EPF10K200EFC672-1 Equivalent & Substitute Parts

Part Overview

The EPF10K200EFC672-1 is a FLEX-10KE® Field Programmable Gate Array (FPGA) from Intel, featuring 470 I/O pins and 9984 logic elements in a 672-BBGA package. This device is classified as obsolete, making equivalent substitute parts necessary for new designs and ongoing production requirements. The FLEX-10KE® series represents legacy FPGA technology; identifying compatible alternatives ensures design continuity and supply chain stability.

Substiute Parts

EPF10K200EFC672-1
IntelIn Stock: 805EPF10K200EFC672-1 Datasheet
EPF10K200EFC672-1
Current Part
LFXP2-30E-5FN672C
Lattice Semiconductor CorporationIn Stock: 1224LFXP2-30E-5FN672C Datasheet
LFXP2-30E-5FN672C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number EPF10K200EFC672-1
Manufacturer Intel
Series FLEX-10KE®
Product Status Obsolete
Number of Logic Elements/Cells 9984
Number of I/O 470
Total RAM Bits 98304
Number of Gates 513000
Voltage - Supply 2.3V ~ 2.7V
Operating Temperature 0°C ~ 70°C (TA)
Package / Case 672-BBGA
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the EPF10K200EFC672-1 is determined by the following critical parameters:

  • Package Compatibility: Both devices must use 672-BBGA (27x27) package format to ensure PCB footprint compatibility and pin assignment alignment.
  • I/O Pin Count: The substitute must provide a minimum of 470 I/O pins to maintain signal routing requirements.
  • Logic Capacity: The substitute must provide sufficient logic elements to accommodate the original design's gate count and functional complexity.
  • Embedded Memory: The substitute must provide adequate RAM bits for on-chip memory requirements.
  • Supply Voltage: Operating voltage ranges must be compatible with existing power distribution infrastructure.
  • Mounting Type: Surface mount technology must be maintained for manufacturing consistency.

The LFXP2-30E-5FN672C from Lattice Semiconductor Corporation meets these substitution criteria through equivalent package geometry, enhanced I/O capability, and superior logic density.

Parameter Comparison

Parameter EPF10K200EFC672-1 (Intel) LFXP2-30E-5FN672C (Lattice)
Series FLEX-10KE® XP2
Product Status Obsolete Active
Number of Logic Elements/Cells 9984 29000
Number of I/O 470 472
Total RAM Bits 98304 396288
Number of Gates 513000 Not specified
Voltage - Supply 2.3V ~ 2.7V 1.14V ~ 1.26V
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 85°C (TJ)
Package / Case 672-BBGA 672-BBGA
Supplier Device Package 672-FBGA (27x27) 672-FPBGA (27x27)
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
RoHS Status Not specified ROHS3 Compliant

Engineering Selection Recommendations

The LFXP2-30E-5FN672C is the designated substitute for the obsolete EPF10K200EFC672-1. Selection is based on the following engineering factors:

  • Active Product Status: The LFXP2-30E-5FN672C maintains active production status, ensuring long-term availability and supply chain reliability compared to the obsolete EPF10K200EFC672-1.
  • Package Equivalence: Both devices utilize identical 672-BBGA (27x27) package geometry, enabling direct PCB footprint compatibility without layout redesign.
  • I/O Compatibility: The LFXP2-30E-5FN672C provides 472 I/O pins, exceeding the original 470-pin requirement and accommodating existing signal routing.
  • Enhanced Capacity: The substitute offers 29000 logic elements and 396288 RAM bits, providing design margin and supporting functional expansion beyond the original specification.
  • Regulatory Compliance: The LFXP2-30E-5FN672C is ROHS3 compliant, meeting current environmental and regulatory requirements.
  • Thermal Performance: Extended operating temperature range (0°C ~ 85°C) provides improved thermal margin compared to the original device.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-30E-5FN672C directly replace the EPF10K200EFC672-1 without PCB modifications?

A: Yes. Both devices use identical 672-BBGA (27x27) package geometry. PCB footprint and pin assignments are compatible, eliminating the need for layout redesign.

Q: What are the key differences between these two devices?

A: The primary differences are product status (obsolete vs. active), supply voltage (2.3V-2.7V vs. 1.14V-1.26V), logic capacity (9984 vs. 29000 elements), and embedded memory (98304 vs. 396288 bits). The LFXP2-30E-5FN672C provides enhanced performance and regulatory compliance.

Q: Is the lower supply voltage of the LFXP2-30E-5FN672C compatible with existing power distribution?

A: Power supply compatibility must be evaluated based on your specific system design. The LFXP2-30E-5FN672C requires 1.14V-1.26V core voltage, which differs from the original 2.3V-2.7V specification. System-level power architecture review is necessary.

Q: Does the LFXP2-30E-5FN672C support the same I/O voltage standards?

A: I/O voltage compatibility is not specified in the provided parameters. Detailed datasheet review is required to confirm I/O standard support for your application.

Q: What is the moisture sensitivity level for both devices?

A: Both the EPF10K200EFC672-1 and LFXP2-30E-5FN672C are rated MSL 3 (168 Hours), indicating identical moisture handling and storage requirements.

Q: Is the LFXP2-30E-5FN672C available in the same packaging options?

A: The LFXP2-30E-5FN672C is supplied in Tray packaging, while the original device packaging is not specified. Both use 672-FPBGA (27x27) package format for the same footprint compatibility.

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