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EP3SL50F484C2N Equivalent & Substitute Parts
Part Overview
The EP3SL50F484C2N is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 47,500 logic elements, 2,184,192 RAM bits, and 296 I/O pins in a 484-FBGA package. The part is currently classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support, design updates, and procurement planning.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | EP3SL50F484C2N |
| Manufacturer | Intel |
| Series | Stratix® III L |
| Number of Logic Elements | 47,500 |
| Total RAM Bits | 2,184,192 |
| Number of I/O | 296 |
| Voltage - Supply | 0.86V ~ 1.15V |
| Package / Case | 484-BBGA, FCBGA |
| Supplier Device Package | 484-FBGA (23x23) |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution of the EP3SL50F484C2N is determined by strict equivalence across the following critical parameters:
- Logic Architecture: Identical Stratix® III L series platform
- Logic Element Count: 47,500 elements (no variation permitted)
- Memory Configuration: 2,184,192 RAM bits (exact match required)
- I/O Pin Count: 296 I/O pins (functional compatibility requirement)
- Supply Voltage Range: 0.86V ~ 1.15V (electrical compatibility)
- Package Specification: 484-FBGA (23x23) form factor (mechanical and thermal compatibility)
- Operating Temperature Range: 0°C ~ 85°C (TJ) (thermal envelope)
- Mounting Technology: Surface Mount (PCB assembly compatibility)
- Environmental Compliance: RoHS Compliant status (regulatory requirement)
The EP3SL50F484C2G qualifies as a direct substitute based on identical performance across all these parameters. The primary distinction is product status and packaging format, which do not affect functional or electrical compatibility.
Parameter Comparison
| Parameter | EP3SL50F484C2N | EP3SL50F484C2G | Match |
|---|---|---|---|
| Manufacturer | Intel | Intel | ✓ |
| Series | Stratix® III L | Stratix® III L | ✓ |
| Number of Logic Elements | 47,500 | 47,500 | ✓ |
| Total RAM Bits | 2,184,192 | 2,184,192 | ✓ |
| Number of I/O | 296 | 296 | ✓ |
| Voltage - Supply | 0.86V ~ 1.15V | 0.86V ~ 1.15V | ✓ |
| Package / Case | 484-BBGA, FCBGA | 484-BBGA, FCBGA | ✓ |
| Supplier Device Package | 484-FBGA (23x23) | 484-FBGA (23x23) | ✓ |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) | ✓ |
| Mounting Type | Surface Mount | Surface Mount | ✓ |
| RoHS Status | RoHS Compliant | RoHS Compliant | ✓ |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) | ✓ |
| Product Status | Obsolete | Active | Different |
| Packaging Format | Tube | Tray | Different |
Engineering Selection Recommendations
The EP3SL50F484C2G is a direct functional equivalent to the EP3SL50F484C2N. Selection between these parts should be based on the following factors:
Product Status: The EP3SL50F484C2G carries Active product status, ensuring continued manufacturer support, availability, and compliance documentation. The EP3SL50F484C2N is classified as Obsolete, indicating discontinued production and limited long-term availability.
Regulatory Compliance: Both parts maintain RoHS Compliant certification. The EP3SL50F484C2G includes REACH Unaffected status, providing additional environmental compliance assurance for applications subject to REACH regulations.
Packaging and Logistics: The EP3SL50F484C2N is supplied in tube packaging, while the EP3SL50F484C2G is supplied in tray packaging. Packaging format selection depends on assembly process requirements and inventory management practices but does not affect electrical or functional performance.
Availability and Supply Chain: The EP3SL50F484C2G is recommended for new designs and ongoing production due to active status and documented availability. For legacy system maintenance where the EP3SL50F484C2N is already deployed, the EP3SL50F484C2G provides seamless compatibility without design modification.
Frequently Asked Questions (FAQ)
Q: Can the EP3SL50F484C2G be used as a direct replacement for the EP3SL50F484C2N in existing designs?
A: Yes. Both parts are electrically and functionally identical across all critical parameters: logic element count, memory configuration, I/O pin count, supply voltage, package specification, and operating temperature range. No design modifications are required for substitution.
Q: What is the difference between the EP3SL50F484C2N and EP3SL50F484C2G?
A: The primary differences are product status and packaging format. The EP3SL50F484C2N is obsolete and supplied in tube packaging. The EP3SL50F484C2G is active and supplied in tray packaging. All electrical and functional specifications are identical.
Q: Why is the EP3SL50F484C2N classified as obsolete?
A: Obsolete status indicates that Intel has discontinued production of this part number. The EP3SL50F484C2G remains in active production as the current equivalent offering.
Q: Are there any thermal or electrical differences between these parts?
A: No. Both parts operate within the identical supply voltage range (0.86V ~ 1.15V) and temperature range (0°C ~ 85°C TJ). Thermal characteristics and electrical performance are equivalent.
Q: Does the packaging format (tube vs. tray) affect performance or compatibility?
A: No. Packaging format is a logistics and assembly consideration only. It does not affect electrical performance, thermal characteristics, or functional compatibility. Selection depends on assembly process requirements and inventory management practices.
Q: Are both parts RoHS compliant?
A: Yes. Both the EP3SL50F484C2N and EP3SL50F484C2G are RoHS Compliant. The EP3SL50F484C2G additionally carries REACH Unaffected status.
Q: What is the Moisture Sensitivity Level (MSL) for these parts?
A: Both parts have MSL 3 (168 Hours), indicating standard moisture handling requirements for surface mount assembly processes.
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