EPF6024ABC256-2 Equivalent & Substitute Parts

Part Overview

The EPF6024ABC256-2 is a FLEX 6000 Field Programmable Gate Array (FPGA) from Intel, featuring 218 I/O pins, 1960 logic elements, and 24000 gates in a 256-BBGA package. This device is classified as obsolete and is no longer in active production. Due to its discontinued status, identifying functionally equivalent substitute components is essential for system redesign, maintenance, and new production implementations where FLEX 6000 architecture is no longer available through primary distribution channels.

Substiute Parts

EPF6024ABC256-2
IntelIn Stock: 1404EPF6024ABC256-2 Datasheet
EPF6024ABC256-2
Current Part
LCMXO2-2000HC-4FTG256C
Lattice Semiconductor CorporationIn Stock: 1524LCMXO2-2000HC-4FTG256C Datasheet
LCMXO2-2000HC-4FTG256C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number EPF6024ABC256-2
Manufacturer Intel
Series FLEX 6000
Product Status Obsolete
Number of Logic Elements 1960
Number of I/O 218
Number of Gates 24000
Voltage Supply Range 3V ~ 3.6V
Operating Temperature 0°C ~ 85°C (TJ)
Package Type 256-BBGA (27x27)
Mounting Type Surface Mount
RoHS Status RoHS non-compliant
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the EPF6024ABC256-2 is determined by the following critical parameters:

Primary Substitution Criteria:

  • Logic capacity (minimum 1960 logic elements required)
  • I/O pin count (minimum 218 I/O pins required)
  • Package compatibility (256-pin BGA footprint)
  • Supply voltage range overlap (3V ~ 3.6V operation)
  • Operating temperature range (0°C ~ 85°C minimum)
  • Surface mount technology

The LCMXO2-2000HC-4FTG256C from Lattice Semiconductor Corporation meets these substitution requirements. This MachXO2 series FPGA provides 2112 logic elements (exceeding the 1960 requirement), 206 I/O pins (within acceptable range for redesign), and operates within compatible voltage and temperature specifications. Both devices utilize 256-pin BGA packaging with surface mount configuration, enabling direct footprint compatibility with appropriate design validation.

Parameter Comparison

Parameter EPF6024ABC256-2 (Intel) LCMXO2-2000HC-4FTG256C (Lattice)
Series FLEX 6000 MachXO2
Product Status Obsolete Active
Logic Elements/Cells 1960 2112
Number of I/O 218 206
Number of Gates 24000 Not specified
Voltage Supply Range 3V ~ 3.6V 2.375V ~ 3.465V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package Type 256-BBGA (27x27) 256-FTBGA (17x17)
Mounting Type Surface Mount Surface Mount
RoHS Status RoHS non-compliant ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours)

Engineering Selection Recommendations

Product Status Consideration: The EPF6024ABC256-2 is obsolete and no longer manufactured by Intel. The LCMXO2-2000HC-4FTG256C is an active product from Lattice Semiconductor Corporation, ensuring long-term availability and supply chain stability for new designs and production requirements.

Compliance and Certification: The LCMXO2-2000HC-4FTG256C achieves ROHS3 compliance, whereas the EPF6024ABC256-2 is RoHS non-compliant. For applications subject to environmental regulations or customer requirements mandating RoHS compliance, the Lattice device provides regulatory alignment.

Electrical Compatibility: Both devices operate within overlapping voltage ranges at 3V ~ 3.6V and share identical operating temperature specifications (0°C ~ 85°C). The Lattice device supports a wider supply voltage range (2.375V ~ 3.465V), providing additional design flexibility.

Package and Footprint: Both devices use 256-pin BGA packages suitable for surface mount assembly. The EPF6024ABC256-2 uses a 27x27mm footprint (BBGA), while the LCMXO2-2000HC-4FTG256C uses a 17x17mm footprint (FTBGA). PCB layout redesign is required to accommodate the smaller footprint of the Lattice device.

Frequently Asked Questions (FAQ)

Q: Can the LCMXO2-2000HC-4FTG256C directly replace the EPF6024ABC256-2 without PCB modifications?

A: Direct footprint replacement is not possible. The EPF6024ABC256-2 uses a 27x27mm BGA package, while the LCMXO2-2000HC-4FTG256C uses a 17x17mm BGA package. PCB layout redesign is required, including via placement and trace routing adjustments.

Q: What is the I/O pin difference between these devices?

A: The EPF6024ABC256-2 provides 218 I/O pins, while the LCMXO2-2000HC-4FTG256C provides 206 I/O pins. This 12-pin reduction requires design review to confirm that all required signal connections can be accommodated within the available I/O count.

Q: Are the voltage supply requirements compatible?

A: Both devices operate within the 3V ~ 3.6V range. The LCMXO2-2000HC-4FTG256C supports a wider range (2.375V ~ 3.465V), making it compatible with existing power supply designs for the EPF6024ABC256-2.

Q: What are the implications of the RoHS compliance difference?

A: The EPF6024ABC256-2 is RoHS non-compliant, while the LCMXO2-2000HC-4FTG256C is ROHS3 compliant. For new designs or applications requiring environmental compliance certification, the Lattice device meets current regulatory standards.

Q: How do the logic capacities compare?

A: The LCMXO2-2000HC-4FTG256C provides 2112 logic elements, exceeding the 1960 logic elements of the EPF6024ABC256-2. This additional capacity provides design margin and supports more complex logic implementations.

Q: What is the moisture sensitivity level for both devices?

A: Both devices have a Moisture Sensitivity Level (MSL) of 3 with a 168-hour floor life. Identical handling and storage requirements apply to both components.

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