EP3SL50F484C4 Equivalent & Substitute Parts

Part Overview

The EP3SL50F484C4 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, featuring 296 I/O pins in a 484-FBGA package. This device is classified as obsolete, which necessitates identification of functionally equivalent alternatives for ongoing system support and new design implementations. The part delivers 47,500 logic elements and 2,184,192 bits of embedded RAM, suitable for embedded applications requiring high-density programmable logic.

Substiute Parts

EP3SL50F484C4
IntelIn Stock: 1158EP3SL50F484C4 Datasheet
EP3SL50F484C4
Current Part
EP3SL50F484C4G
IntelIn Stock: 1055EP3SL50F484C4G Datasheet
EP3SL50F484C4G
Direct

Key Parameters

Parameter Value
Manufacturer Intel
Series Stratix® III L
Number of Logic Elements 47,500
Total RAM Bits 2,184,192
Number of I/O 296
Package Type 484-FBGA (23x23)
Voltage Supply Range 0.86V ~ 1.15V
Operating Temperature 0°C ~ 85°C (TJ)
Mounting Type Surface Mount
RoHS Status RoHS Compliant
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the EP3SL50F484C4 is determined by strict equivalence across the following critical parameters:

  • Series and Architecture: Both parts must belong to the Stratix® III L family to ensure design compatibility
  • Logic Element Count: 47,500 logic elements (fixed requirement)
  • Embedded RAM Capacity: 2,184,192 bits (fixed requirement)
  • I/O Pin Count: 296 I/O pins (fixed requirement)
  • Package Specification: 484-FBGA (23x23) form factor (fixed requirement)
  • Voltage Supply Range: 0.86V ~ 1.15V (fixed requirement)
  • Operating Temperature Range: 0°C ~ 85°C (fixed requirement)
  • RoHS Compliance: RoHS Compliant status (fixed requirement)

The EP3SL50F484C4G qualifies as a direct substitute based on identical electrical specifications, logic density, memory capacity, I/O configuration, and package dimensions. The primary distinction is product status and packaging format.

Parameter Comparison

Parameter EP3SL50F484C4 EP3SL50F484C4G
Manufacturer Intel Intel
Series Stratix® III L Stratix® III L
Number of Logic Elements 47,500 47,500
Number of LABs/CLBs 1,900 1,900
Total RAM Bits 2,184,192 2,184,192
Number of I/O 296 296
Package / Case 484-BBGA, FCBGA 484-BBGA, FCBGA
Supplier Device Package 484-FBGA (23x23) 484-FBGA (23x23)
Voltage - Supply 0.86V ~ 1.15V 0.86V ~ 1.15V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Mounting Type Surface Mount Surface Mount
RoHS Status RoHS Compliant RoHS Compliant
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active
Packaging Format Tube Tray

Engineering Selection Recommendations

The EP3SL50F484C4G is the direct equivalent substitute for the EP3SL50F484C4. Both parts maintain identical electrical characteristics, logic density, memory configuration, and physical package specifications. The EP3SL50F484C4G carries Active product status, ensuring continued availability and supply chain support compared to the Obsolete status of the original part. Both devices are RoHS Compliant and carry equivalent moisture sensitivity ratings. The packaging format differs (Tray versus Tube), which may affect procurement and handling procedures but does not impact electrical or functional compatibility.

Frequently Asked Questions (FAQ)

Q: Can the EP3SL50F484C4G be used as a direct replacement for the EP3SL50F484C4?

A: Yes. Both parts are electrically and functionally identical, with matching logic element counts (47,500), embedded RAM capacity (2,184,192 bits), I/O pin configuration (296), package type (484-FBGA 23x23), voltage supply range (0.86V ~ 1.15V), and operating temperature range (0°C ~ 85°C). Design modifications are not required.

Q: What is the primary difference between these two part numbers?

A: The EP3SL50F484C4G is the Active production variant, while the EP3SL50F484C4 is classified as Obsolete. The packaging format also differs: the original uses Tube packaging, while the substitute uses Tray packaging.

Q: Are there any compliance or certification differences?

A: Both parts are RoHS Compliant with identical Moisture Sensitivity Level ratings (MSL 3, 168 Hours). No compliance gaps exist between the two variants.

Q: Does the packaging format change affect PCB assembly?

A: Packaging format (Tray versus Tube) affects component handling, storage, and pick-and-place machine compatibility during assembly. Electrical and mechanical fit on the PCB remain unchanged. Verify your assembly process compatibility with Tray-packaged components.

Q: Are the pin configurations identical?

A: Yes. Both parts feature 296 I/O pins in the 484-FBGA (23x23) package with identical pinout and electrical specifications.

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