EP3SL150F780C2 Equivalent & Substitute Parts

Part Overview

The EP3SL150F780C2 is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 142,500 logic elements, 488 I/O pins, and 6,543,360 total RAM bits in a 780-FBGA package. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support, maintenance, and design continuity.

Substiute Parts

EP3SL150F780C2

IntelIn Stock: 975EP3SL150F780C2 Datasheet

Current PartRFQ

EP3SL150F780C2G

IntelIn Stock: 1060EP3SL150F780C2G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the EP3SL150F780C2 are identified based on strict equivalence of the following critical parameters:

• Base Product Number: EP3SL150
• Number of Logic Elements: 142,500
• Number of I/O: 488
• Total RAM Bits: 6,543,360
• Package Type: 780-FBGA
• Voltage Supply Range: 0.86V ~ 1.15V
• Operating Temperature Range: 0°C ~ 85°C
• RoHS Compliance: RoHS Compliant
• Moisture Sensitivity Level: 3 (168 Hours)

The EP3SL150F780C2G qualifies as a direct substitute based on identical core specifications and packaging. The primary distinction is the packaging format (Tray versus standard packaging) and active product status, which ensures continued availability and supply chain support.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL150F780C2G is a direct functional equivalent to the EP3SL150F780C2. Both devices share identical electrical specifications, logic capacity, I/O configuration, and thermal characteristics. The EP3SL150F780C2G maintains active product status with Intel, ensuring continued manufacturing support and supply availability. Both parts are RoHS compliant and carry identical moisture sensitivity ratings, confirming compatibility for applications requiring regulatory compliance and environmental control during storage and handling.

Selection between these parts should be based on supply chain availability and packaging requirements. The EP3SL150F780C2G, supplied in Tray packaging, is the preferred choice for new designs and ongoing production due to its active status.

Frequently Asked Questions (FAQ)

Q: Can the EP3SL150F780C2G be used as a direct replacement for the EP3SL150F780C2?

A: Yes. Both devices are functionally equivalent with identical logic element count (142,500), I/O configuration (488 pins), RAM capacity (6,543,360 bits), voltage supply range (0.86V ~ 1.15V), and package type (780-FBGA). The primary difference is product status and packaging format.

Q: What is the significance of the product status difference?

A: The EP3SL150F780C2 is classified as obsolete, indicating Intel has discontinued active manufacturing. The EP3SL150F780C2G maintains active status, ensuring continued availability from authorized distributors and manufacturing support from Intel.

Q: Are there any thermal or electrical differences between these parts?

A: No. Both devices operate within the same temperature range (0°C ~ 85°C junction temperature) and require identical supply voltage (0.86V ~ 1.15V). Thermal and electrical performance characteristics are equivalent.

Q: Does packaging format affect electrical performance?

A: No. The Tray packaging format of the EP3SL150F780C2G does not affect electrical performance or functional characteristics. Packaging format relates to handling, storage, and supply chain logistics only.

Q: Are both parts RoHS compliant?

A: Yes. Both the EP3SL150F780C2 and EP3SL150F780C2G are RoHS compliant and carry identical Moisture Sensitivity Level 3 ratings (168 hours), meeting the same environmental and regulatory requirements.