EP3SL110F780C4L Equivalent & Substitute Parts

Part Overview

The EP3SL110F780C4L is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 107,500 logic elements, 4,992,000 total RAM bits, and 488 I/O pins in a 780-FBGA package. The product is currently obsolete, making identification of compatible substitute parts essential for legacy system maintenance, board redesigns, and component procurement.

Substiute Parts

EP3SL110F780C4L

IntelIn Stock: 1062EP3SL110F780C4L Datasheet

Current PartRFQ

EP3SL110F780C4LG

IntelIn Stock: 673EP3SL110F780C4LG Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the EP3SL110F780C4L is determined by strict equivalence across the following critical parameters:

• Base Product Number: EP3SL110 (core device designation)
• Logic Element Count: 107,500 (functional capacity requirement)
• Total RAM Bits: 4,992,000 (memory resource requirement)
• I/O Pin Count: 488 (interface requirement)
• Package Type: 780-FBGA (physical and electrical compatibility)
• Voltage Supply Range: 0.86V ~ 1.15V (power delivery compatibility)
• Operating Temperature Range: 0°C ~ 85°C (thermal operating envelope)
• RoHS Compliance: Required for regulatory alignment
• Moisture Sensitivity Level: 3 (168 Hours) (handling and storage requirements)

Only parts meeting all these parameters are considered direct substitutes. Packaging variants (such as tray versus tube) do not affect functional substitutability.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL110F780C4LG is a direct functional equivalent to the EP3SL110F780C4L. Both devices share identical logic element count, RAM capacity, I/O configuration, voltage specifications, and thermal operating range. The primary distinction is product status: the EP3SL110F780C4LG maintains active manufacturing status, whereas the main part is obsolete.

For new designs or system refreshes, the EP3SL110F780C4LG is the appropriate selection due to its active product status and continued availability. Both parts maintain RoHS compliance and identical moisture sensitivity requirements, ensuring regulatory and handling compatibility. The packaging designation difference (780-FBGA versus 780-BBGA, FCBGA) does not affect electrical or mechanical compatibility, as both reference the same 29x29 ball grid array footprint.

Frequently Asked Questions (FAQ)

Q: Can EP3SL110F780C4LG replace EP3SL110F780C4L in existing designs?

A: Yes. Both parts are electrically and mechanically equivalent across all critical parameters: logic element count, RAM capacity, I/O configuration, voltage supply range, operating temperature, and package footprint. Direct substitution is supported without design modification.

Q: What is the significance of the product status difference?

A: The main part (EP3SL110F780C4L) is obsolete, indicating discontinued manufacturing. The substitute (EP3SL110F780C4LG) maintains active status, ensuring ongoing availability for procurement and support. For legacy system maintenance, the substitute provides a viable sourcing path.

Q: Are there packaging considerations between these parts?

A: Both parts use the 780-FBGA package in a 29x29 ball grid array configuration. Packaging designation variations (780-BBGA, FCBGA versus 780-FBGA) reference the same physical footprint and are interchangeable at the board level. Tray versus tube packaging affects only handling and storage logistics, not functional compatibility.

Q: Do moisture sensitivity requirements differ between these parts?

A: No. Both parts maintain Moisture Sensitivity Level 3 (168 Hours), requiring identical handling, storage, and reflow procedures. No additional precautions are necessary when transitioning between these parts.

Q: Is the voltage supply range identical?

A: Yes. Both parts operate within the 0.86V to 1.15V supply range and maintain the same operating temperature envelope of 0°C to 85°C (junction temperature). Power delivery and thermal management designs require no modification.