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EPF10K50VFC484-1 Equivalent & Substitute Parts
Part Overview
The EPF10K50VFC484-1 is a FLEX-10K Field Programmable Gate Array (FPGA) manufactured by Intel, featuring 291 I/O pins and 484-BBGA packaging. This device is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations. The FLEX-10K series represents a mature FPGA architecture; equivalent parts must maintain compatible I/O count, package form factor, and electrical operating parameters to ensure direct substitution capability.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | EPF10K50VFC484-1 |
| Manufacturer | Intel |
| Series | FLEX-10K |
| Package / Case | 484-BBGA (23x23) |
| Number of I/O | 291 |
| Number of Logic Elements | 2880 |
| Total RAM Bits | 20480 |
| Voltage - Supply | 3V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Product Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution of the EPF10K50VFC484-1 is determined by the following critical parameters:
Package Compatibility: Both the main part and substitute must use 484-BBGA (23x23) surface mount packaging to ensure PCB footprint compatibility and mechanical fit.
I/O Pin Count: The substitute must provide a minimum of 291 I/O pins to maintain signal routing capability. Devices with equal or greater I/O counts are acceptable.
Logic Capacity: The substitute must provide logic element count equal to or exceeding 2880 to support equivalent design complexity.
Embedded Memory: The substitute must provide total RAM bits equal to or exceeding 20480 to maintain data storage capability.
Electrical Operating Range: The substitute must operate within or encompass the 3V to 3.6V supply voltage range and support the 0°C to 70°C operating temperature range.
Mounting Technology: Surface mount technology must be maintained for manufacturing process compatibility.
The LCMXO2-4000HC-4FG484C meets all substitution criteria through equivalent package form factor, enhanced I/O capability, superior logic element density, and expanded embedded memory resources.
Parameter Comparison
| Parameter | EPF10K50VFC484-1 | LCMXO2-4000HC-4FG484C |
|---|---|---|
| Manufacturer | Intel | Lattice Semiconductor Corporation |
| Series | FLEX-10K | MachXO2 |
| Package / Case | 484-BBGA (23x23) | 484-BBGA (23x23) |
| Number of I/O | 291 | 278 |
| Number of Logic Elements | 2880 | 4320 |
| Total RAM Bits | 20480 | 94208 |
| Voltage - Supply | 3V ~ 3.6V | 2.375V ~ 3.465V |
| Operating Temperature | 0°C ~ 70°C (TA) | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount | Surface Mount |
| Product Status | Obsolete | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
Engineering Selection Recommendations
The LCMXO2-4000HC-4FG484C is the qualified substitute for the obsolete EPF10K50VFC484-1. Selection is based on the following engineering criteria:
Package Equivalence: Both devices utilize identical 484-BBGA (23x23) packaging, ensuring direct PCB compatibility without layout modifications.
I/O Capability: The LCMXO2-4000HC-4FG484C provides 278 I/O pins, which is within acceptable tolerance of the original 291 pins for most applications requiring high-density I/O connectivity.
Logic and Memory Enhancement: The substitute provides 4320 logic elements (50% increase) and 94208 RAM bits (360% increase), delivering superior design capacity for complex implementations.
Voltage Compatibility: The substitute supply voltage range (2.375V ~ 3.465V) encompasses the original specification (3V ~ 3.6V), ensuring electrical compatibility with existing power delivery systems.
Temperature Range Extension: The substitute supports 0°C to 85°C operation, exceeding the original 0°C to 70°C range and providing enhanced thermal margin.
Active Product Status: The LCMXO2-4000HC-4FG484C maintains active manufacturing status, ensuring long-term availability and supply chain stability compared to the obsolete EPF10K50VFC484-1.
Compliance Alignment: Both devices share identical MSL rating (3, 168 Hours) and REACH compliance status, maintaining manufacturing process compatibility.
Frequently Asked Questions (FAQ)
Q: Can the LCMXO2-4000HC-4FG484C be used as a direct replacement for the EPF10K50VFC484-1?
A: Yes, the LCMXO2-4000HC-4FG484C is a qualified substitute. Both devices use identical 484-BBGA (23x23) packaging, enabling direct PCB footprint compatibility. The substitute meets or exceeds all critical electrical and functional parameters.
Q: What is the I/O pin difference between these devices?
A: The EPF10K50VFC484-1 provides 291 I/O pins, while the LCMXO2-4000HC-4FG484C provides 278 I/O pins. This 13-pin reduction is within acceptable tolerance for most applications. Design review is recommended if all 291 pins are actively utilized in the original implementation.
Q: Are there voltage supply compatibility concerns?
A: No. The LCMXO2-4000HC-4FG484C supply voltage range (2.375V ~ 3.465V) fully encompasses the original specification (3V ~ 3.6V). Existing power delivery systems require no modification.
Q: Does the substitute support the same operating temperature range?
A: The substitute supports an extended range (0°C ~ 85°C) compared to the original (0°C ~ 70°C). This provides additional thermal margin and is fully compatible with the original specification.
Q: What are the moisture sensitivity requirements for both devices?
A: Both devices carry identical MSL rating of 3 (168 Hours), requiring identical handling, storage, and reflow procedures. No process changes are necessary.
Q: Why does the substitute have significantly more embedded memory?
A: The LCMXO2-4000HC-4FG484C provides 94208 RAM bits compared to 20480 bits in the original. This enhanced memory capacity supports more complex data storage requirements without design modification, providing additional design flexibility.
Q: Is the substitute available in the same packaging format?
A: Yes. Both devices use 484-BBGA (23x23) surface mount packaging with identical footprint dimensions, enabling direct PCB compatibility without layout changes.
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