EP3SL150F780C3N Equivalent & Substitute Parts

Part Overview

The EP3SL150F780C3N is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 142,500 logic elements, 488 I/O pins, and 6,543,360 total RAM bits in a 780-FBGA package. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support, maintenance, and production continuity.

Substiute Parts

EP3SL150F780C3N

IntelIn Stock: 1612EP3SL150F780C3N Datasheet

Current PartRFQ

EP3SL150F780C3G

IntelIn Stock: 1004EP3SL150F780C3G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the EP3SL150F780C3N is determined by strict alignment with the following critical parameters:

• Base product number match (EP3SL150)
• Identical logic element count (142,500)
• Identical I/O pin count (488)
• Identical RAM bit capacity (6,543,360)
• Identical package designation (780-FBGA)
• Identical voltage supply range (0.86V ~ 1.15V)
• Identical operating temperature range (0°C ~ 85°C)
• RoHS compliance status

The EP3SL150F780C3G qualifies as a direct substitute based on these parameters. Differences in packaging format (Tray vs. standard), moisture sensitivity level, and product status do not affect functional equivalence at the component level.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL150F780C3G is a functional equivalent to the EP3SL150F780C3N. Both devices share identical core specifications including logic element density, I/O configuration, memory capacity, and electrical operating parameters. The primary distinction is product lifecycle status: the EP3SL150F780C3N is obsolete, while the EP3SL150F780C3G maintains active production status.

The EP3SL150F780C3G offers improved moisture sensitivity characteristics (MSL 3 vs. MSL 4), providing extended handling and storage windows. Both parts maintain RoHS compliance and are suitable for surface mount assembly in identical footprints.

Frequently Asked Questions (FAQ)

Q: Can EP3SL150F780C3G directly replace EP3SL150F780C3N in existing designs?

A: Yes. Both parts are functionally equivalent with identical logic element count, I/O configuration, RAM capacity, voltage requirements, and operating temperature range. No design modifications are required.

Q: What is the significance of the different moisture sensitivity levels?

A: MSL 3 (EP3SL150F780C3G) allows 168 hours of exposure to 85°C/85% RH before reflow, compared to 72 hours for MSL 4 (EP3SL150F780C3N). This affects component storage, handling, and production scheduling but does not impact functional performance.

Q: Are there packaging differences between these parts?

A: Both parts use the 780-FBGA package (29x29). The EP3SL150F780C3G is supplied in Tray packaging, while the EP3SL150F780C3N packaging format is not specified. This affects logistics and handling but not electrical or mechanical compatibility.

Q: Why is the EP3SL150F780C3N classified as obsolete?

A: Obsolete status indicates the manufacturer has discontinued production. The EP3SL150F780C3G, with active production status, is the recommended path for new designs and ongoing supply requirements.

Q: Are both parts RoHS compliant?

A: Yes. Both EP3SL150F780C3N and EP3SL150F780C3G are RoHS compliant, meeting environmental and regulatory requirements for electronic components.