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ES1GLHRTG Equivalent & Substitute Parts
Part Overview
The ES1GLHRTG is a general-purpose rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 400 V DC reverse voltage and 1 A average rectified current in a Sub SMA surface mount package. This component is classified as Active product status and meets AEC-Q101 automotive qualification standards.
Substitute parts are necessary when the ES1GLHRTG reaches end-of-life status, when alternative packaging formats are required for manufacturing processes, or when inventory constraints necessitate component alternatives that maintain electrical and mechanical compatibility within specified parameters.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - DC Reverse (Vr) (Max) | 400 | V |
| Current - Average Rectified (Io) | 1 | A |
| Voltage - Forward (Vf) (Max) @ If | 1.3 @ 1 A | V |
| Reverse Recovery Time (trr) | 35 | ns |
| Current - Reverse Leakage @ Vr | 5 @ 400 V | µA |
| Capacitance @ Vr, F | 8 @ 4V, 1MHz | pF |
| Package / Case | DO-219AB | — |
| Mounting Type | Surface Mount | — |
| Operating Temperature - Junction | -55 to 150 | °C |
| RoHS Status | ROHS3 Compliant | — |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | — |
Substitute Part Grouping Explanation
Substitution eligibility for the ES1GLHRTG is determined by the following critical parameters:
Mandatory Matching Parameters:
- Voltage - DC Reverse (Vr) (Max): 400 V
- Current - Average Rectified (Io): 1 A
- Package / Case: DO-219AB
- Mounting Type: Surface Mount
- Operating Temperature - Junction: -55°C to 150°C
- RoHS Status: ROHS3 Compliant
Allowable Variation Parameters:
- Reverse Recovery Time (trr): Substitute parts may vary from the primary specification
- Capacitance @ Vr, F: Substitute parts may vary from the primary specification
- Packaging Format: Cut Tape (CT), Digi-Reel®, or Tape & Reel (TR) formats are interchangeable for the same electrical component
- Product Status: Active or Not For New Designs status does not affect electrical compatibility
The three identified substitute parts—ES1GL, ES1GL RVG, and HS1GL RVG—maintain all mandatory matching parameters while exhibiting variations in secondary electrical characteristics and packaging configurations.
Parameter Comparison
| Parameter | ES1GLHRTG | ES1GL | ES1GL RVG | HS1GL RVG |
|---|---|---|---|---|
| Manufacturer | Taiwan Semiconductor Corporation | Taiwan Semiconductor Corporation | Taiwan Semiconductor Corporation | Taiwan Semiconductor Corporation |
| Category | Diodes, Rectifiers | Diodes, Rectifiers | Diodes, Rectifiers | Diodes, Rectifiers |
| Voltage - DC Reverse (Vr) (Max) | 400 V | 400 V | 400 V | 400 V |
| Current - Average Rectified (Io) | 1 A | 1 A | 1 A | 1 A |
| Voltage - Forward (Vf) (Max) @ If | 1.3 V @ 1 A | 1.3 V @ 1 A | 1.3 V @ 1 A | 1.3 V @ 1 A |
| Speed | Fast Recovery ≤ 500ns, > 200mA (Io) | Fast Recovery ≤ 500ns, > 200mA (Io) | Fast Recovery ≤ 500ns, > 200mA (Io) | Fast Recovery ≤ 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | 35 ns | 35 ns | 35 ns | 50 ns |
| Current - Reverse Leakage @ Vr | 5 µA @ 400 V | 5 µA @ 400 V | 5 µA @ 400 V | 5 µA @ 400 V |
| Capacitance @ Vr, F | 8 pF @ 4V, 1MHz | 8 pF @ 4V, 1MHz | 8 pF @ 4V, 1MHz | 15 pF @ 4V, 1MHz |
| Package / Case | DO-219AB | DO-219AB | DO-219AB | DO-219AB |
| Supplier Device Package | Sub SMA | Sub SMA | Sub SMA | Sub SMA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature - Junction | -55°C to 150°C | -55°C to 150°C | -55°C to 150°C | -55°C to 150°C |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
| REACH Status | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected |
| ECCN | EAR99 | EAR99 | EAR99 | EAR99 |
| HTSUS | 8541.10.0080 | 8541.10.0080 | 8541.10.0080 | 8541.10.0080 |
Engineering Selection Recommendations
ES1GL RVG is the primary substitute for ES1GLHRTG. Both components share identical electrical specifications including reverse recovery time (35 ns) and capacitance (8 pF @ 4V, 1MHz). ES1GL RVG maintains Active product status and is available in Tape & Reel (TR) packaging format. This substitute is suitable for high-volume manufacturing processes requiring reel-based component feeding.
ES1GL is a secondary substitute available in Cut Tape (CT) and Digi-Reel® packaging formats. This component carries Not For New Designs product status, indicating it is suitable for replacement and maintenance applications but not recommended for new product development. ES1GL maintains identical electrical parameters to ES1GLHRTG and is available in significantly higher inventory quantities (95,300 pieces).
HS1GL RVG is an alternative substitute with measurable differences in secondary electrical characteristics. The reverse recovery time is 50 ns (compared to 35 ns in ES1GLHRTG) and capacitance is 15 pF @ 4V, 1MHz (compared to 8 pF). HS1GL RVG maintains Active product status and is available in Tape & Reel (TR) packaging. This substitute is electrically compatible but exhibits different transient response characteristics due to the extended recovery time and increased capacitance.
All substitute parts maintain ROHS3 compliance, AEC-Q101 automotive qualification equivalence, and identical thermal operating ranges.
Frequently Asked Questions (FAQ)
Q: Can ES1GL RVG be used as a direct replacement for ES1GLHRTG in automotive applications?
A: Yes. Both components meet identical voltage (400 V), current (1 A), and thermal specifications (-55°C to 150°C). Both maintain ROHS3 compliance and equivalent automotive qualification standards. The primary difference is packaging format: ES1GLHRTG is supplied in cut tape format, while ES1GL RVG is supplied in Tape & Reel (TR) format. Electrical performance is identical.
Q: What is the significance of the reverse recovery time difference between ES1GLHRTG and HS1GL RVG?
A: ES1GLHRTG specifies a reverse recovery time (trr) of 35 ns, while HS1GL RVG specifies 50 ns. This parameter defines the time required for the diode to transition from forward conduction to reverse blocking state. The 15 ns difference may affect switching transient behavior in high-frequency applications but does not impact steady-state rectification performance at the specified 1 A current rating.
Q: Are there packaging compatibility considerations when substituting ES1GL for ES1GLHRTG?
A: Both components use the DO-219AB package in Sub SMA format and are surface mount devices. ES1GLHRTG is supplied in cut tape format, while ES1GL is available in Cut Tape (CT), Digi-Reel®, or Tape & Reel (TR) formats. The physical component dimensions and PCB footprint are identical. Packaging format selection depends on manufacturing equipment compatibility and assembly process requirements.
Q: Why does HS1GL RVG show higher capacitance (15 pF) compared to ES1GLHRTG (8 pF)?
A: Capacitance variation reflects differences in the internal junction structure and doping profile of the semiconductor die. The 15 pF capacitance of HS1GL RVG is measured at identical conditions (4V, 1MHz) as ES1GLHRTG. This parameter affects high-frequency switching behavior and may influence circuit performance in applications with significant AC signal components superimposed on the DC reverse bias.
Q: Is ES1GL suitable for new product designs given its Not For New Designs status?
A: ES1GL carries Not For New Designs product status, indicating the manufacturer does not recommend this part for incorporation into new product designs. However, ES1GL remains electrically and mechanically compatible with ES1GLHRTG and is suitable for replacement, repair, and maintenance applications. For new designs, ES1GL RVG or HS1GL RVG are preferred alternatives with Active product status.
Q: Do all substitute parts maintain the same moisture sensitivity level?
A: Yes. ES1GLHRTG, ES1GL, ES1GL RVG, and HS1GL RVG all specify Moisture Sensitivity Level (MSL) 1 (Unlimited), indicating no moisture sensitivity restrictions. All parts are suitable for standard storage and handling conditions without special desiccant packaging requirements.
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