EP3SL110F780C3 Equivalent & Substitute Parts

Part Overview

The EP3SL110F780C3 is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 107,500 logic elements, 4,992,000 total RAM bits, and 488 I/O pins in a 780-FBGA package. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support, maintenance, and new design implementations where legacy compatibility is required.

Substiute Parts

EP3SL110F780C3

IntelIn Stock: 1270EP3SL110F780C3 Datasheet

Current PartRFQ

EP3SL110F780C3G

IntelIn Stock: 1362EP3SL110F780C3G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute components for the EP3SL110F780C3 are identified based on strict equivalence across the following critical parameters:

• Manufacturer and Series: Intel Stratix® III L family
• Logic Density: 107,500 logic elements
• Memory Configuration: 4,992,000 total RAM bits
• I/O Count: 488 I/O pins
• Package Type: 780-FBGA (29x29) form factor
• Electrical Specifications: 0.86V ~ 1.15V supply voltage
• Environmental Compliance: RoHS Compliant, MSL 3 (168 Hours)

The substitute part EP3SL110F780C3G maintains identical functional and electrical specifications while differing only in packaging format (Tray vs. standard packaging) and product status (Active vs. Obsolete). This distinction does not affect electrical or mechanical compatibility in circuit applications.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL110F780C3G is a direct functional equivalent to the EP3SL110F780C3. Both components share identical electrical characteristics, logic density, memory configuration, I/O specifications, and physical package dimensions. The primary distinction is product status: the original part is obsolete while the substitute remains in active production.

For new designs or system replacements, the EP3SL110F780C3G is the appropriate selection due to its active status and continued availability. Both parts maintain RoHS compliance and identical moisture sensitivity specifications, ensuring compatibility with current manufacturing and environmental standards. The difference in packaging format (Tray for the substitute) does not affect electrical or mechanical performance in circuit applications.

Frequently Asked Questions (FAQ)

Q: Can EP3SL110F780C3G be used as a direct replacement for EP3SL110F780C3?

A: Yes. Both parts are functionally identical with matching logic elements (107,500), RAM bits (4,992,000), I/O count (488), package type (780-FBGA), and electrical specifications (0.86V ~ 1.15V). The only differences are product status and packaging format, neither of which affects circuit compatibility.

Q: What is the significance of the product status difference (Obsolete vs. Active)?

A: The EP3SL110F780C3 is classified as obsolete, indicating Intel has discontinued production. The EP3SL110F780C3G remains in active production. For new applications or system replacements, the active part ensures long-term availability and supply chain reliability.

Q: Are the package dimensions identical between these parts?

A: Yes. Both components use the 780-FBGA (29x29) package format with identical pin configurations, footprints, and mechanical specifications. PCB layout and assembly processes remain unchanged.

Q: Do both parts meet the same environmental and compliance standards?

A: Yes. Both the EP3SL110F780C3 and EP3SL110F780C3G are RoHS Compliant with identical Moisture Sensitivity Level 3 (168 Hours) ratings. They meet equivalent environmental and regulatory requirements.

Q: What does the packaging format difference (Standard vs. Tray) mean?

A: Packaging format refers to the delivery container. Standard packaging and Tray packaging contain the same components with identical electrical and mechanical properties. The format difference affects only logistics and handling, not device performance or compatibility.