ES1GL MHG Equivalent & Substitute Parts

Part Overview

The ES1GL MHG is a general-purpose rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 400 V DC reverse voltage and 1 A average rectified current in a Sub SMA surface mount package. This component is classified as Active product status and is RoHS3 compliant with unlimited moisture sensitivity level.

Substitute parts are necessary when the ES1GL MHG packaging format (MHG suffix) is unavailable or when alternative packaging configurations are required for production continuity. The substitute parts listed maintain electrical equivalence while offering different packaging options or from alternative manufacturers.

Substiute Parts

ES1GL MHG
Taiwan Semiconductor CorporationIn Stock: 701ES1GL MHG Datasheet
ES1GL MHG
Current Part
ES1GL
Taiwan Semiconductor CorporationIn Stock: 95356ES1GL Datasheet
ES1GL
Parametric Equivalent
ES1GL RVG
Taiwan Semiconductor CorporationIn Stock: 4702ES1GL RVG Datasheet
ES1GL RVG
Parametric Equivalent
HS1GL RVG
Taiwan Semiconductor CorporationIn Stock: 18365HS1GL RVG Datasheet
HS1GL RVG
Parametric Equivalent
S07G-GS08
Vishay General Semiconductor - Diodes DivisionIn Stock: 658515S07G-GS08 Datasheet
S07G-GS08
Similar
S07G-GS18
Vishay General Semiconductor - Diodes DivisionIn Stock: 95112S07G-GS18 Datasheet
S07G-GS18
Similar

Key Parameters

Parameter Value
Voltage - DC Reverse (Vr) (Max) 400 V
Current - Average Rectified (Io) 1 A
Voltage - Forward (Vf) (Max) @ If 1.3 V @ 1 A
Reverse Recovery Time (trr) 35 ns
Current - Reverse Leakage @ Vr 5 µA @ 400 V
Package / Case DO-219AB
Mounting Type Surface Mount
Operating Temperature - Junction -55°C ~ 150°C
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution logic for the ES1GL MHG is based on the following critical parameters:

Parametric Equivalents maintain identical electrical specifications:

  • Voltage - DC Reverse (Vr): 400 V
  • Current - Average Rectified (Io): 1 A
  • Voltage - Forward (Vf): 1.3 V @ 1 A
  • Reverse Recovery Time (trr): 35 ns
  • Current - Reverse Leakage: 5 µA @ 400 V
  • Package / Case: DO-219AB
  • Mounting Type: Surface Mount

Parametric equivalents differ only in packaging format (Cut Tape, Digi-Reel, or Tape & Reel) and product status designation.

Similar Parts share the same package and voltage rating but differ in current rating and recovery characteristics:

  • Voltage - DC Reverse (Vr): 400 V (maintained)
  • Current - Average Rectified (Io): 700 mA (reduced from 1 A)
  • Reverse Recovery Time (trr): 1.8 µs (slower than 35 ns)
  • Package / Case: DO-219AB (maintained)

Similar parts are suitable only when the application current requirement does not exceed 700 mA and slower recovery time is acceptable.

Parameter Comparison

Part Number Manufacturer Vr (Max) Io Vf @ If trr Ir @ Vr Package Packaging Format Product Status Inventory
ES1GL MHG Taiwan Semiconductor Corporation 400 V 1 A 1.3 V @ 1 A 35 ns 5 µA @ 400 V DO-219AB Sub SMA Active 674 Pcs
ES1GL Taiwan Semiconductor Corporation 400 V 1 A 1.3 V @ 1 A 35 ns 5 µA @ 400 V DO-219AB Cut Tape & Digi-Reel Not For New Designs 95300 Pcs
ES1GL RVG Taiwan Semiconductor Corporation 400 V 1 A 1.3 V @ 1 A 35 ns 5 µA @ 400 V DO-219AB Tape & Reel Active 4619 Pcs
HS1GL RVG Taiwan Semiconductor Corporation 400 V 1 A 1.3 V @ 1 A 50 ns 5 µA @ 400 V DO-219AB Tape & Reel Active 18316 Pcs
S07G-GS08 Vishay General Semiconductor 400 V 700 mA 1.1 V @ 1 A 1.8 µs 10 µA @ 400 V DO-219AB Tape & Reel Active 658490 Pcs
S07G-GS18 Vishay General Semiconductor 400 V 700 mA 1.1 V @ 1 A 1.8 µs 10 µA @ 200 V DO-219AB Tape & Reel Active 95100 Pcs

Engineering Selection Recommendations

For Direct Electrical Equivalence (Active Product Status):

ES1GL RVG is the primary substitute for ES1GL MHG. Both parts maintain identical electrical specifications with 400 V reverse voltage, 1 A current rating, 35 ns reverse recovery time, and 1.3 V forward voltage. ES1GL RVG is Active product status and available in Tape & Reel packaging format. This part is suitable for new designs and production applications requiring the same electrical performance as the original ES1GL MHG.

For Packaging Format Alternatives (Same Electrical Specifications):

ES1GL is available in Cut Tape and Digi-Reel packaging formats with identical electrical parameters to ES1GL MHG. However, this part carries "Not For New Designs" product status and should be used only for legacy system support or when specific packaging format is mandated by existing production equipment.

For Alternative Manufacturer with Reduced Current Rating:

S07G-GS08 and S07G-GS18 from Vishay General Semiconductor are suitable only when the application current requirement does not exceed 700 mA. These parts feature slower recovery time (1.8 µs versus 35 ns) and higher reverse leakage current (10 µA versus 5 µA). Both parts are AEC-Q101 qualified and Active product status. Selection of these parts requires confirmation that the 700 mA current limit and slower recovery characteristics are acceptable for the application.

For Marginal Recovery Time Tolerance:

HS1GL RVG from Taiwan Semiconductor Corporation provides 50 ns reverse recovery time compared to 35 ns for ES1GL MHG, with all other electrical parameters identical. This part is Active product status and available in Tape & Reel format. Selection requires confirmation that 50 ns recovery time meets application timing requirements.

Frequently Asked Questions (FAQ)

Q: Can ES1GL RVG be used as a direct replacement for ES1GL MHG?

A: Yes. ES1GL RVG maintains identical electrical specifications including 400 V reverse voltage, 1 A current rating, 1.3 V forward voltage, and 35 ns reverse recovery time. The difference is packaging format: ES1GL RVG is supplied in Tape & Reel format while ES1GL MHG uses Sub SMA packaging. Both are RoHS3 compliant and rated for -55°C to 150°C junction temperature.

Q: What is the difference between ES1GL and ES1GL RVG?

A: Both parts have identical electrical specifications. ES1GL is available in Cut Tape and Digi-Reel formats, while ES1GL RVG is supplied in Tape & Reel format. ES1GL carries "Not For New Designs" status, indicating it is for legacy applications only. ES1GL RVG is Active product status and suitable for new designs.

Q: Can S07G-GS08 replace ES1GL MHG in all applications?

A: No. S07G-GS08 has a reduced current rating of 700 mA compared to 1 A for ES1GL MHG. Additionally, S07G-GS08 has slower recovery time (1.8 µs versus 35 ns) and higher reverse leakage current (10 µA versus 5 µA). S07G-GS08 is suitable only when the application current does not exceed 700 mA and slower recovery time is acceptable.

Q: What does "Sub SMA" packaging mean?

A: Sub SMA refers to a surface mount package smaller than standard SMA. The actual package designation is DO-219AB. All substitute parts listed use the same DO-219AB package, ensuring mechanical compatibility with existing PCB layouts.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All parts listed—ES1GL MHG, ES1GL, ES1GL RVG, HS1GL RVG, S07G-GS08, and S07G-GS18—are RoHS3 compliant with unlimited moisture sensitivity level (MSL 1).

Q: What is the significance of "Active" versus "Not For New Designs" product status?

A: Active status indicates the part is in full production and suitable for new designs. "Not For New Designs" status indicates the part is in limited production for legacy system support only. For new applications, select parts with Active status: ES1GL MHG, ES1GL RVG, HS1GL RVG, S07G-GS08, or S07G-GS18.

Q: Why does HS1GL RVG have different capacitance and recovery time specifications?

A: HS1GL RVG is from a different product series (HS1G base number versus ES1G). While it maintains the same voltage and current ratings, the 50 ns recovery time and 15 pF capacitance reflect different semiconductor design. Verify that these parameters are acceptable for the specific application before substitution.

Q: Can packaging format be changed without affecting circuit performance?

A: Packaging format (Cut Tape, Digi-Reel, Tape & Reel, or Sub SMA) affects only the delivery and handling method, not electrical performance. All formats use the same DO-219AB package for PCB mounting. Format selection depends on production equipment compatibility and inventory management requirements.

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