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EPF10K10ATC100-1 Equivalent & Substitute Parts
Part Overview
The EPF10K10ATC100-1 is a FLEX-10KA® Field Programmable Gate Array (FPGA) IC manufactured by Intel, featuring 66 I/O pins in a 100-TQFP package. This device integrates 576 logic elements, 6144 RAM bits, and 31,000 gates for embedded programmable logic applications. The product is currently obsolete, making equivalent substitute parts necessary for ongoing system support, maintenance, and new design implementations where legacy compatibility is required.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | EPF10K10ATC100-1 |
| Manufacturer | Intel |
| Series | FLEX-10KA® |
| Category | Embedded |
| Package / Case | 100-TQFP |
| Number of I/O | 66 |
| Number of Logic Elements/Cells | 576 |
| Total RAM Bits | 6144 |
| Number of Gates | 31,000 |
| Voltage - Supply | 3V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution of the EPF10K10ATC100-1 is determined by the following critical parameters:
Package Compatibility: Both the main part and substitute must use a 100-pin TQFP/VQFP package format (14x14mm) to ensure PCB footprint compatibility and pin assignment alignment.
I/O Pin Count: The substitute must provide a minimum of 66 I/O pins to maintain signal routing capability. The XC3S50A-4VQG100C provides 68 I/O pins, meeting this requirement.
Logic Capacity: The substitute must provide sufficient logic elements to accommodate the original design. The EPF10K10ATC100-1 contains 576 logic elements; the XC3S50A-4VQG100C provides 1584 logic elements, offering increased capacity.
Memory Resources: The substitute must provide adequate embedded RAM. The EPF10K10ATC100-1 contains 6144 RAM bits; the XC3S50A-4VQG100C provides 55,296 RAM bits, exceeding the original specification.
Mounting Type: Both parts use surface mount technology, ensuring assembly process compatibility.
Moisture Sensitivity: Both parts share MSL 3 classification, requiring identical handling and storage protocols.
Parameter Comparison
| Parameter | EPF10K10ATC100-1 | XC3S50A-4VQG100C |
|---|---|---|
| Manufacturer | Intel | AMD |
| Series | FLEX-10KA® | Spartan®-3A |
| Package / Case | 100-TQFP | 100-VQFP |
| Number of I/O | 66 | 68 |
| Number of Logic Elements/Cells | 576 | 1584 |
| Total RAM Bits | 6144 | 55,296 |
| Number of Gates | 31,000 | 50,000 |
| Voltage - Supply | 3V ~ 3.6V | 1.14V ~ 1.26V |
| Operating Temperature | 0°C ~ 70°C (TA) | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Obsolete | Last Time Buy |
Engineering Selection Recommendations
The XC3S50A-4VQG100C serves as a functional substitute for the obsolete EPF10K10ATC100-1 based on the following engineering criteria:
Package Compatibility: Both devices use 100-pin TQFP/VQFP packages with identical 14x14mm footprints, enabling direct PCB layout compatibility without redesign.
I/O Capacity: The XC3S50A-4VQG100C provides 68 I/O pins compared to the original 66 pins, maintaining signal routing capability with additional I/O availability.
Logic Resources: The substitute provides 1584 logic elements versus the original 576, offering 2.75x greater logic capacity for design flexibility and future enhancements.
Memory Resources: The XC3S50A-4VQG100C provides 55,296 RAM bits compared to 6144 bits in the original, delivering 9x greater embedded memory capacity.
Moisture Sensitivity: Both parts share MSL 3 classification, requiring identical handling protocols during storage and assembly.
Product Status Consideration: The EPF10K10ATC100-1 is obsolete, while the XC3S50A-4VQG100C is Last Time Buy status, providing a defined procurement window for design transitions.
Compliance: The XC3S50A-4VQG100C is RoHS3 compliant, meeting current environmental and regulatory standards.
Frequently Asked Questions (FAQ)
Q: Can the XC3S50A-4VQG100C directly replace the EPF10K10ATC100-1 without PCB modifications?
A: The 100-pin TQFP and 100-pin VQFP packages share identical 14x14mm footprints and pin spacing, enabling direct PCB compatibility. However, design implementation differences between FLEX-10KA® and Spartan®-3A architectures require HDL code adaptation and re-compilation.
Q: What are the key differences in electrical specifications between these parts?
A: The primary difference is supply voltage: the EPF10K10ATC100-1 operates at 3V–3.6V, while the XC3S50A-4VQG100C operates at 1.14V–1.26V. This requires separate power supply design and may necessitate level-shifting circuitry for I/O interfacing with 3.3V logic.
Q: Does the increased logic capacity of the XC3S50A-4VQG100C affect compatibility?
A: Increased logic elements (1584 vs. 576) and RAM bits (55,296 vs. 6144) provide design headroom but do not affect pin-level compatibility. The substitute can accommodate the original design with additional resources available for future expansion.
Q: Are there any moisture sensitivity or handling differences?
A: Both parts share MSL 3 classification (168 hours), requiring identical moisture control protocols during storage, handling, and assembly. No additional precautions are necessary.
Q: What is the significance of the product status difference?
A: The EPF10K10ATC100-1 is obsolete and no longer manufactured. The XC3S50A-4VQG100C is Last Time Buy status, indicating a defined procurement window before discontinuation. Long-term availability planning is recommended.
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