EP3SL200F1152C3 Equivalent & Substitute Parts

Part Overview

The EP3SL200F1152C3 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 200,000 logic elements, 744 I/O pins, and 10.9 MB of embedded RAM in a 1152-FBGA package. The part is currently obsolete, making equivalent and substitute parts essential for legacy system maintenance, design updates, and procurement continuity.

Substiute Parts

EP3SL200F1152C3

IntelIn Stock: 2034EP3SL200F1152C3 Datasheet

Current PartRFQ

EP3SL200F1152C3G

IntelIn Stock: 989EP3SL200F1152C3G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution for the EP3SL200F1152C3 is determined by strict equivalence across the following critical parameters:

• Base Product Number: EP3SL200 (core device designation)
• Logic Element Count: 200,000 (functional capacity requirement)
• I/O Pin Count: 744 (interface requirement)
• Package Type: 1152-FBGA (physical and electrical compatibility)
• Voltage Supply Range: 0.86V ~ 1.15V (power delivery compatibility)
• Operating Temperature Range: 0°C ~ 85°C (thermal operating envelope)
• RoHS Compliance: Required for regulatory alignment
• Moisture Sensitivity Level: 3 (168 Hours) (handling and storage requirements)

The substitute part EP3SL200F1152C3G maintains identical electrical and mechanical specifications while differing only in packaging format (Tray vs. standard packaging) and product status (Active vs. Obsolete).

Parameter Comparison

Engineering Selection Recommendations

The EP3SL200F1152C3G is a direct functional equivalent to the EP3SL200F1152C3. Both devices share identical electrical specifications, logic capacity, I/O configuration, and thermal operating parameters. The primary distinction is product status: the EP3SL200F1152C3G is currently Active, while the main part is Obsolete.

For new designs or system updates, the EP3SL200F1152C3G is the appropriate selection due to its Active status and continued manufacturer support. Both parts maintain RoHS Compliance and identical Moisture Sensitivity Level (MSL) ratings, ensuring regulatory and handling compatibility.

The packaging format difference (Tray for the substitute) does not affect electrical or mechanical compatibility and is a supply chain consideration only.

Frequently Asked Questions (FAQ)

Q: Can EP3SL200F1152C3G replace EP3SL200F1152C3 in existing designs?

A: Yes. Both devices are electrically and mechanically identical across all critical parameters: logic element count, I/O configuration, voltage supply range, operating temperature, package type, and compliance certifications. The substitute is a direct replacement.

Q: What is the difference between the two part numbers?

A: The primary difference is product status. EP3SL200F1152C3 is Obsolete, while EP3SL200F1152C3G is Active. The "G" suffix indicates the Active variant with continued manufacturer availability. Packaging format differs (Tray vs. standard), but this does not affect device functionality or compatibility.

Q: Are there any thermal or power supply differences?

A: No. Both parts operate within the identical voltage supply range (0.86V ~ 1.15V) and temperature envelope (0°C ~ 85°C TJ). Thermal and power delivery requirements are equivalent.

Q: Do both parts meet the same compliance standards?

A: Yes. Both EP3SL200F1152C3 and EP3SL200F1152C3G are RoHS Compliant and share the same Moisture Sensitivity Level (MSL 3, 168 Hours). Handling, storage, and regulatory requirements are identical.

Q: Which part should be selected for new procurement?

A: EP3SL200F1152C3G should be selected for new designs and procurement due to its Active product status and continued manufacturer support. The substitute provides supply chain continuity and long-term availability assurance.

Q: Is the 1152-FBGA package compatible with designs using 1152-BBGA, FCBGA?

A: Yes. The package designations refer to the same physical form factor (1152-pin Ball Grid Array). Both parts use identical pin configurations, pitch, and mechanical dimensions, ensuring PCB layout and assembly compatibility.