EPM7128BFC100-7 Equivalent & Substitute Parts

Part Overview

The EPM7128BFC100-7 is a Complex Programmable Logic Device (CPLD) from Intel's MAX® 7000B series, featuring 128 macrocells and 2500 gates in a 100-pin Fine-pitch Ball Grid Array (FBGA) package. This device is classified as obsolete, making equivalent substitute parts necessary for new designs and production continuity. The part operates with internal voltage supply of 2.375V to 2.625V and supports in-system programmable functionality with a maximum propagation delay of 7.5 nanoseconds.

Substiute Parts

EPM7128BFC100-7
IntelIn Stock: 1210EPM7128BFC100-7 Datasheet
EPM7128BFC100-7
Current Part
ATF1508ASV-15AU100
Microchip TechnologyIn Stock: 1205ATF1508ASV-15AU100 Datasheet
ATF1508ASV-15AU100
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number EPM7128BFC100-7
Manufacturer Intel
Series MAX® 7000B
Product Status Obsolete
Number of Macrocells 128
Number of Gates 2500
Number of I/O 84
Delay Time tpd(1) Max 7.5 ns
Voltage Supply - Internal 2.375V ~ 2.625V
Operating Temperature 0°C ~ 70°C (TA)
Package / Case 100-LBGA
Mounting Type Surface Mount
Programmable Type In System Programmable
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the EPM7128BFC100-7 is based on the following critical parameters that define functional equivalence:

  • Macrocell Count: 128 macrocells (primary functional requirement)
  • Programmable Type: In System Programmable capability
  • Logic Density: Minimum 2500 gates to maintain design compatibility
  • I/O Pin Count: Minimum 80 I/O pins for signal routing
  • Package Type: Surface mount configuration with ball grid or quad flat pack options
  • Regulatory Compliance: REACH and RoHS status for supply chain continuity

The ATF1508ASV-15AU100 from Microchip Technology meets these substitution criteria as an active product with equivalent macrocell density and programmable functionality, though with different electrical characteristics and package geometry.

Parameter Comparison

Parameter EPM7128BFC100-7 ATF1508ASV-15AU100
Manufacturer Intel Microchip Technology
Product Status Obsolete Active
Number of Macrocells 128 128
Number of I/O 84 80
Delay Time tpd(1) Max 7.5 ns 15 ns
Voltage Supply - Internal 2.375V ~ 2.625V 3V ~ 3.6V
Operating Temperature 0°C ~ 70°C (TA) -40°C ~ 85°C (TA)
Package / Case 100-LBGA 100-TQFP
Programmable Type In System Programmable In System Programmable (min 10K program/erase cycles)
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
RoHS Status Not specified ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

The ATF1508ASV-15AU100 serves as an active substitute for the obsolete EPM7128BFC100-7. Both devices maintain equivalent macrocell density (128) and in-system programmable functionality, ensuring design logic compatibility. The substitute part offers extended operating temperature range (-40°C to 85°C versus 0°C to 70°C) and active product status with ongoing manufacturer support.

Key considerations for selection:

  • Propagation Delay: The substitute exhibits 15 ns maximum delay compared to 7.5 ns for the original part. Timing-critical applications must validate this specification against design requirements.
  • Voltage Supply: The substitute operates at 3V to 3.6V internal supply versus 2.375V to 2.625V for the original. Power supply design modifications may be required.
  • Package Geometry: The substitute uses 100-TQFP (14x14 mm) versus 100-LBGA (11x11 mm) for the original. PCB layout and footprint redesign is necessary.
  • I/O Pin Count: The substitute provides 80 I/O pins versus 84 for the original. Design verification is required to confirm sufficient signal routing capability.
  • Regulatory Compliance: The substitute is ROHS3 compliant and REACH unaffected, meeting current environmental and supply chain requirements.

Frequently Asked Questions (FAQ)

Q: Can the ATF1508ASV-15AU100 directly replace the EPM7128BFC100-7 without design changes?

A: Direct pin-for-pin replacement is not possible due to different package types (100-TQFP versus 100-LBGA) and pin count differences (80 versus 84 I/O). PCB layout redesign and footprint modification are required. Logic design compatibility is maintained through equivalent macrocell density.

Q: What are the critical electrical differences between these parts?

A: The substitute operates at higher internal voltage (3V to 3.6V versus 2.375V to 2.625V) and exhibits longer propagation delay (15 ns versus 7.5 ns). Power supply circuitry and timing analysis must be updated for the substitute part.

Q: Is the substitute part suitable for high-speed applications?

A: The 15 ns maximum propagation delay of the substitute is slower than the original 7.5 ns specification. Applications with strict timing requirements must validate that the substitute meets performance criteria through simulation or testing.

Q: What is the temperature operating range difference?

A: The substitute supports -40°C to 85°C operating temperature, providing wider range than the original 0°C to 70°C specification. This allows use in extended temperature environments.

Q: Are there any supply chain advantages to using the substitute?

A: The substitute is an active product from Microchip Technology with current manufacturing and distribution support, whereas the original is obsolete. The substitute also carries ROHS3 compliance certification, meeting modern environmental standards.

Q: How do the I/O pin counts affect design compatibility?

A: The substitute provides 80 I/O pins compared to 84 for the original. Design verification is necessary to confirm that all required signals can be routed with the reduced pin count. Some applications may require signal multiplexing or elimination of non-critical I/O.

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