ES1F R3G Equivalent & Substitute Parts

Part Overview

The ES1F R3G is a general-purpose fast recovery diode manufactured by Taiwan Semiconductor Corporation, rated for 300 V DC reverse voltage and 1 A average rectified current in a surface mount DO-214AC (SMA) package. This component is discontinued at DiGi Electronics, necessitating identification of equivalent alternatives that maintain electrical and mechanical compatibility for circuit applications requiring fast recovery rectification at 300 V, 1 A specifications.

Key Parameters

Parameter	Value	Unit
Voltage - DC Reverse (Vr) (Max)	300	V
Current - Average Rectified (Io)	1	A
Voltage - Forward (Vf) (Max) @ If	1.3	V @ 1 A
Reverse Recovery Time (trr)	35	ns
Current - Reverse Leakage @ Vr	5	µA @ 300 V
Package / Case	DO-214AC, SMA	—
Mounting Type	Surface Mount	—
Operating Temperature - Junction	-55 to 150	°C
RoHS Status	ROHS3 Compliant	—

Substitute Part Grouping Explanation

Substitution of the ES1F R3G is determined by equivalence in the following critical parameters: DC reverse voltage rating (300 V maximum), average rectified current (1 A), forward voltage drop (1.3 V @ 1 A), reverse recovery time (35 ns fast recovery characteristic), reverse leakage current (5 µA @ 300 V), package type (DO-214AC/SMA surface mount), and operating temperature range (-55°C to 150°C).

Substitute parts must maintain identical or superior ratings in voltage and current specifications, equivalent or faster recovery characteristics, and compatible surface mount packaging. Parts that exceed the original specifications in voltage or current capacity while maintaining the same package and thermal range are considered direct substitutes. Parts with different mounting technologies (through-hole versus surface mount) or significantly different recovery speeds are not equivalent for this application.

Parameter Comparison

Parameter	ES1F R3G (Main)	ES1FH	ES1E	ES1F (Sanken)
Manufacturer	Taiwan Semiconductor Corporation	Taiwan Semiconductor Corporation	SMC Diode Solutions	Sanken Electric USA Inc.
Voltage - DC Reverse (Vr) (Max)	300 V	300 V	300 V	1500 V
Current - Average Rectified (Io)	1 A	1 A	1 A	500 mA
Voltage - Forward (Vf) (Max) @ If	1.3 V @ 1 A	1.3 V @ 1 A	1.3 V @ 1 A	2 V @ 500 mA
Reverse Recovery Time (trr)	35 ns	35 ns	35 ns	1.5 µs
Current - Reverse Leakage @ Vr	5 µA @ 300 V	5 µA @ 300 V	5 µA @ 300 V	10 µA @ 1500 V
Capacitance @ Vr, F	18 pF @ 4V, 1MHz	16 pF @ 4V, 1MHz	45 pF @ 4V, 1MHz	—
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Through Hole
Package / Case	DO-214AC, SMA	DO-214AC, SMA	DO-214AC, SMA	Axial
Operating Temperature - Junction	-55 to 150°C	-55 to 150°C	-55 to 150°C	-40 to 150°C
Product Status	Discontinued at DiGi Electronics	Active	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	RoHS Compliant

Engineering Selection Recommendations

ES1FH (Taiwan Semiconductor Corporation): Direct equivalent substitute. Maintains identical electrical specifications (300 V, 1 A, 1.3 V forward voltage, 35 ns recovery time, 5 µA leakage) and surface mount DO-214AC packaging. Offers automotive-grade qualification (AEC-Q101) with active product status. Capacitance specification (16 pF) is marginally lower than the main part (18 pF), which is acceptable for general-purpose rectification applications. ROHS3 compliant. Recommended as primary substitute.

ES1E (SMC Diode Solutions): Direct equivalent substitute. Maintains identical electrical specifications (300 V, 1 A, 1.3 V forward voltage, 35 ns recovery time, 5 µA leakage) and surface mount DO-214AC packaging. Active product status with ROHS3 compliance. Capacitance specification (45 pF) is higher than the main part, which may affect high-frequency performance in sensitive applications but remains acceptable for standard rectification. REACH Affected status requires verification for specific regulatory jurisdictions.

ES1F (Sanken Electric USA Inc.): Not recommended as direct substitute. While rated for higher voltage (1500 V) and lower current (500 mA), this part uses through-hole axial packaging incompatible with surface mount circuit board layouts designed for DO-214AC components. Recovery time (1.5 µs) is significantly slower than the fast recovery specification (35 ns) of the main part, making it unsuitable for applications requiring fast switching characteristics. Minimum operating temperature (-40°C) is higher than the main part (-55°C).

Frequently Asked Questions (FAQ)

Q: Can ES1FH replace ES1F R3G in all applications?

A: Yes. ES1FH maintains identical voltage (300 V), current (1 A), forward voltage (1.3 V @ 1 A), and recovery time (35 ns) specifications. Surface mount DO-214AC packaging is mechanically and electrically compatible. The automotive-grade qualification (AEC-Q101) of ES1FH provides additional reliability assurance.

Q: What is the difference between ES1E and ES1FH?

A: Both ES1E and ES1FH are electrically equivalent to the main part with identical voltage, current, and recovery specifications. The primary difference is capacitance: ES1E measures 45 pF while ES1FH measures 16 pF at 4 V, 1 MHz. For applications sensitive to junction capacitance effects, ES1FH is preferred. ES1E carries REACH Affected status, requiring regulatory verification for specific end-use jurisdictions.

Q: Why is the Sanken ES1F not suitable as a substitute?

A: The Sanken ES1F uses through-hole axial packaging, which is mechanically incompatible with surface mount circuit boards designed for DO-214AC components. Additionally, its 1.5 µs recovery time is significantly slower than the 35 ns fast recovery requirement, making it unsuitable for applications requiring fast switching performance.

Q: Are there any temperature range limitations with substitute parts?

A: ES1FH and ES1E maintain the full operating temperature range of the main part (-55°C to 150°C). The Sanken ES1F has a minimum operating temperature of -40°C, which is 15°C higher than the main part and may be limiting for applications requiring extended low-temperature operation.

Q: What packaging considerations apply to these substitutes?

A: ES1FH and ES1E are direct package equivalents, both using surface mount DO-214AC (SMA) packaging. No circuit board layout modifications are required. The Sanken ES1F uses axial through-hole packaging and requires different board layout and assembly processes, making it incompatible with existing designs.

Q: Do all substitute parts meet RoHS compliance requirements?

A: Yes. ES1FH and ES1E are ROHS3 compliant, matching the main part. The Sanken ES1F is RoHS compliant. All three parts meet standard RoHS requirements for lead-free construction.

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