EP3SL70F780I4N Equivalent & Substitute Parts

Part Overview

The EP3SL70F780I4N is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, featuring 488 I/O pins, 67,500 logic elements, and 2,699,264 total RAM bits in a 780-FBGA package. This device is classified as obsolete, which necessitates identification of functionally equivalent alternatives for ongoing system support and new design implementations. The substitute part EP3SL70F780I4G maintains identical core functionality while offering active product status and improved availability.

Substiute Parts

EP3SL70F780I4N

IntelIn Stock: 1168EP3SL70F780I4N Datasheet

Current PartRFQ

EP3SL70F780I4G

IntelIn Stock: 1096EP3SL70F780I4G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution between EP3SL70F780I4N and EP3SL70F780I4G is based on strict equivalence of the following parameters:

• Base product number (EP3SL70) ensures identical core architecture and logic capacity
• Logic element count (67,500) and I/O count (488) guarantee functional compatibility
• RAM capacity (2,699,264 bits) remains unchanged
• Supply voltage range (0.86V ~ 1.15V) and operating temperature range (-40°C ~ 100°C) are identical
• Package specification (780-FBGA, 29x29mm) ensures mechanical and electrical pin compatibility
• RoHS compliance and MSL rating (3) are maintained across both parts

The primary distinction is product status: EP3SL70F780I4N is obsolete, while EP3SL70F780I4G maintains active status. The packaging designation difference (tray vs. standard) reflects distribution format only and does not affect functional equivalence.

Parameter Comparison

Engineering Selection Recommendations

EP3SL70F780I4G is the direct functional equivalent for EP3SL70F780I4N applications. Selection of EP3SL70F780I4G is supported by:

• Identical electrical and logical specifications across all core parameters
• Active product status ensuring continued availability and supply chain support
• Maintained RoHS compliance and regulatory classification (ECCN 3A001A2C, HTSUS 8542.39.0001)
• Equivalent MSL rating (3) confirming identical moisture handling requirements
• Pin-compatible 780-FBGA package maintaining PCB layout compatibility

For systems currently using EP3SL70F780I4N, transition to EP3SL70F780I4G requires no design modifications. Existing firmware and bitstream configurations remain valid without alteration.

Frequently Asked Questions (FAQ)

Q: Are EP3SL70F780I4N and EP3SL70F780I4G pin-compatible?

A: Yes. Both devices use the 780-FBGA (29x29mm) package with 488 I/O pins in identical positions. PCB layouts designed for either part are interchangeable.

Q: Can I use EP3SL70F780I4G as a direct replacement in existing designs?

A: Yes. All electrical parameters, logic capacity, memory configuration, and operating ranges are identical. No design changes are required.

Q: What is the difference between the two part numbers?

A: The primary difference is product status. EP3SL70F780I4N is obsolete, while EP3SL70F780I4G maintains active status. The packaging designation (tray vs. standard) reflects distribution format only.

Q: Are the supply voltage and operating temperature ranges the same?

A: Yes. Both parts operate at 0.86V ~ 1.15V supply voltage and -40°C ~ 100°C junction temperature.

Q: Do both parts have the same RAM capacity and logic element count?

A: Yes. Both devices contain 67,500 logic elements and 2,699,264 total RAM bits.

Q: Are there any compliance or regulatory differences?

A: No. Both parts maintain identical RoHS compliance, MSL rating (3), ECCN classification (3A001A2C), and HTSUS code (8542.39.0001).

Q: Which part should I specify for new designs?

A: EP3SL70F780I4G should be specified for new designs due to active product status and assured long-term availability.