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EPF10K200EFC672-1 Equivalent & Substitute Parts
Part Overview
The EPF10K200EFC672-1 is a FLEX-10KE® Field Programmable Gate Array (FPGA) from Intel, featuring 470 I/O pins and 9984 logic elements in a 672-BBGA package. This device is classified as obsolete, making equivalent substitute parts necessary for new designs and ongoing production requirements. The FLEX-10KE® series represents legacy FPGA technology; identifying compatible alternatives ensures design continuity and supply chain stability.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | EPF10K200EFC672-1 |
| Manufacturer | Intel |
| Series | FLEX-10KE® |
| Product Status | Obsolete |
| Number of Logic Elements/Cells | 9984 |
| Number of I/O | 470 |
| Total RAM Bits | 98304 |
| Number of Gates | 513000 |
| Voltage - Supply | 2.3V ~ 2.7V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package / Case | 672-BBGA |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution of the EPF10K200EFC672-1 is determined by the following critical parameters:
- Package Compatibility: Both devices must use 672-BBGA (27x27) package format to ensure PCB footprint compatibility and pin assignment alignment.
- I/O Pin Count: The substitute must provide a minimum of 470 I/O pins to maintain signal routing requirements.
- Logic Capacity: The substitute must provide sufficient logic elements to accommodate the original design's gate count and functional complexity.
- Embedded Memory: The substitute must provide adequate RAM bits for on-chip memory requirements.
- Supply Voltage: Operating voltage ranges must be compatible with existing power distribution infrastructure.
- Mounting Type: Surface mount technology must be maintained for manufacturing consistency.
The LFXP2-30E-5FN672C from Lattice Semiconductor Corporation meets these substitution criteria through equivalent package geometry, enhanced I/O capability, and superior logic density.
Parameter Comparison
| Parameter | EPF10K200EFC672-1 (Intel) | LFXP2-30E-5FN672C (Lattice) |
|---|---|---|
| Series | FLEX-10KE® | XP2 |
| Product Status | Obsolete | Active |
| Number of Logic Elements/Cells | 9984 | 29000 |
| Number of I/O | 470 | 472 |
| Total RAM Bits | 98304 | 396288 |
| Number of Gates | 513000 | Not specified |
| Voltage - Supply | 2.3V ~ 2.7V | 1.14V ~ 1.26V |
| Operating Temperature | 0°C ~ 70°C (TA) | 0°C ~ 85°C (TJ) |
| Package / Case | 672-BBGA | 672-BBGA |
| Supplier Device Package | 672-FBGA (27x27) | 672-FPBGA (27x27) |
| Mounting Type | Surface Mount | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| RoHS Status | Not specified | ROHS3 Compliant |
Engineering Selection Recommendations
The LFXP2-30E-5FN672C is the designated substitute for the obsolete EPF10K200EFC672-1. Selection is based on the following engineering factors:
- Active Product Status: The LFXP2-30E-5FN672C maintains active production status, ensuring long-term availability and supply chain reliability compared to the obsolete EPF10K200EFC672-1.
- Package Equivalence: Both devices utilize identical 672-BBGA (27x27) package geometry, enabling direct PCB footprint compatibility without layout redesign.
- I/O Compatibility: The LFXP2-30E-5FN672C provides 472 I/O pins, exceeding the original 470-pin requirement and accommodating existing signal routing.
- Enhanced Capacity: The substitute offers 29000 logic elements and 396288 RAM bits, providing design margin and supporting functional expansion beyond the original specification.
- Regulatory Compliance: The LFXP2-30E-5FN672C is ROHS3 compliant, meeting current environmental and regulatory requirements.
- Thermal Performance: Extended operating temperature range (0°C ~ 85°C) provides improved thermal margin compared to the original device.
Frequently Asked Questions (FAQ)
Q: Can the LFXP2-30E-5FN672C directly replace the EPF10K200EFC672-1 without PCB modifications?
A: Yes. Both devices use identical 672-BBGA (27x27) package geometry. PCB footprint and pin assignments are compatible, eliminating the need for layout redesign.
Q: What are the key differences between these two devices?
A: The primary differences are product status (obsolete vs. active), supply voltage (2.3V-2.7V vs. 1.14V-1.26V), logic capacity (9984 vs. 29000 elements), and embedded memory (98304 vs. 396288 bits). The LFXP2-30E-5FN672C provides enhanced performance and regulatory compliance.
Q: Is the lower supply voltage of the LFXP2-30E-5FN672C compatible with existing power distribution?
A: Power supply compatibility must be evaluated based on your specific system design. The LFXP2-30E-5FN672C requires 1.14V-1.26V core voltage, which differs from the original 2.3V-2.7V specification. System-level power architecture review is necessary.
Q: Does the LFXP2-30E-5FN672C support the same I/O voltage standards?
A: I/O voltage compatibility is not specified in the provided parameters. Detailed datasheet review is required to confirm I/O standard support for your application.
Q: What is the moisture sensitivity level for both devices?
A: Both the EPF10K200EFC672-1 and LFXP2-30E-5FN672C are rated MSL 3 (168 Hours), indicating identical moisture handling and storage requirements.
Q: Is the LFXP2-30E-5FN672C available in the same packaging options?
A: The LFXP2-30E-5FN672C is supplied in Tray packaging, while the original device packaging is not specified. Both use 672-FPBGA (27x27) package format for the same footprint compatibility.
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