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EP3SL70F780C4 Equivalent & Substitute Parts
Part Overview
The EP3SL70F780C4 is a Stratix® III L Field Programmable Gate Array (FPGA) IC featuring 488 I/O pins in a 780-FBGA package. This component delivers 67,500 logic elements and 2,699,264 total RAM bits for embedded applications requiring high-density programmable logic. The part is currently classified as obsolete, making identification of compatible alternatives essential for ongoing system support and procurement planning.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | EP3SL70F780C4 |
| Manufacturer | Intel |
| Series | Stratix® III L |
| Number of Logic Elements | 67,500 |
| Total RAM Bits | 2,699,264 |
| Number of I/O | 488 |
| Voltage - Supply | 0.86V ~ 1.15V |
| Package / Case | 780-BBGA, FCBGA |
| Supplier Device Package | 780-FBGA (29x29) |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution eligibility for the EP3SL70F780C4 is determined by strict equivalence across the following critical parameters:
- Logic Element Count: 67,500 elements (exact match required)
- RAM Capacity: 2,699,264 bits (exact match required)
- I/O Pin Count: 488 pins (exact match required)
- Package Type: 780-FBGA (29x29) (exact match required)
- Supply Voltage Range: 0.86V ~ 1.15V (exact match required)
- Operating Temperature Range: 0°C ~ 85°C (exact match required)
- Series Family: Stratix® III L (exact match required)
The EP3SL70F780C4G qualifies as a direct substitute based on identical electrical specifications, logic density, memory configuration, and physical packaging. The primary distinction is product status and packaging format.
Parameter Comparison
| Parameter | EP3SL70F780C4 (Main Part) | EP3SL70F780C4G (Substitute) |
|---|---|---|
| Manufacturer | Intel | Intel |
| Series | Stratix® III L | Stratix® III L |
| Number of Logic Elements | 67,500 | 67,500 |
| Total RAM Bits | 2,699,264 | 2,699,264 |
| Number of I/O | 488 | 488 |
| Voltage - Supply | 0.86V ~ 1.15V | 0.86V ~ 1.15V |
| Package / Case | 780-BBGA, FCBGA | 780-BBGA, FCBGA |
| Supplier Device Package | 780-FBGA (29x29) | 780-FBGA (29x29) |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | RoHS Compliant | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Obsolete | Active |
| Packaging Format | Tube | Tray |
Engineering Selection Recommendations
The EP3SL70F780C4G is a direct functional equivalent to the EP3SL70F780C4. Both parts share identical electrical characteristics, logic density, memory configuration, and physical package specifications. The EP3SL70F780C4G carries active product status, whereas the main part is classified as obsolete. Both parts maintain RoHS compliance and equivalent moisture sensitivity ratings.
Selection between these parts should be based on procurement availability and packaging requirements. The EP3SL70F780C4G is supplied in tray packaging, while the main part uses tube packaging. No functional or electrical differences exist between these variants.
Frequently Asked Questions (FAQ)
Q: Can EP3SL70F780C4G replace EP3SL70F780C4 in existing designs?
A: Yes. Both parts are electrically and functionally identical across all specified parameters, including logic element count, RAM capacity, I/O pin configuration, supply voltage, operating temperature range, and package dimensions.
Q: What is the difference between the two part numbers?
A: The primary difference is product status and packaging format. EP3SL70F780C4 is obsolete and supplied in tube packaging. EP3SL70F780C4G is active and supplied in tray packaging. Electrical and functional specifications are identical.
Q: Are there any compatibility concerns with the 780-FBGA package?
A: No. Both parts use the identical 780-FBGA (29x29) package with 488 I/O pins. PCB footprints, solder reflow profiles, and thermal management requirements are equivalent.
Q: Does the packaging format affect performance or reliability?
A: No. Packaging format (tube versus tray) affects only handling and storage logistics. Electrical performance, reliability, and functional characteristics remain unchanged.
Q: Are both parts RoHS compliant?
A: Yes. Both EP3SL70F780C4 and EP3SL70F780C4G are RoHS compliant with identical moisture sensitivity levels (MSL 3, 168 hours).
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