EPF10K200SFC672-1 Equivalent & Substitute Parts

Part Overview

The EPF10K200SFC672-1 is a FLEX-10KS® Field Programmable Gate Array (FPGA) manufactured by Intel, featuring 470 I/O pins and 9984 logic elements in a 672-BBGA package. This device is classified as obsolete, making equivalent substitute parts necessary for new designs and production continuity. The part delivers 513,000 gates with 98,304 bits of embedded RAM, operating at 2.375V to 2.625V supply voltage across a 0°C to 70°C temperature range.

Substiute Parts

EPF10K200SFC672-1

IntelIn Stock: 1386EPF10K200SFC672-1 Datasheet

Current PartRFQ

LFXP2-30E-5FN672C

Lattice Semiconductor CorporationIn Stock: 1224LFXP2-30E-5FN672C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the EPF10K200SFC672-1 is determined by the following critical parameters:

• Package Compatibility: Both main and substitute parts must use 672-BBGA (27x27) package format to ensure PCB footprint compatibility
• I/O Pin Count: Minimum 470 I/O pins required to maintain signal routing equivalence
• Logic Element Capacity: Minimum 9984 logic elements to support design complexity
• Embedded RAM: Minimum 98,304 bits to preserve memory functionality
• Surface Mount Technology: Both parts use surface mount assembly methods
• Moisture Sensitivity: MSL 3 rating ensures equivalent handling and storage requirements

The LFXP2-30E-5FN672C from Lattice Semiconductor Corporation meets all substitution criteria with equivalent or superior specifications in logic capacity, I/O count, and package format.

Parameter Comparison

Engineering Selection Recommendations

The LFXP2-30E-5FN672C qualifies as a direct substitute for the obsolete EPF10K200SFC672-1 based on the following engineering criteria:

• Package Equivalence: Both devices use identical 672-BBGA (27x27) package format, ensuring PCB compatibility without layout redesign
• I/O Compatibility: The substitute provides 472 I/O pins versus 470 required, meeting minimum signal routing requirements
• Logic Capacity: The LFXP2-30E-5FN672C provides 29,000 logic elements, exceeding the 9,984 elements of the original part, allowing design migration without functional loss
• Memory Capacity: The substitute offers 396,288 RAM bits compared to 98,304 bits, providing additional embedded memory resources
• Active Product Status: The LFXP2-30E-5FN672C is in active production, ensuring long-term availability and supply chain continuity
• Compliance: The substitute meets ROHS3 compliance requirements, supporting modern environmental and regulatory standards
• Temperature Range: Extended operating temperature range (0°C to 85°C) provides broader operational flexibility compared to the original part

Supply voltage differs between the two devices (2.375V–2.625V versus 1.14V–1.26V), requiring power supply circuit redesign during implementation.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-30E-5FN672C be used as a direct drop-in replacement for the EPF10K200SFC672-1?

A: The LFXP2-30E-5FN672C is package-compatible and functionally equivalent in terms of I/O count, logic capacity, and embedded memory. However, the different supply voltage ranges (1.14V–1.26V versus 2.375V–2.625V) require power supply circuit modifications. PCB layout remains compatible due to identical 672-BBGA package format.

Q: What are the key compatibility criteria for substituting the EPF10K200SFC672-1?

A: Substitute parts must meet the following requirements: 672-BBGA package format, minimum 470 I/O pins, minimum 9,984 logic elements, minimum 98,304 bits embedded RAM, surface mount technology, and MSL 3 moisture sensitivity rating.

Q: Why is the EPF10K200SFC672-1 classified as obsolete?

A: The FLEX-10KS® series has reached end-of-life status. Intel has discontinued production, making the LFXP2-30E-5FN672C from Lattice Semiconductor Corporation the recommended active alternative for new designs and production continuity.

Q: Does the LFXP2-30E-5FN672C provide superior specifications?

A: Yes. The substitute offers 29,000 logic elements (versus 9,984), 396,288 RAM bits (versus 98,304), 472 I/O pins (versus 470), extended temperature range (0°C–85°C versus 0°C–70°C), and ROHS3 compliance. These enhancements support more complex designs without functional compromise.

Q: Are there any design considerations when migrating from EPF10K200SFC672-1 to LFXP2-30E-5FN672C?

A: Primary considerations include supply voltage circuit redesign (1.14V–1.26V instead of 2.375V–2.625V) and potential firmware or HDL code adaptation due to different FPGA architectures. Package footprint and I/O pin assignments remain compatible.

Q: What is the moisture sensitivity level for both parts?

A: Both the EPF10K200SFC672-1 and LFXP2-30E-5FN672C carry MSL 3 rating with 168-hour floor life, requiring identical handling, storage, and reflow procedures.