EP3SL70F780C3N Equivalent & Substitute Parts

Part Overview

The EP3SL70F780C3N is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, featuring 488 I/O pins in a 780-FBGA package. This device is classified as obsolete, making substitute parts necessary for new designs or when inventory becomes unavailable. The part delivers 67,500 logic elements and 2,699,264 total RAM bits, operating at 0.86V to 1.15V supply voltage across a 0°C to 85°C temperature range. Identifying compatible alternatives ensures design continuity and supply chain flexibility.

Substiute Parts

EP3SL70F780C3N
IntelIn Stock: 1717EP3SL70F780C3N Datasheet
EP3SL70F780C3N
Current Part
EP3SL70F780C3G
IntelIn Stock: 836EP3SL70F780C3G Datasheet
EP3SL70F780C3G
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Key Parameters

Parameter Value
Manufacturer Intel
Series Stratix® III L
Number of Logic Elements 67,500
Number of I/O 488
Total RAM Bits 2,699,264
Voltage - Supply 0.86V ~ 1.15V
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Operating Temperature 0°C ~ 85°C (TJ)
Mounting Type Surface Mount
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the EP3SL70F780C3N is determined by strict equivalence across the following critical parameters:

  • Series and Base Product Number: Both parts must belong to the Stratix® III L series with base product number EP3SL70
  • Logic Elements and RAM: Identical count of 67,500 logic elements and 2,699,264 RAM bits
  • I/O Pin Count: Both parts maintain 488 I/O pins
  • Package Type: Identical 780-FBGA (29x29) package configuration
  • Electrical Specifications: Matching voltage supply range (0.86V ~ 1.15V) and operating temperature (0°C ~ 85°C)
  • Mounting and Compliance: Surface mount configuration with RoHS compliance and MSL rating of 3

The EP3SL70F780C3G qualifies as a direct substitute based on complete alignment with these parameters. The primary distinction is product status and packaging format.

Parameter Comparison

Parameter EP3SL70F780C3N EP3SL70F780C3G
Manufacturer Intel Intel
Series Stratix® III L Stratix® III L
Number of Logic Elements 67,500 67,500
Number of I/O 488 488
Total RAM Bits 2,699,264 2,699,264
Voltage - Supply 0.86V ~ 1.15V 0.86V ~ 1.15V
Package / Case 780-BBGA, FCBGA 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29) 780-FBGA (29x29)
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Mounting Type Surface Mount Surface Mount
RoHS Status RoHS Compliant RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active
Packaging Format Bulk Tray

Engineering Selection Recommendations

The EP3SL70F780C3G is the qualified substitute for the EP3SL70F780C3N. Selection between these parts should be based on the following criteria:

EP3SL70F780C3G is the preferred choice for new designs and ongoing production. This part carries Active product status, ensuring continued manufacturer support and availability. It maintains full electrical and functional equivalence to the EP3SL70F780C3N while offering superior supply chain stability. The Tray packaging format provides standard handling and storage benefits for production environments.

EP3SL70F780C3N remains suitable for legacy system maintenance and repair applications where existing inventory is available. The Obsolete status indicates no new production; selection of this part should be limited to situations where design compatibility with existing systems is mandatory.

Both parts satisfy RoHS compliance requirements and maintain identical MSL ratings, ensuring equivalent handling and storage protocols.

Frequently Asked Questions (FAQ)

Q: Can EP3SL70F780C3G replace EP3SL70F780C3N in existing designs?

A: Yes. The EP3SL70F780C3G is a direct functional and electrical equivalent. All critical parameters—logic elements, I/O count, RAM capacity, voltage specifications, package type, and operating temperature range—are identical. No design modifications are required.

Q: What is the difference between these two part numbers?

A: The primary differences are product status and packaging format. The EP3SL70F780C3N is Obsolete and supplied in bulk packaging, while the EP3SL70F780C3G is Active and supplied in Tray packaging. Electrical and functional specifications are identical.

Q: Are there any package compatibility concerns?

A: No. Both parts use the identical 780-FBGA (29x29) package configuration. PCB footprints, solder reflow profiles, and mechanical mounting requirements are equivalent.

Q: What does the Obsolete status mean for the EP3SL70F780C3N?

A: Obsolete status indicates that Intel has discontinued production of this part. New inventory may be available from authorized distributors, but long-term availability cannot be guaranteed. For new designs, the Active EP3SL70F780C3G is recommended.

Q: Are moisture sensitivity and handling requirements the same?

A: Yes. Both parts carry MSL rating 3 (168 Hours), requiring identical storage, handling, and reflow procedures. No additional precautions are necessary when substituting between these parts.

Q: Can I use these parts interchangeably in production?

A: Yes, provided that supply and product status considerations are addressed. From a technical standpoint, the parts are fully interchangeable. Production planning should prioritize the Active EP3SL70F780C3G for continuity.

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