EP3SL50F484C4N Equivalent & Substitute Parts

Part Overview

The EP3SL50F484C4N is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 47,500 logic elements, 2,184,192 RAM bits, and 296 I/O pins in a 484-FBGA package. The main part is currently listed as obsolete, making substitute parts necessary for ongoing system support and new design implementations where this architecture remains applicable.

Substiute Parts

EP3SL50F484C4N

IntelIn Stock: 1311EP3SL50F484C4N Datasheet

Current PartRFQ

EP3SL50F484C4G

IntelIn Stock: 1055EP3SL50F484C4G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the EP3SL50F484C4N is determined by strict equivalence across the following critical parameters:

• Logic Architecture: Identical Stratix® III L series platform
• Logic Element Count: 47,500 elements (no variation)
• RAM Capacity: 2,184,192 bits (no variation)
• I/O Pin Count: 296 pins (no variation)
• Package Type: 484-FBGA (23x23) form factor
• Supply Voltage Range: 0.86V ~ 1.15V
• Operating Temperature Range: 0°C ~ 85°C (TJ)
• Mounting Technology: Surface Mount, BGA
• Compliance Standards: RoHS Compliant, MSL 3

The substitute part EP3SL50F484C4G maintains identical electrical and mechanical specifications, with the primary distinction being packaging format (Tray vs. standard packaging) and active product status.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL50F484C4G is a direct functional equivalent to the EP3SL50F484C4N. Both devices share identical electrical specifications, logic capacity, memory configuration, I/O count, and thermal operating range. The primary distinction is product lifecycle status: the EP3SL50F484C4G maintains active product status, ensuring continued availability and supply chain support.

For new designs or system refreshes, the EP3SL50F484C4G is the appropriate selection. Both parts maintain RoHS compliance and identical MSL ratings, supporting equivalent handling and storage requirements. The packaging format difference (Tray for the substitute) does not affect functional performance or PCB integration.

Frequently Asked Questions (FAQ)

Q: Are EP3SL50F484C4N and EP3SL50F484C4G pin-compatible?

A: Yes. Both devices use the 484-FBGA (23x23) package with identical pinout, voltage specifications, and I/O configuration. Direct PCB substitution is supported without layout modifications.

Q: What is the difference between these two part numbers?

A: The primary difference is product status and packaging format. The EP3SL50F484C4N is obsolete; the EP3SL50F484C4G is active. Electrical and mechanical specifications are identical.

Q: Can I use EP3SL50F484C4G in existing designs specified for EP3SL50F484C4N?

A: Yes. The substitute part maintains identical logic architecture, I/O configuration, supply voltage range, and operating temperature specifications. No design changes are required.

Q: Are there any compliance or certification differences?

A: Both parts are RoHS Compliant with MSL 3 rating. Compliance profiles are equivalent.

Q: What is the significance of the packaging format difference?

A: Packaging format (Tray vs. standard) affects supply chain handling and bulk ordering but does not impact electrical performance, thermal characteristics, or PCB integration.