EP3SL110F1152C4 Equivalent & Substitute Parts

Part Overview

The EP3SL110F1152C4 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 107,500 logic elements, 744 I/O pins, and 4,992,000 total RAM bits in a 1152-BBGA/FCBGA package. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support, maintenance, and new design implementations where legacy compatibility is required.

Substiute Parts

EP3SL110F1152C4

IntelIn Stock: 980EP3SL110F1152C4 Datasheet

Current PartRFQ

EP3SL110F1152C4G

IntelIn Stock: 1127EP3SL110F1152C4G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution for the EP3SL110F1152C4 is determined by strict equivalence across the following critical parameters:

Mandatory Matching Criteria:

• Base product number (EP3SL110)
• Logic element count (107,500)
• I/O pin count (744)
• Total RAM bits (4,992,000)
• Package type (1152-BBGA/FCBGA)
• Voltage supply range (0.86V ~ 1.15V)
• Mounting type (Surface Mount)
• Operating temperature range (0°C ~ 85°C)
• RoHS compliance status
• Moisture sensitivity level (MSL 3)

The substitute part EP3SL110F1152C4G maintains identical electrical and mechanical specifications to the main part, with the primary distinction being packaging format (Tray versus standard packaging) and active product status, making it a direct functional equivalent for replacement applications.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL110F1152C4G is a direct functional substitute for the EP3SL110F1152C4. Both parts are RoHS compliant and maintain identical electrical specifications, logic density, I/O configuration, and thermal operating range. The primary distinction is product status: the original part is obsolete while the substitute remains in active production. For new designs or system replacements requiring this logic density and I/O configuration, the EP3SL110F1152C4G is the appropriate selection. Both parts satisfy identical compliance requirements (RoHS, MSL 3) and are suitable for surface mount assembly in embedded applications.

Frequently Asked Questions (FAQ)

Q: Can EP3SL110F1152C4G replace EP3SL110F1152C4 in existing designs?

A: Yes. Both parts share identical electrical specifications, logic element count (107,500), I/O pin count (744), RAM capacity (4,992,000 bits), package type (1152-BBGA/FCBGA), voltage supply range (0.86V ~ 1.15V), and operating temperature range (0°C ~ 85°C). Pin-for-pin compatibility is maintained.

Q: What is the difference between these two part numbers?

A: The EP3SL110F1152C4G differs only in packaging format (Tray) and product status (Active). The EP3SL110F1152C4 is obsolete. All functional and electrical parameters are identical.

Q: Are both parts RoHS compliant?

A: Yes. Both EP3SL110F1152C4 and EP3SL110F1152C4G are RoHS compliant with MSL 3 moisture sensitivity level (168 hours).

Q: What does the "G" suffix in EP3SL110F1152C4G indicate?

A: The "G" suffix indicates the packaging format is Tray. This is a standard Intel designation for this product line variant.

Q: Can I use these parts interchangeably in PCB assembly?

A: Yes. Both parts use identical 1152-BBGA/FCBGA package (35x35mm) with surface mount configuration. PCB footprints, solder reflow profiles, and assembly processes are identical.

Q: What is the supply voltage requirement for these FPGAs?

A: Both parts require a supply voltage range of 0.86V to 1.15V. Power delivery design must accommodate this specification.

Q: Are there any thermal considerations for these parts?

A: Both parts operate within 0°C to 85°C junction temperature range. Thermal management design should account for the logic density (107,500 elements) and power dissipation characteristics of the application.