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EP3SL200F1152C2N Equivalent & Substitute Parts
Part Overview
The EP3SL200F1152C2N is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, featuring 744 I/O pins and 200,000 logic elements in a 1152-BBGA, FCBGA package. This component is classified as obsolete, making equivalent and substitute parts necessary for legacy system maintenance, redesigns, and continued production support. The part operates at 0.86V to 1.15V supply voltage with an operating temperature range of 0°C to 85°C (TJ).
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | EP3SL200F1152C2N |
| Manufacturer | Intel |
| Series | Stratix® III L |
| Number of Logic Elements | 200,000 |
| Number of I/O | 744 |
| Total RAM Bits | 10,901,504 |
| Voltage - Supply | 0.86V ~ 1.15V |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution for the EP3SL200F1152C2N is determined by the following critical parameters:
- Base Product Number: EP3SL200 (core device architecture)
- Number of Logic Elements: 200,000 (functional capacity)
- Number of I/O: 744 (pin count and connectivity)
- Package Type: 1152-BBGA, FCBGA (physical form factor and pinout compatibility)
- Voltage Supply Range: 0.86V ~ 1.15V (power delivery requirements)
- Operating Temperature Range: 0°C ~ 85°C (thermal specifications)
- RoHS Compliance: Required for regulatory alignment
- Moisture Sensitivity Level: 3 (168 Hours) (handling and storage requirements)
The substitute part EP3SL200F1152C2G shares the identical base product number, logic element count, I/O configuration, package specification, and compliance certifications. The primary distinction is packaging format (Tray versus standard packaging) and product status (Active versus Obsolete).
Parameter Comparison
| Parameter | EP3SL200F1152C2N (Main) | EP3SL200F1152C2G (Substitute) |
|---|---|---|
| Manufacturer | Intel | Intel |
| Base Product Number | EP3SL200 | EP3SL200 |
| Series | Stratix® III L | Stratix® III L |
| Number of Logic Elements | 200,000 | 200,000 |
| Number of I/O | 744 | 744 |
| Total RAM Bits | 10,901,504 | Not specified |
| Voltage - Supply | 0.86V ~ 1.15V | Not specified |
| Operating Temperature | 0°C ~ 85°C (TJ) | Not specified |
| Package / Case | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
| Packaging Format | Standard | Tray |
| RoHS Status | RoHS Compliant | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Obsolete | Active |
Engineering Selection Recommendations
The EP3SL200F1152C2G is a direct functional equivalent to the EP3SL200F1152C2N. Both parts share identical core specifications: 200,000 logic elements, 744 I/O pins, and 1152-FBGA package configuration. Both maintain RoHS compliance and identical MSL ratings.
The EP3SL200F1152C2G carries Active product status, whereas the main part is Obsolete. This distinction is significant for long-term supply chain planning and design decisions. The substitute part is available in Tray packaging, which may affect procurement quantities and handling procedures compared to standard packaging formats.
Selection between these parts should be based on availability requirements, packaging format compatibility with assembly processes, and supply chain continuity objectives. Both parts satisfy identical electrical and mechanical requirements for applications requiring Stratix® III L FPGA functionality at the specified I/O and logic element density.
Frequently Asked Questions (FAQ)
Q: Can EP3SL200F1152C2G directly replace EP3SL200F1152C2N in existing designs?
A: Yes. Both parts share identical core specifications: 200,000 logic elements, 744 I/O pins, 1152-FBGA package, 0.86V–1.15V supply voltage, and 0°C–85°C operating temperature range. Pinout and electrical characteristics are equivalent.
Q: What is the significance of the packaging format difference (Tray versus standard)?
A: Packaging format affects procurement quantities, handling procedures, and assembly line compatibility. Tray packaging typically accommodates higher-volume orders and automated pick-and-place operations. Verify compatibility with your assembly process before selection.
Q: Why is the main part marked Obsolete while the substitute is Active?
A: Product status reflects Intel's manufacturing and support lifecycle. Active status indicates ongoing production and support availability. For new designs or long-term production, the Active substitute part provides superior supply chain continuity.
Q: Are there any compliance or certification differences between these parts?
A: Both parts are RoHS Compliant and share identical MSL ratings of 3 (168 Hours). No compliance or certification differences exist between the two parts.
Q: What parameters must remain identical for substitution to be valid?
A: Logic element count (200,000), I/O pin count (744), package type (1152-FBGA), voltage supply range (0.86V–1.15V), operating temperature range (0°C–85°C), and RoHS compliance status must all remain identical for direct substitution.
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