EP3SL150F780I4 Equivalent & Substitute Parts

Part Overview

The EP3SL150F780I4 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 142,500 logic elements, 488 I/O pins, and 6,543,360 total RAM bits in a 780-BBGA/FCBGA package. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support, maintenance, and new design implementations where legacy compatibility is required.

Substiute Parts

EP3SL150F780I4

IntelIn Stock: 56014EP3SL150F780I4 Datasheet

Current PartRFQ

EP3SL150F780I4G

IntelIn Stock: 983EP3SL150F780I4G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution for the EP3SL150F780I4 is determined by strict equivalence across the following critical parameters:

• Base Product Number: EP3SL150 (identical across all variants)
• Logic Elements: 142,500 (fixed for this density grade)
• I/O Count: 488 pins (package-dependent, non-negotiable)
• Package Type: 780-FBGA (29x29) form factor
• Supply Voltage Range: 0.86V ~ 1.15V
• Operating Temperature Range: -40°C ~ 100°C
• RoHS Compliance: Required
• MSL Rating: 3 (168 Hours)

Substitute parts must maintain identical electrical specifications, pinout configuration, and thermal characteristics. Packaging format (tray versus other configurations) represents the only allowable variation, provided the underlying device remains functionally and electrically equivalent.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL150F780I4G serves as a direct functional equivalent to the EP3SL150F780I4. Both devices share identical electrical specifications, logic density, I/O configuration, and thermal operating parameters. The primary distinction is product status: the original part is obsolete while the substitute remains in active production.

The EP3SL150F780I4G maintains full RoHS compliance and identical MSL rating, ensuring compatibility with current manufacturing and environmental standards. The tray packaging format of the substitute part does not affect electrical or mechanical compatibility; it represents a packaging configuration difference only.

For applications requiring the EP3SL150F780I4, the EP3SL150F780I4G is electrically and mechanically interchangeable, with the added advantage of active product status and ongoing availability.

Frequently Asked Questions (FAQ)

Q: Can the EP3SL150F780I4G replace the EP3SL150F780I4 in existing designs?

A: Yes. Both parts are electrically and mechanically identical. They share the same logic element count (142,500), I/O configuration (488 pins), RAM capacity (6,543,360 bits), supply voltage range (0.86V ~ 1.15V), operating temperature range (-40°C ~ 100°C), and package type (780-FBGA). The substitute is a direct replacement.

Q: What is the difference between these two part numbers?

A: The EP3SL150F780I4G differs only in packaging format (tray) and product status (active versus obsolete). All functional and electrical parameters are identical.

Q: Are both parts RoHS compliant?

A: Yes. Both the EP3SL150F780I4 and EP3SL150F780I4G are RoHS compliant and carry an MSL rating of 3 (168 Hours).

Q: Does the tray packaging affect PCB assembly compatibility?

A: No. Packaging format does not affect electrical performance, pinout, or mechanical fit. The 780-FBGA (29x29) package dimensions and pin configuration remain identical regardless of packaging format.

Q: Why is the original part marked as obsolete?

A: Product obsolescence reflects Intel's lifecycle management. The EP3SL150F780I4G, as an active product variant, provides continued access to equivalent functionality and specifications.