EPF6024ATC144-1 Equivalent & Substitute Parts

Part Overview

The EPF6024ATC144-1 is a FLEX 6000 Field Programmable Gate Array (FPGA) IC with 117 I/O pins in a 144-LQFP package. This device is classified as obsolete, making equivalent and substitute parts necessary for ongoing system support and new design implementations. The part delivers 1960 logic elements across 196 LABs with 24000 gates, operating at 3V to 3.6V supply voltage in the 0°C to 85°C temperature range.

Substiute Parts

EPF6024ATC144-1

IntelIn Stock: 943EPF6024ATC144-1 Datasheet

Current PartRFQ

XC3S50-4TQG144I

AMDIn Stock: 51363XC3S50-4TQG144I Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution for the EPF6024ATC144-1 is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 144-LQFP package to ensure mechanical and electrical compatibility with existing PCB layouts and socket designs.

I/O Pin Count: The substitute must provide a minimum of 117 I/O pins to maintain functional equivalence. Devices with fewer I/O pins cannot support the same signal routing requirements.

Logic Capacity: The substitute must deliver sufficient logic elements and LABs to accommodate designs originally targeting 1960 logic elements and 196 LABs.

Supply Voltage Range: The substitute must operate within or encompass the 3V to 3.6V supply voltage specification to ensure compatibility with existing power distribution systems.

Operating Temperature Range: The substitute must support the 0°C to 85°C operating temperature range to maintain thermal compatibility with the original application environment.

Mounting Type: Surface mount technology must be preserved to ensure compatibility with automated assembly processes and PCB design constraints.

Parameter Comparison

Engineering Selection Recommendations

The XC3S50-4TQG144I serves as a substitute for the EPF6024ATC144-1 based on package compatibility and mounting type alignment. Both devices utilize the 144-LQFP package in a 20x20mm footprint, enabling direct PCB layout compatibility.

The XC3S50-4TQG144I is classified as Last Time Buy, providing extended availability compared to the obsolete status of the EPF6024ATC144-1. This status extends the procurement window for new designs and system replacements.

Design migration requires evaluation of the following parameter differences:

I/O Pin Count: The substitute provides 97 I/O pins versus 117 on the main part. Designs utilizing all 117 I/O pins require architectural review to determine feasibility within the reduced pin count.

Logic Capacity: The substitute delivers 1728 logic elements and 192 LABs compared to 1960 logic elements and 196 LABs. Logic-intensive designs must be analyzed for fit within the reduced capacity.

Supply Voltage: The substitute operates at 1.14V to 1.26V, requiring power supply redesign from the 3V to 3.6V specification of the main part.

Operating Temperature Range: The substitute supports -40°C to 100°C, exceeding the 0°C to 85°C range of the main part and providing broader thermal coverage.

Compliance: Both devices maintain MSL 3 (168 Hours) moisture sensitivity and REACH Unaffected status, ensuring consistent handling and environmental compliance.

Frequently Asked Questions (FAQ)

Q: Can the XC3S50-4TQG144I be used as a direct replacement for the EPF6024ATC144-1?

A: Direct replacement is not guaranteed due to parameter differences. The substitute has 20 fewer I/O pins (97 vs. 117) and 232 fewer logic elements (1728 vs. 1960). PCB layout compatibility is maintained through identical 144-LQFP packaging, but design functionality must be verified against the reduced I/O and logic capacity.

Q: What are the primary compatibility constraints?

A: The 144-LQFP package and surface mount technology are compatible. However, supply voltage differs significantly (1.14V–1.26V vs. 3V–3.6V), requiring power supply redesign. I/O pin count reduction and logic element reduction may impact design feasibility.

Q: Are there moisture sensitivity or compliance concerns?

A: Both devices maintain identical MSL 3 (168 Hours) ratings and REACH Unaffected status. Handling and storage procedures remain consistent between the two parts.

Q: How does the operating temperature range affect selection?

A: The substitute supports a wider temperature range (-40°C to 100°C) compared to the main part (0°C to 85°C). Applications requiring the narrower 0°C to 85°C range are fully supported by the substitute.

Q: What design considerations apply to I/O pin reduction?

A: The 20-pin reduction (117 to 97) requires signal routing analysis. Designs utilizing all 117 I/O pins must be re-architected or alternative devices evaluated to accommodate the constraint.

Q: Does the substitute provide adequate logic capacity?

A: The substitute delivers 1728 logic elements versus 1960 required. Logic-intensive designs must undergo synthesis and place-and-route analysis to confirm fit within the reduced capacity.