EP3SL110F780I3 Equivalent & Substitute Parts

Part Overview

The EP3SL110F780I3 is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 107,500 logic elements, 4,992,000 total RAM bits, and 488 I/O pins in a 780-FBGA package. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support, design updates, and procurement planning.

Substiute Parts

EP3SL110F780I3

IntelIn Stock: 987EP3SL110F780I3 Datasheet

Current PartRFQ

EP3SL110F780I3G

IntelIn Stock: 1047EP3SL110F780I3G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the EP3SL110F780I3 is determined by strict equivalence across the following critical parameters:

• Manufacturer and Series: Must be Intel Stratix® III L FPGA
• Logic Element Count: 107,500 elements (exact match)
• RAM Capacity: 4,992,000 total bits (exact match)
• I/O Pin Count: 488 I/O (exact match)
• Package Configuration: 780-FBGA, 29x29mm footprint (exact match)
• Voltage Supply Range: 0.86V ~ 1.15V (exact match)
• Operating Temperature Range: -40°C ~ 100°C (exact match)
• RoHS Compliance: RoHS Compliant (required)
• Moisture Sensitivity Level: MSL 3, 168 Hours (exact match)

The substitute part EP3SL110F780I3G maintains identical electrical and mechanical specifications, with the primary distinction being packaging format (Tray versus unspecified for the main part) and active product status.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL110F780I3G is a direct functional equivalent to the EP3SL110F780I3. Both devices share identical electrical specifications, logic capacity, memory configuration, I/O count, and thermal operating range. The primary distinction is product lifecycle status: the original part is obsolete while the substitute is active.

For new designs or system updates, the EP3SL110F780I3G is the appropriate selection due to its active product status and continued manufacturer support. Both parts maintain RoHS compliance and identical moisture sensitivity classifications, ensuring regulatory and environmental consistency.

The packaging difference (Tray for the substitute) represents a logistical distinction without impact on electrical or mechanical compatibility. Both parts utilize the same 780-FBGA footprint and pinout configuration.

Frequently Asked Questions (FAQ)

Q: Can EP3SL110F780I3G be used as a direct replacement for EP3SL110F780I3?

A: Yes. Both parts are identical in electrical specifications, logic element count, RAM capacity, I/O configuration, package footprint, voltage supply range, and operating temperature. The substitute part is functionally equivalent.

Q: What is the difference between the two part numbers?

A: The primary difference is product status. EP3SL110F780I3 is obsolete, while EP3SL110F780I3G is active. The packaging format differs (Tray for the substitute), but this does not affect electrical or mechanical compatibility.

Q: Are both parts RoHS compliant?

A: Yes. Both EP3SL110F780I3 and EP3SL110F780I3G are RoHS compliant and carry identical Moisture Sensitivity Level 3 ratings.

Q: Does the 780-FBGA package footprint remain the same for both parts?

A: Yes. Both parts use the 780-FBGA package with a 29x29mm footprint. PCB layout and design files require no modification.

Q: What is the supply voltage requirement for these devices?

A: Both parts operate within a supply voltage range of 0.86V to 1.15V. Power supply design specifications remain unchanged between the two parts.

Q: Are there any temperature operating range differences?

A: No. Both parts operate across the identical temperature range of -40°C to 100°C (junction temperature).