EP3SL200F1152C2 Equivalent & Substitute Parts

Part Overview

The EP3SL200F1152C2 is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 200,000 logic elements, 744 I/O pins, and 10,901,504 total RAM bits in a 1152-BBGA/FCBGA package. The part is currently classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support, design updates, and procurement planning.

Substiute Parts

EP3SL200F1152C2

IntelIn Stock: 783EP3SL200F1152C2 Datasheet

Current PartRFQ

EP3SL200F1152C2G

IntelIn Stock: 1179EP3SL200F1152C2G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the EP3SL200F1152C2 is determined by the following critical parameters:

• Logic Element Count: 200,000 elements
• I/O Pin Count: 744 pins
• Total RAM Bits: 10,901,504 bits
• Package Type: 1152-BBGA/FCBGA form factor
• Voltage Supply Range: 0.86V ~ 1.15V
• Mounting Configuration: Surface Mount
• Operating Temperature Range: 0°C ~ 85°C

The substitute part EP3SL200F1152C2G maintains identical electrical specifications and package dimensions, differing only in packaging format (Tray vs. standard packaging) and product status (Active vs. Obsolete). This distinction does not affect functional compatibility or electrical performance in circuit applications.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL200F1152C2G is a direct functional equivalent to the EP3SL200F1152C2. Both devices are manufactured by Intel within the Stratix® III L series and share identical electrical characteristics, logic capacity, I/O configuration, and thermal specifications. The primary distinction is product status: the original part is obsolete while the substitute remains active in Intel's product portfolio.

Both parts maintain RoHS compliance and identical moisture sensitivity ratings, satisfying regulatory and environmental requirements. The substitute part's active status provides improved availability and supply chain continuity compared to the obsolete original part. Packaging format differences (Tray vs. standard) do not affect electrical performance or circuit compatibility.

Frequently Asked Questions (FAQ)

Q: Can EP3SL200F1152C2G be used as a direct replacement for EP3SL200F1152C2?

A: Yes. Both parts are electrically and functionally identical. They share the same logic element count (200,000), I/O pin configuration (744 pins), RAM capacity (10,901,504 bits), package type (1152-BBGA/FCBGA), voltage supply range (0.86V ~ 1.15V), and operating temperature range (0°C ~ 85°C). The only differences are product status and packaging format, neither of which affects circuit performance.

Q: What is the significance of the packaging format difference?

A: The main part uses standard packaging while the substitute uses Tray packaging. This distinction relates to how units are supplied and stored but does not affect the electrical specifications, pin configuration, or functional capabilities of the device itself.

Q: Why is the original part classified as obsolete?

A: Product obsolescence is determined by the manufacturer based on market demand, technology evolution, and production decisions. The availability of the active substitute part (EP3SL200F1152C2G) ensures continued access to equivalent functionality.

Q: Are there any compliance or certification differences between these parts?

A: No. Both parts maintain RoHS compliance and identical Moisture Sensitivity Level (MSL) ratings of 3 (168 Hours). Regulatory and environmental requirements are equivalent.

Q: What parameters must remain identical for substitution to be valid?

A: Logic element count, I/O pin count, total RAM bits, package type, voltage supply range, mounting type, and operating temperature range must all match. The EP3SL200F1152C2G satisfies all these requirements.