EP3SL200H780C2 Equivalent & Substitute Parts

Part Overview

The EP3SL200H780C2 is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 200,000 logic elements, 488 I/O pins, and 10,901,504 total RAM bits in a 780-BBGA/FCBGA package. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support, design updates, and procurement planning.

Substiute Parts

EP3SL200H780C2

IntelIn Stock: 1029EP3SL200H780C2 Datasheet

Current PartRFQ

EP3SL200H780C2G

IntelIn Stock: 1059EP3SL200H780C2G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the EP3SL200H780C2 is determined by the following critical parameters:

• Base Product Number: EP3SL200 (defines the core logic and memory architecture)
• Package Type: 780-BBGA/FCBGA (ensures PCB footprint and pin compatibility)
• I/O Count: 488 pins (maintains system interface requirements)
• Logic Elements: 200,000 (preserves design capacity)
• Total RAM Bits: 10,901,504 (ensures memory resource availability)
• Supply Voltage Range: 0.86V ~ 1.15V (confirms power delivery compatibility)
• Operating Temperature Range: 0°C ~ 85°C (validates thermal envelope)
• RoHS Compliance: Required for regulatory alignment
• Moisture Sensitivity Level: 3 (168 Hours) (specifies handling and storage requirements)

Substitute parts must match all these parameters to ensure functional and mechanical compatibility without design modification.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL200H780C2G is a direct functional equivalent to the EP3SL200H780C2. Both devices share identical electrical specifications, logic capacity, I/O configuration, and package geometry. The primary distinction is product status: the EP3SL200H780C2 is obsolete, while the EP3SL200H780C2G maintains active status with current manufacturing support.

For new designs or system updates, the EP3SL200H780C2G is the appropriate selection due to its active product status and availability. Both parts maintain RoHS compliance and identical moisture sensitivity requirements, ensuring regulatory and handling consistency. The EP3SL200H780C2G is supplied in Tray packaging, which is standard for production environments.

Frequently Asked Questions (FAQ)

Q: Can EP3SL200H780C2G replace EP3SL200H780C2 in existing designs?

A: Yes. Both parts are electrically and mechanically identical. The EP3SL200H780C2G provides the same logic capacity, I/O configuration, supply voltage range, and operating temperature specifications. No design modifications are required for substitution.

Q: What is the difference between these two part numbers?

A: The primary difference is product lifecycle status. The EP3SL200H780C2 is obsolete, while the EP3SL200H780C2G is active. The suffix "G" in the EP3SL200H780C2G designation indicates the active variant. Both parts are functionally equivalent.

Q: Are the package dimensions identical?

A: Yes. Both parts use the 780-BBGA/FCBGA package with identical footprint and pin configuration (33x33 mm). PCB layouts designed for one part are directly compatible with the other.

Q: Do both parts have the same moisture sensitivity requirements?

A: Yes. Both the EP3SL200H780C2 and EP3SL200H780C2G have Moisture Sensitivity Level 3 (168 Hours), requiring identical handling, storage, and reflow procedures.

Q: Which part should be specified for new procurement?

A: The EP3SL200H780C2G should be specified for new orders due to its active product status and current manufacturing availability. This ensures supply chain continuity and access to manufacturer support.

Q: Are both parts RoHS compliant?

A: Yes. Both the EP3SL200H780C2 and EP3SL200H780C2G are RoHS compliant, meeting regulatory requirements for hazardous substance restrictions.