EPF10K130EFC672-1 Equivalent & Substitute Parts

Part Overview

The EPF10K130EFC672-1 is a FLEX-10KE® Field Programmable Gate Array (FPGA) manufactured by Intel, featuring 413 I/O pins and 6656 logic elements in a 672-BBGA package. This device is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations where legacy compatibility is required.

Substiute Parts

EPF10K130EFC672-1

IntelIn Stock: 1339EPF10K130EFC672-1 Datasheet

Current PartRFQ

LFXP2-30E-5FN672C

Lattice Semiconductor CorporationIn Stock: 1224LFXP2-30E-5FN672C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the EPF10K130EFC672-1 is determined by the following critical parameters:

• Package Compatibility: Both devices must use the 672-BBGA (27x27) package to ensure mechanical and electrical pin compatibility on existing PCBs.
• I/O Pin Count: The substitute must provide a minimum of 413 I/O pins to maintain signal routing equivalence.
• Logic Element Capacity: The substitute must provide sufficient logic elements (minimum 6656) to accommodate the original design's functional requirements.
• Embedded Memory: The substitute must provide at least 65536 RAM bits for designs dependent on embedded memory resources.
• Voltage Supply: The substitute must operate within compatible voltage ranges to function with existing power delivery infrastructure.
• Operating Temperature Range: The substitute must support the required thermal operating window.

The LFXP2-30E-5FN672C from Lattice Semiconductor Corporation meets these substitution criteria through equivalent package geometry, enhanced I/O capacity (472 pins), superior logic element count (29000 elements), and increased embedded memory (396288 bits).

Parameter Comparison

Engineering Selection Recommendations

The LFXP2-30E-5FN672C is qualified as a direct substitute for the obsolete EPF10K130EFC672-1 based on the following engineering criteria:

• Package Geometry: Both devices utilize 672-pin ball grid array packages with identical 27x27mm footprints, ensuring PCB layout compatibility without redesign.
• Pin Count Equivalence: The substitute provides 472 I/O pins, exceeding the original 413-pin requirement, allowing full signal routing compatibility with potential for additional functionality.
• Logic Capacity: The substitute's 29000 logic elements substantially exceed the original 6656 elements, providing design margin and supporting future feature expansion.
• Embedded Memory: The substitute's 396288 RAM bits far exceed the original 65536 bits, accommodating memory-intensive applications without architectural changes.
• Active Product Status: The LFXP2-30E-5FN672C maintains active manufacturing status, ensuring long-term availability and supply chain stability compared to the obsolete EPF10K130EFC672-1.
• Compliance Certifications: The substitute is ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

Voltage Supply Consideration: The substitute operates at 1.14V ~ 1.26V versus the original 2.375V ~ 2.625V. Power delivery infrastructure and voltage regulation circuits must be evaluated and potentially redesigned to accommodate this lower supply voltage requirement.

Operating Temperature Range: The substitute supports 0°C ~ 85°C (TJ), providing a 15°C extended upper thermal limit compared to the original 0°C ~ 70°C (TA) specification, beneficial for applications in elevated ambient conditions.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-30E-5FN672C be used as a direct drop-in replacement for the EPF10K130EFC672-1?

A: The LFXP2-30E-5FN672C is mechanically compatible due to identical 672-BBGA package geometry. However, the different supply voltage (1.14V ~ 1.26V versus 2.375V ~ 2.625V) requires power delivery circuit modifications. HDL design files may require retargeting to the XP2 architecture, depending on design complexity and tool support.

Q: What are the key advantages of substituting to the LFXP2-30E-5FN672C?

A: The substitute provides significantly greater logic capacity (29000 versus 6656 elements), expanded embedded memory (396288 versus 65536 bits), additional I/O pins (472 versus 413), active product status with guaranteed availability, and ROHS3 compliance meeting current environmental standards.

Q: Are there any design constraints when migrating from EPF10K130EFC672-1 to LFXP2-30E-5FN672C?

A: Primary constraints include voltage supply redesign (lower voltage requirement), potential HDL retargeting to XP2 architecture, and thermal management evaluation due to extended operating temperature range. Pin assignment verification is required despite package compatibility.

Q: What is the moisture sensitivity level for both devices?

A: Both the EPF10K130EFC672-1 and LFXP2-30E-5FN672C are classified as MSL 3 (168 Hours), requiring identical moisture control and handling procedures during storage, transportation, and assembly.

Q: How do the operating temperature ranges compare?

A: The EPF10K130EFC672-1 operates from 0°C ~ 70°C (TA), while the LFXP2-30E-5FN672C operates from 0°C ~ 85°C (TJ). The substitute provides 15°C additional thermal headroom, suitable for applications requiring extended temperature operation.

Q: Is the LFXP2-30E-5FN672C available in the same packaging format?

A: Both devices use 672-pin ball grid array packages with identical 27x27mm footprints. The EPF10K130EFC672-1 uses BBGA packaging, while the LFXP2-30E-5FN672C uses FPBGA packaging. Both are mechanically and electrically compatible on the same PCB layout.