ES3F General Purpose Rectifier Diode – Equivalent & Substitute Parts

Part Overview

The ES3F is a general purpose rectifier diode rated for 300 V DC reverse voltage and 3 A average rectified current in a surface mount DO-214AB (SMC) package. This component is classified as a fast recovery diode with a reverse recovery time of 35 ns, suitable for standard rectification applications requiring moderate switching speeds. The part is currently in active production status with full RoHS3 compliance and unlimited moisture sensitivity rating (MSL 1).

Substitute parts are identified when equivalent electrical performance and mechanical compatibility are maintained across the specified parameter range. Alternative sources may be required due to supply chain considerations, inventory availability, or procurement preferences while maintaining identical functional characteristics.

Substiute Parts

ES3F
Taiwan Semiconductor CorporationIn Stock: 3771ES3F Datasheet
ES3F
Current Part
ES3F
Diotec SemiconductorIn Stock: 3701ES3F Datasheet
ES3F
Direct

Key Parameters

Parameter Value Unit
Voltage - DC Reverse (Vr) (Max) 300 V
Current - Average Rectified (Io) 3 A
Speed Classification Fast Recovery ≤ 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 35 ns
Package / Case DO-214AB, SMC
Mounting Type Surface Mount
Operating Temperature - Junction -55 to 150 °C
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the ES3F rectifier diode is determined by strict equivalence across the following critical parameters:

Electrical Performance Criteria:

  • Voltage rating: 300 V DC reverse voltage (Vr) maximum
  • Current rating: 3 A average rectified current (Io)
  • Speed classification: Fast recovery diode with reverse recovery time ≤ 500 ns at currents > 200 mA

Mechanical Compatibility Criteria:

  • Package type: DO-214AB (SMC) surface mount package
  • Mounting method: Surface mount technology

Compliance & Environmental Criteria:

  • RoHS3 compliance status
  • Operating temperature range: Minimum -50°C to maximum 150°C junction temperature

Parts meeting all three criteria groups are classified as direct substitutes. Variations in secondary parameters such as reverse leakage current, forward voltage, or reverse recovery time do not disqualify substitution when primary electrical and mechanical specifications remain within the defined range.

Parameter Comparison

Parameter ES3F (Taiwan Semiconductor Corporation) ES3F (Diotec Semiconductor) Unit
Manufacturer Taiwan Semiconductor Corporation Diotec Semiconductor
Voltage - DC Reverse (Vr) (Max) 300 300 V
Current - Average Rectified (Io) 3 3 A
Speed Classification Fast Recovery ≤ 500ns, > 200mA (Io) Fast Recovery ≤ 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 35 25 ns
Current - Reverse Leakage @ Vr 10 µA @ 300 V 5 µA @ 300 V µA
Package / Case DO-214AB, SMC DO-214AB, SMC
Mounting Type Surface Mount Surface Mount
Operating Temperature - Junction -55 to 150 -50 to 150 °C
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) Not Applicable

Engineering Selection Recommendations

Both ES3F variants meet the core substitution criteria for voltage rating (300 V), current rating (3 A), package type (DO-214AB/SMC), and RoHS3 compliance status. The Diotec Semiconductor version demonstrates improved performance characteristics with a lower reverse recovery time (25 ns versus 35 ns) and reduced reverse leakage current (5 µA versus 10 µA at 300 V).

The Taiwan Semiconductor Corporation version maintains a wider operating temperature range at the lower bound (-55°C versus -50°C), which may be relevant for applications requiring extended cold-temperature operation. Both parts are classified as active products with current manufacturing status.

Selection between these equivalent parts should be based on procurement availability, supply chain requirements, and application-specific performance priorities. Both parts are suitable for direct substitution in circuits designed for the ES3F specification.

Frequently Asked Questions (FAQ)

Q: Can the Diotec Semiconductor ES3F replace the Taiwan Semiconductor Corporation ES3F in existing designs?

A: Yes. Both parts share identical voltage (300 V), current (3 A), and package specifications (DO-214AB/SMC). The Diotec version offers improved reverse recovery time (25 ns) and lower leakage current, making it functionally compatible for direct substitution.

Q: What is the significance of the reverse recovery time difference between the two parts?

A: The Diotec variant exhibits a 10 ns faster reverse recovery time (25 ns versus 35 ns). Both remain within the fast recovery classification (≤ 500 ns). The faster recovery in the Diotec part may provide marginal benefits in high-frequency switching applications but does not affect compatibility in standard rectification circuits.

Q: Are there temperature range limitations when substituting between these parts?

A: The Taiwan Semiconductor Corporation version operates from -55°C to 150°C, while the Diotec version operates from -50°C to 150°C. For applications requiring operation below -50°C, the Taiwan Semiconductor Corporation part is required. For standard industrial temperature ranges, both parts are equivalent.

Q: Do both parts meet the same compliance standards?

A: Yes. Both ES3F variants are RoHS3 compliant. The Taiwan Semiconductor Corporation part carries MSL 1 (unlimited moisture sensitivity), while the Diotec part lists MSL as not applicable. Both are suitable for standard surface mount assembly processes.

Q: Is the DO-214AB package identical to the SMC package designation?

A: Yes. DO-214AB and SMC refer to the same surface mount package type. Both designations are used interchangeably in industry documentation and represent the same physical and electrical interface.

Q: What is the primary reason to consider substitute parts for the ES3F?

A: Substitute parts are identified to address supply chain flexibility, inventory availability, and procurement options. Both ES3F variants maintain identical core electrical specifications and mechanical compatibility, allowing circuit designers and procurement teams to source from alternative manufacturers without redesign.

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