: Yes. Both parts are electrically and mechanically identical across all specified parameters. The DO-214AA (SMB) package footprint, pin configuration, and electrical performance are equivalent. No circuit modification or re-qualification is required.

Q: Are there any differences in automotive qualification between these parts?

A: No. Both ES3FBH and ES3FB carry AEC-Q101 automotive qualification and are classified as automotive-grade components. Compliance certifications, RoHS status, and REACH status are identical.

Q: What is the significance of the base product number ES3F?

A: The base product number ES3F indicates the common product family. Both ES3FBH and ES3FB derive from this base designation, confirming their fundamental design equivalence and shared electrical specifications.

Q: Are there any thermal or environmental operating differences?

A: No. Both parts operate across the identical junction temperature range of -55°C to 150°C. Moisture sensitivity level (MSL 1 - Unlimited) and all environmental compliance parameters are identical.

Q: What packaging format is used for both parts?

A: Both parts are supplied in Tape & Reel (TR) format with DO-214AA (SMB) surface mount package designation. This format is standard for automated assembly processes and high-volume production environments.

Q: How do the reverse recovery characteristics compare?

A: Both parts exhibit identical reverse recovery time of 35 nanoseconds, confirming their classification as fast recovery diodes. This parameter is critical for switching applications and is fully matched between the two part numbers.

Q: Is there any difference in forward voltage drop?

A: No. Both parts specify maximum forward voltage of 1.13 V at 3 A forward current. This parameter directly affects power dissipation and thermal performance, and is identical for both components.

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