ERA-2HEC1801P Equivalent & Substitute Parts

Part Overview

The ERA-2HEC1801P is a 1.8 kOhms ±0.25% thin film chip resistor in 0402 (1005 Metric) package rated at 0.063W (1/16W). This component is currently obsolete, necessitating identification of functionally equivalent alternatives for ongoing production and maintenance applications. The part operates across -55°C to 125°C with a temperature coefficient of ±25ppm/°C and maintains ROHS3 compliance with MSL Level 1 rating.

Substiute Parts

ERA-2HEC1801P

Panasonic Electronic ComponentsIn Stock: 1043ERA-2HEC1801P Datasheet

Current PartRFQ

ERA-2AEC1801X

Panasonic Electronic ComponentsIn Stock: 982ERA-2AEC1801X Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the ERA-2HEC1801P is determined by the following critical parameters:

• Resistance value: 1.8 kOhms (exact match required)
• Tolerance: ±0.25% (exact match required)
• Power rating: 0.063W minimum (1/16W)
• Package: 0402 (1005 Metric) form factor
• Composition: Thin film construction
• Temperature coefficient: ±25ppm/°C
• RoHS compliance: ROHS3 Compliant

The ERA-2AEC1801X qualifies as a direct substitute based on matching all electrical specifications and package requirements. The substitute maintains identical resistance, tolerance, power rating, package geometry, and thin film composition. Operating temperature range extension and automotive qualification represent enhanced capabilities rather than deviations from the original specification.

Parameter Comparison

Engineering Selection Recommendations

The ERA-2AEC1801X is the qualified substitute for ERA-2HEC1801P applications. Both components are manufactured by Panasonic Electronic Components and share identical electrical and mechanical specifications across all critical parameters.

The ERA-2AEC1801X offers the advantage of active product status, ensuring continued availability and supply chain reliability. The component carries AEC-Q200 automotive qualification, which does not restrict use in non-automotive applications and provides additional quality assurance through automotive-grade testing protocols.

The extended operating temperature range of the ERA-2AEC1801X (-55°C ~ 155°C versus -55°C ~ 125°C) provides additional thermal margin for applications operating near the upper temperature limit of the original specification. Both components maintain identical RoHS3 compliance and MSL Level 1 moisture sensitivity ratings, ensuring compatibility with standard PCB assembly and storage procedures.

Frequently Asked Questions (FAQ)

Q: Can ERA-2AEC1801X be used as a direct replacement for ERA-2HEC1801P?

A: Yes. Both components share identical resistance (1.8 kOhms), tolerance (±0.25%), power rating (0.063W), package (0402), composition (thin film), and temperature coefficient (±25ppm/°C). The ERA-2AEC1801X is electrically and mechanically interchangeable.

Q: What is the difference between ERA-2H and ERA-2A series?

A: The ERA-2A series incorporates AEC-Q200 automotive qualification and extends the operating temperature range to 155°C. The ERA-2H series is the standard industrial variant. Both series use identical thin film construction and electrical specifications for the 1.8 kOhms ±0.25% value.

Q: Are there any compliance or certification differences?

A: Both components are ROHS3 compliant with MSL Level 1 rating. The ERA-2AEC1801X carries additional AEC-Q200 automotive qualification. This qualification does not restrict use in non-automotive applications and represents enhanced quality assurance.

Q: Does the extended temperature range of ERA-2AEC1801X affect circuit performance?

A: No. The temperature coefficient remains ±25ppm/°C for both components. The extended range of the ERA-2AEC1801X provides additional operational margin but does not alter performance characteristics within the original -55°C ~ 125°C specification window.

Q: Are there any PCB assembly or storage differences?

A: No. Both components maintain identical MSL Level 1 (Unlimited) moisture sensitivity ratings and 0402 package geometry, requiring no changes to assembly processes, storage procedures, or handling protocols.