EP3SL110F780C2N Equivalent & Substitute Parts

Part Overview

The EP3SL110F780C2N is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 107,500 logic elements, 4,992,000 total RAM bits, and 488 I/O pins in a 780-FBGA package. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support, maintenance, and new design implementations where legacy compatibility is required.

Substiute Parts

EP3SL110F780C2N

IntelIn Stock: 1427EP3SL110F780C2N Datasheet

Current PartRFQ

EP3SL110F780C2G

IntelIn Stock: 931EP3SL110F780C2G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the EP3SL110F780C2N is determined by strict equivalence across the following critical parameters:

• Base Product Number: EP3SL110 (identical across all qualified substitutes)
• Number of Logic Elements: 107,500 (functional capacity match)
• Total RAM Bits: 4,992,000 (memory capacity match)
• Number of I/O: 488 (pin count match)
• Package / Case: 780-FBGA (physical and electrical compatibility)
• Voltage - Supply: 0.86V ~ 1.15V (power supply compatibility)
• Operating Temperature Range: 0°C ~ 85°C (thermal operating envelope)
• Mounting Type: Surface Mount (PCB assembly compatibility)
• RoHS Status: RoHS Compliant (environmental compliance match)
• Moisture Sensitivity Level: 3 (168 Hours) (handling and storage requirements)

Only components matching all these parameters are classified as direct substitutes. Variations in packaging type (tray vs. tube) do not affect functional or electrical compatibility.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL110F780C2G serves as a direct functional and electrical substitute for the EP3SL110F780C2N. Both components share identical logic element count, RAM capacity, I/O configuration, voltage specifications, and thermal operating range. The primary distinction is product status: the EP3SL110F780C2N is obsolete, while the EP3SL110F780C2G maintains active production status. Both devices maintain RoHS compliance and identical moisture sensitivity specifications, ensuring equivalent handling and storage requirements. The packaging designation difference (780-BBGA, FCBGA vs. 780-FBGA) reflects nomenclature variation rather than physical incompatibility, as both reference the same 29x29 footprint. Selection of the EP3SL110F780C2G is appropriate for applications requiring continued component availability and supply chain stability.

Frequently Asked Questions (FAQ)

Q: Can EP3SL110F780C2G replace EP3SL110F780C2N in existing designs?

A: Yes. Both components are electrically and functionally equivalent across all critical parameters: logic element count, RAM capacity, I/O count, voltage supply range, operating temperature, and package footprint. Direct substitution is supported without design modification.

Q: What is the significance of the product status difference (Obsolete vs. Active)?

A: Product status indicates manufacturing availability. The EP3SL110F780C2N is no longer in production, while the EP3SL110F780C2G remains in active production. For new designs or ongoing procurement, the active part number ensures supply chain continuity.

Q: Are the packaging designations 780-BBGA, FCBGA and 780-FBGA compatible?

A: Yes. Both designations reference the same physical package: a 780-pin Fine-Pitch Ball Grid Array in a 29x29mm footprint. The nomenclature variation does not affect PCB assembly compatibility or electrical performance.

Q: Do both parts require identical handling and storage procedures?

A: Yes. Both components carry Moisture Sensitivity Level 3 (168 Hours), requiring identical moisture control, storage conditions, and pre-reflow bake procedures during assembly.

Q: What compliance certifications apply to both parts?

A: Both EP3SL110F780C2N and EP3SL110F780C2G are RoHS Compliant and carry identical REACH status classifications, ensuring equivalent environmental and regulatory compliance.