EP3SL150F780C2N Equivalent & Substitute Parts

Part Overview

The EP3SL150F780C2N is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, featuring 488 I/O pins in a 780-FBGA package. This device is classified as obsolete, which necessitates identification of equivalent substitute components for ongoing system support and new design implementations. The part delivers 142,500 logic elements and 6,543,360 total RAM bits, operating at 0.86V to 1.15V supply voltage across a 0°C to 85°C temperature range.

Substiute Parts

EP3SL150F780C2N

IntelIn Stock: 10322EP3SL150F780C2N Datasheet

Current PartRFQ

EP3SL150F780C2G

IntelIn Stock: 1060EP3SL150F780C2G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the EP3SL150F780C2N is determined by strict equivalence across the following critical parameters:

• Base Product Number: EP3SL150 (identical across main and substitute parts)
• Number of Logic Elements: 142,500
• Total RAM Bits: 6,543,360
• Number of I/O: 488
• Package Type: 780-FBGA
• Voltage Supply Range: 0.86V ~ 1.15V
• Mounting Type: Surface Mount
• Series: Stratix® III L
• RoHS Compliance: Required

The substitute part EP3SL150F780C2G maintains functional and electrical equivalence through identical logic element count, RAM capacity, I/O configuration, and package specifications. Variations in packaging format (Tray vs. standard) and moisture sensitivity level do not affect electrical or mechanical compatibility.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL150F780C2G is a direct functional equivalent to the EP3SL150F780C2N. Both devices share identical logic element density, RAM capacity, I/O count, and electrical specifications. The substitute part carries Active product status, ensuring continued availability and manufacturing support compared to the Obsolete status of the main part.

Both parts maintain RoHS compliance. The EP3SL150F780C2G features improved moisture sensitivity characteristics (MSL 3 vs. MSL 4), providing extended handling windows during assembly and storage operations. Selection between these parts should be based on availability, packaging requirements, and supply chain considerations rather than functional or electrical differences.

Frequently Asked Questions (FAQ)

Q: Are EP3SL150F780C2N and EP3SL150F780C2G electrically interchangeable?

A: Yes. Both parts share identical logic element count (142,500), RAM capacity (6,543,360 bits), I/O configuration (488 pins), supply voltage range (0.86V ~ 1.15V), and package type (780-FBGA). They are direct functional equivalents.

Q: What is the significance of the different MSL ratings?

A: EP3SL150F780C2N carries MSL 4 (72-hour moisture absorption limit), while EP3SL150F780C2G carries MSL 3 (168-hour limit). MSL 3 provides a longer safe handling window before reflow soldering, reducing risk of moisture-induced defects during assembly. This difference does not affect electrical performance or long-term reliability in deployed systems.

Q: Why is the main part listed as Obsolete?

A: Obsolete status indicates Intel has discontinued manufacturing. The EP3SL150F780C2G, with Active status, represents the current production equivalent and is the recommended choice for new designs and ongoing system support.

Q: Does packaging format (Tray vs. standard) affect compatibility?

A: No. Packaging format affects only handling, storage, and logistics. The electrical and mechanical specifications of the die and package remain identical. Component selection should account for assembly line requirements and inventory management practices.

Q: Are both parts RoHS compliant?

A: Yes. Both EP3SL150F780C2N and EP3SL150F780C2G meet RoHS compliance requirements.