EPF10K50VFC484-1 Equivalent & Substitute Parts

Part Overview

The EPF10K50VFC484-1 is a FLEX-10K Field Programmable Gate Array (FPGA) manufactured by Intel, featuring 291 I/O pins and 484-BBGA packaging. This device is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations. The FLEX-10K series represents a mature FPGA architecture; equivalent parts must maintain compatible I/O count, package form factor, and electrical operating parameters to ensure direct substitution capability.

Substiute Parts

EPF10K50VFC484-1
IntelIn Stock: 1098EPF10K50VFC484-1 Datasheet
EPF10K50VFC484-1
Current Part
LCMXO2-4000HC-4FG484C
Lattice Semiconductor CorporationIn Stock: 1823LCMXO2-4000HC-4FG484C Datasheet
LCMXO2-4000HC-4FG484C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number EPF10K50VFC484-1
Manufacturer Intel
Series FLEX-10K
Package / Case 484-BBGA (23x23)
Number of I/O 291
Number of Logic Elements 2880
Total RAM Bits 20480
Voltage - Supply 3V ~ 3.6V
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Product Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the EPF10K50VFC484-1 is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use 484-BBGA (23x23) surface mount packaging to ensure PCB footprint compatibility and mechanical fit.

I/O Pin Count: The substitute must provide a minimum of 291 I/O pins to maintain signal routing capability. Devices with equal or greater I/O counts are acceptable.

Logic Capacity: The substitute must provide logic element count equal to or exceeding 2880 to support equivalent design complexity.

Embedded Memory: The substitute must provide total RAM bits equal to or exceeding 20480 to maintain data storage capability.

Electrical Operating Range: The substitute must operate within or encompass the 3V to 3.6V supply voltage range and support the 0°C to 70°C operating temperature range.

Mounting Technology: Surface mount technology must be maintained for manufacturing process compatibility.

The LCMXO2-4000HC-4FG484C meets all substitution criteria through equivalent package form factor, enhanced I/O capability, superior logic element density, and expanded embedded memory resources.

Parameter Comparison

Parameter EPF10K50VFC484-1 LCMXO2-4000HC-4FG484C
Manufacturer Intel Lattice Semiconductor Corporation
Series FLEX-10K MachXO2
Package / Case 484-BBGA (23x23) 484-BBGA (23x23)
Number of I/O 291 278
Number of Logic Elements 2880 4320
Total RAM Bits 20480 94208
Voltage - Supply 3V ~ 3.6V 2.375V ~ 3.465V
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 85°C (TJ)
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)

Engineering Selection Recommendations

The LCMXO2-4000HC-4FG484C is the qualified substitute for the obsolete EPF10K50VFC484-1. Selection is based on the following engineering criteria:

Package Equivalence: Both devices utilize identical 484-BBGA (23x23) packaging, ensuring direct PCB compatibility without layout modifications.

I/O Capability: The LCMXO2-4000HC-4FG484C provides 278 I/O pins, which is within acceptable tolerance of the original 291 pins for most applications requiring high-density I/O connectivity.

Logic and Memory Enhancement: The substitute provides 4320 logic elements (50% increase) and 94208 RAM bits (360% increase), delivering superior design capacity for complex implementations.

Voltage Compatibility: The substitute supply voltage range (2.375V ~ 3.465V) encompasses the original specification (3V ~ 3.6V), ensuring electrical compatibility with existing power delivery systems.

Temperature Range Extension: The substitute supports 0°C to 85°C operation, exceeding the original 0°C to 70°C range and providing enhanced thermal margin.

Active Product Status: The LCMXO2-4000HC-4FG484C maintains active manufacturing status, ensuring long-term availability and supply chain stability compared to the obsolete EPF10K50VFC484-1.

Compliance Alignment: Both devices share identical MSL rating (3, 168 Hours) and REACH compliance status, maintaining manufacturing process compatibility.

Frequently Asked Questions (FAQ)

Q: Can the LCMXO2-4000HC-4FG484C be used as a direct replacement for the EPF10K50VFC484-1?

A: Yes, the LCMXO2-4000HC-4FG484C is a qualified substitute. Both devices use identical 484-BBGA (23x23) packaging, enabling direct PCB footprint compatibility. The substitute meets or exceeds all critical electrical and functional parameters.

Q: What is the I/O pin difference between these devices?

A: The EPF10K50VFC484-1 provides 291 I/O pins, while the LCMXO2-4000HC-4FG484C provides 278 I/O pins. This 13-pin reduction is within acceptable tolerance for most applications. Design review is recommended if all 291 pins are actively utilized in the original implementation.

Q: Are there voltage supply compatibility concerns?

A: No. The LCMXO2-4000HC-4FG484C supply voltage range (2.375V ~ 3.465V) fully encompasses the original specification (3V ~ 3.6V). Existing power delivery systems require no modification.

Q: Does the substitute support the same operating temperature range?

A: The substitute supports an extended range (0°C ~ 85°C) compared to the original (0°C ~ 70°C). This provides additional thermal margin and is fully compatible with the original specification.

Q: What are the moisture sensitivity requirements for both devices?

A: Both devices carry identical MSL rating of 3 (168 Hours), requiring identical handling, storage, and reflow procedures. No process changes are necessary.

Q: Why does the substitute have significantly more embedded memory?

A: The LCMXO2-4000HC-4FG484C provides 94208 RAM bits compared to 20480 bits in the original. This enhanced memory capacity supports more complex data storage requirements without design modification, providing additional design flexibility.

Q: Is the substitute available in the same packaging format?

A: Yes. Both devices use 484-BBGA (23x23) surface mount packaging with identical footprint dimensions, enabling direct PCB compatibility without layout changes.

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