EP3SL150F780I3 Equivalent & Substitute Parts

Part Overview

The EP3SL150F780I3 is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 142,500 logic elements, 488 I/O pins, and 6,543,360 total RAM bits in a 780-FBGA package. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support, design updates, and procurement planning.

Substiute Parts

EP3SL150F780I3

IntelIn Stock: 701EP3SL150F780I3 Datasheet

Current PartRFQ

EP3SL150F780I3G

IntelIn Stock: 1200EP3SL150F780I3G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the EP3SL150F780I3 is determined by strict equivalence across the following critical parameters:

• Manufacturer and Series: Both main and substitute parts must be Intel Stratix® III L devices
• Logic Element Count: 142,500 logic elements (exact match required)
• I/O Pin Count: 488 I/O pins (exact match required)
• RAM Capacity: 6,543,360 total RAM bits (exact match required)
• Package Configuration: 780-FBGA form factor with identical pinout
• Voltage Supply Range: 0.86V ~ 1.15V (exact match required)
• Operating Temperature Range: -40°C ~ 100°C (exact match required)
• RoHS Compliance: RoHS Compliant status maintained
• Moisture Sensitivity Level: MSL 3 (168 Hours) maintained

The EP3SL150F780I3G qualifies as a direct substitute based on matching all electrical and mechanical parameters while offering active product status and improved availability.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL150F780I3G is a qualified direct substitute for the EP3SL150F780I3. Both devices maintain identical electrical specifications, logic capacity, I/O configuration, and thermal operating range. The substitute part offers the advantage of active product status, ensuring continued manufacturer support and supply chain availability. Both parts maintain RoHS compliance and equivalent moisture sensitivity ratings, supporting deployment in regulated and industrial environments. The EP3SL150F780I3G is supplied in tray packaging, which may require evaluation against existing procurement and assembly workflows.

Frequently Asked Questions (FAQ)

Q: Can the EP3SL150F780I3G be used as a direct replacement for the EP3SL150F780I3?

A: Yes. Both parts are identical in logic element count (142,500), I/O configuration (488 pins), RAM capacity (6,543,360 bits), voltage supply range (0.86V ~ 1.15V), and operating temperature range (-40°C ~ 100°C). The 780-FBGA package pinout is equivalent across both variants.

Q: What is the primary difference between these two part numbers?

A: The EP3SL150F780I3G carries active product status with tray packaging, while the EP3SL150F780I3 is obsolete. The suffix "G" indicates the active variant with improved supply availability.

Q: Are there any compliance or certification differences?

A: Both parts maintain RoHS compliance and identical Moisture Sensitivity Level 3 (168 Hours) ratings. No compliance differences exist between the two variants.

Q: What packaging considerations apply to the EP3SL150F780I3G?

A: The substitute part is supplied in tray packaging. Verify compatibility with existing assembly and storage procedures, particularly regarding moisture control and handling protocols for MSL 3 devices.

Q: Can these parts be used interchangeably in PCB designs?

A: Yes, provided the PCB layout accommodates the 780-FBGA (29x29) form factor and the design meets the specified voltage supply range (0.86V ~ 1.15V) and operating temperature requirements (-40°C ~ 100°C).