ES3C-E3/9AT Equivalent & Substitute Parts

Part Overview

The ES3C-E3/9AT is a general-purpose rectifier diode manufactured by Vishay General Semiconductor - Diodes Division. This surface mount device operates at 150 V DC reverse voltage with 3 A average rectified current in a DO-214AB (SMC) package. The part is classified as Active product status with ROHS3 compliance and unlimited moisture sensitivity level (MSL 1).

Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required due to inventory constraints, manufacturing discontinuation, or design flexibility across qualified component sources.

Substiute Parts

ES3C-E3/9AT
Vishay General Semiconductor - Diodes DivisionIn Stock: 1156ES3C-E3/9AT Datasheet
ES3C-E3/9AT
Current Part
ES3C-E3/57T
Vishay General Semiconductor - Diodes DivisionIn Stock: 19001ES3C-E3/57T Datasheet
ES3C-E3/57T
Parametric Equivalent
ES3C
Taiwan Semiconductor CorporationIn Stock: 10289ES3C Datasheet
ES3C
MFR Recommended
STPS3150U
STMicroelectronicsIn Stock: 18048STPS3150U Datasheet
STPS3150U
MFR Recommended
STTH302S
STMicroelectronicsIn Stock: 25236STTH302S Datasheet
STTH302S
MFR Recommended
ES3C-13-F
Diodes IncorporatedIn Stock: 10410ES3C-13-F Datasheet
ES3C-13-F
Parametric Equivalent

Key Parameters

Parameter Value Unit
Voltage - DC Reverse (Vr) (Max) 150 V
Current - Average Rectified (Io) 3 A
Voltage - Forward (Vf) (Max) @ If 900 mV @ 3 A mV
Reverse Recovery Time (trr) 30 ns
Current - Reverse Leakage @ Vr 10 µA @ 150 V
Speed Classification Fast Recovery ≤ 500ns, > 200mA (Io)
Package / Case DO-214AB, SMC
Mounting Type Surface Mount
Operating Temperature - Junction -55 to 150 °C
Technology Standard
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the ES3C-E3/9AT are classified into two categories based on electrical and mechanical compatibility:

Parametric Equivalents maintain identical electrical specifications across all critical parameters: 150 V reverse voltage, 3 A average rectified current, 900 mV forward voltage at 3 A, 30 ns reverse recovery time, and DO-214AB (SMC) package configuration. These parts are direct functional replacements with no circuit redesign required.

Manufacturer Recommended Alternatives provide equivalent voltage and current ratings with minor variations in forward voltage, reverse recovery time, or package designation. These parts satisfy the same application requirements but may require validation for specific circuit timing or thermal characteristics.

Key Parameters Determining Substitution:

  • Voltage - DC Reverse (Vr) (Max): 150 V minimum
  • Current - Average Rectified (Io): 3 A minimum
  • Package / Case: DO-214AB or compatible SMC footprint
  • Mounting Type: Surface Mount
  • Technology: Standard or Schottky (for alternatives)
  • RoHS Status: ROHS3 Compliant

Parameter Comparison

Part Number Manufacturer Vr (Max) [V] Io [A] Vf (Max) @ 3A [mV] trr [ns] Ir @ Vr [µA] Package Technology Tj (Max) [°C]
ES3C-E3/9AT Vishay 150 3 900 30 10 @ 150V DO-214AB (SMC) Standard 150
ES3C-E3/57T Vishay 150 3 900 30 10 @ 150V DO-214AB (SMC) Standard 150
ES3C Taiwan Semiconductor 150 3 950 35 10 @ 150V DO-214AB (SMC) Standard 150
STPS3150U STMicroelectronics 150 3 820 2 @ 150V DO-214AA (SMB) Schottky 175
STTH302S STMicroelectronics 200 3 950 35 3 @ 200V DO-214AB (SMC) Standard 175
ES3C-13-F Diodes Incorporated 150 3 900 25 10 @ 150V DO-214AB (SMC) Standard 150

Engineering Selection Recommendations

Direct Parametric Equivalents (No Circuit Modification Required):

ES3C-E3/57T and ES3C-13-F are parametric equivalents to ES3C-E3/9AT. Both parts maintain identical voltage and current ratings with matching forward voltage and reverse leakage specifications. ES3C-E3/57T is supplied by Vishay with identical reverse recovery time (30 ns). ES3C-13-F is supplied by Diodes Incorporated with slightly faster reverse recovery time (25 ns), providing improved switching performance. All three parts are ROHS3 compliant with MSL 1 rating and DO-214AB (SMC) package compatibility.

Manufacturer Recommended Alternatives (Application-Dependent Validation Required):

ES3C (Taiwan Semiconductor) maintains 150 V / 3 A ratings with 50 mV higher forward voltage (950 mV) and 5 ns longer reverse recovery time (35 ns) compared to the primary part. This alternative is suitable for applications where the slightly increased forward voltage drop and recovery time are acceptable within circuit design margins.

STPS3150U (STMicroelectronics) is a Schottky technology alternative with 150 V / 3 A ratings. The Schottky construction provides 80 mV lower forward voltage (820 mV) and significantly lower reverse leakage (2 µA). The package is DO-214AA (SMB), which differs from the DO-214AB (SMC) footprint of the primary part. Maximum junction temperature is 175°C, providing extended thermal operating range. This part is suitable for applications prioritizing low forward voltage drop and reduced power dissipation.

STTH302S (STMicroelectronics) provides 200 V reverse voltage rating with 3 A current capacity. Forward voltage is 950 mV at 3 A with 35 ns reverse recovery time. The higher voltage rating provides design margin for overvoltage transients. Package is DO-214AB (SMC), maintaining footprint compatibility. Maximum junction temperature is 175°C. This part is suitable for applications requiring higher voltage headroom or operating in environments with voltage transients.

All substitute parts maintain ROHS3 compliance, MSL 1 rating, and Active product status.

Frequently Asked Questions (FAQ)

Q: Can ES3C-E3/57T be used as a direct replacement for ES3C-E3/9AT?

A: Yes. ES3C-E3/57T is a parametric equivalent with identical electrical specifications: 150 V reverse voltage, 3 A average rectified current, 900 mV forward voltage at 3 A, 30 ns reverse recovery time, and DO-214AB (SMC) package. No circuit modification is required.

Q: What is the difference between ES3C-13-F and ES3C-E3/9AT?

A: ES3C-13-F maintains identical voltage and current ratings with matching forward voltage (900 mV) and reverse leakage (10 µA). The reverse recovery time is 25 ns compared to 30 ns in the primary part, providing faster switching performance. Both use DO-214AB (SMC) packages. The part is supplied by Diodes Incorporated rather than Vishay.

Q: Why would STPS3150U be selected over ES3C-E3/9AT?

A: STPS3150U is a Schottky technology diode with 80 mV lower forward voltage (820 mV vs. 900 mV), reducing power dissipation in high-current applications. Reverse leakage is also lower (2 µA vs. 10 µA). However, the package is DO-214AA (SMB) rather than DO-214AB (SMC), requiring PCB footprint verification. Maximum junction temperature is 175°C, providing extended thermal range.

Q: Is STTH302S compatible with ES3C-E3/9AT in all applications?

A: STTH302S provides 200 V reverse voltage rating compared to 150 V in the primary part, offering higher voltage margin. Current rating is identical at 3 A. Forward voltage is 950 mV (50 mV higher) and reverse recovery time is 35 ns (5 ns longer). The DO-214AB (SMC) package is footprint-compatible. Applications requiring 150 V operation can use STTH302S with the benefit of higher voltage headroom for transient protection.

Q: What is the difference between Standard and Schottky technology in these diodes?

A: Standard technology diodes (ES3C-E3/9AT, ES3C-E3/57T, ES3C-13-F, ES3C, STTH302S) use silicon junction construction with typical forward voltage of 900-950 mV. Schottky technology diodes (STPS3150U) use metal-semiconductor junction construction with lower forward voltage (820 mV) and lower reverse leakage, but typically higher reverse leakage temperature coefficient. Schottky diodes are preferred for low-voltage, high-current applications where power dissipation is critical.

Q: Can ES3C (Taiwan Semiconductor) be used as a direct replacement?

A: ES3C maintains 150 V / 3 A ratings with 900 mV forward voltage specification. Forward voltage maximum is listed as 950 mV at 3 A (50 mV higher than ES3C-E3/9AT) and reverse recovery time is 35 ns (5 ns longer). The part is suitable for applications where these parameter variations fall within circuit design margins. DO-214AB (SMC) package is compatible.

Q: What packaging differences exist between these substitute parts?

A: ES3C-E3/9AT, ES3C-E3/57T, ES3C-13-F, ES3C, and STTH302S all use DO-214AB (SMC) package with identical PCB footprint. STPS3150U uses DO-214AA (SMB) package, which has a different footprint and requires PCB layout verification before substitution. Tape & Reel (TR) and Cut Tape (CT) packaging designations refer to supply format and do not affect component functionality or footprint.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All listed substitute parts (ES3C-E3/57T, ES3C, STPS3150U, STTH302S, ES3C-13-F) maintain ROHS3 compliance and MSL 1 (Unlimited) moisture sensitivity level, matching the primary part ES3C-E3/9AT.

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