EP3SL150F1152C2 Equivalent & Substitute Parts

Part Overview

The EP3SL150F1152C2 is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 142,500 logic elements, 744 I/O pins, and 6,543,360 total RAM bits in a 1152-FBGA package. The part is classified as obsolete, making identification of compatible substitute components essential for ongoing system support, maintenance, and design continuity.

Substiute Parts

EP3SL150F1152C2
IntelIn Stock: 1314EP3SL150F1152C2 Datasheet
EP3SL150F1152C2
Current Part

Key Parameters

Parameter Value
Manufacturer Part Number EP3SL150F1152C2
Manufacturer Intel
Series Stratix® III L
Number of Logic Elements 142,500
Number of I/O 744
Total RAM Bits 6,543,360
Voltage Supply Range 0.86V ~ 1.15V
Package Type 1152-BBGA, FCBGA
Operating Temperature 0°C ~ 85°C (TJ)
RoHS Status RoHS Compliant
Moisture Sensitivity Level 3 (168 Hours)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution eligibility for the EP3SL150F1152C2 is determined by strict alignment of the following critical parameters:

  • Base Product Number: EP3SL150 (core device designation)
  • Package Type: 1152-FBGA (35x35) pinout and footprint compatibility
  • Logic Element Count: 142,500 (functional capacity)
  • I/O Pin Count: 744 (interface compatibility)
  • Total RAM Bits: 6,543,360 (memory capacity)
  • Voltage Supply Range: 0.86V ~ 1.15V (power delivery requirements)
  • RoHS Compliance: RoHS Compliant (regulatory alignment)
  • Moisture Sensitivity Level: 3 (168 Hours) (handling and storage requirements)

The substitute part EP3SL150F1152C2G maintains identical electrical specifications, logic density, I/O configuration, and package footprint. The primary distinction is packaging format (Tray versus standard packaging) and active product status, which affects availability and supply chain considerations.

Parameter Comparison

Parameter EP3SL150F1152C2 (Main) EP3SL150F1152C2G (Substitute)
Manufacturer Intel Intel
Base Product Number EP3SL150 EP3SL150
Number of Logic Elements 142,500 142,500
Number of I/O 744 744
Total RAM Bits 6,543,360 6,543,360
Voltage Supply Range 0.86V ~ 1.15V 0.86V ~ 1.15V
Package Type 1152-BBGA, FCBGA 1152-FBGA
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
RoHS Status RoHS Compliant RoHS Compliant
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active
Packaging Format Standard Tray

Engineering Selection Recommendations

The EP3SL150F1152C2G is a direct functional equivalent to the EP3SL150F1152C2. Both devices share identical electrical specifications, logic capacity, I/O configuration, and thermal operating range. The substitute part carries active product status, ensuring continued availability and supply chain support compared to the obsolete main part number.

Both parts maintain RoHS compliance and identical moisture sensitivity requirements, eliminating regulatory or handling procedure differences. The packaging format difference (Tray for the substitute) does not affect electrical performance or PCB integration, though it may influence procurement quantities and storage protocols.

Selection between these part numbers should be based on current inventory availability, supply chain lead times, and organizational procurement policies regarding active versus obsolete device designations.

Frequently Asked Questions (FAQ)

Q: Can EP3SL150F1152C2G be used as a direct replacement for EP3SL150F1152C2?

A: Yes. Both parts are electrically and functionally identical, sharing the same logic element count (142,500), I/O configuration (744 pins), RAM capacity (6,543,360 bits), voltage supply range (0.86V ~ 1.15V), and package footprint (1152-FBGA). PCB layout and design files require no modification.

Q: What is the difference between these two part numbers?

A: The primary differences are product status and packaging format. EP3SL150F1152C2 is classified as obsolete, while EP3SL150F1152C2G is active. EP3SL150F1152C2G is supplied in Tray packaging, whereas the main part uses standard packaging. Electrical and functional specifications are identical.

Q: Are there any compliance or regulatory differences?

A: No. Both parts are RoHS Compliant and carry identical Moisture Sensitivity Level ratings (3, 168 Hours). No changes to compliance documentation or handling procedures are required when substituting between these parts.

Q: Does the packaging format affect circuit board integration?

A: No. The packaging format difference (Tray versus standard) affects only procurement, storage, and handling logistics. The 1152-FBGA footprint and pinout are identical, requiring no PCB redesign or layout modifications.

Q: Which part should be selected for new designs?

A: EP3SL150F1152C2G should be selected for new designs due to its active product status, which ensures long-term availability and supply chain continuity. The obsolete status of EP3SL150F1152C2 limits future procurement options.

Request Quote (Ships tomorrow)