EP3SL110F1152C3 Equivalent & Substitute Parts

Part Overview

The EP3SL110F1152C3 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 107,500 logic elements, 744 I/O pins, and 4,992,000 total RAM bits in a 1152-FBGA package. The part is currently obsolete, making equivalent and substitute parts essential for legacy system maintenance, design updates, and procurement continuity.

Substiute Parts

EP3SL110F1152C3

IntelIn Stock: 940EP3SL110F1152C3 Datasheet

Current PartRFQ

EP3SL110F1152C3G

IntelIn Stock: 1139EP3SL110F1152C3G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution for the EP3SL110F1152C3 is determined by the following critical parameters:

• Base Product Number: EP3SL110 (core device identifier)
• Logic Element Count: 107,500 (functional capacity requirement)
• I/O Pin Count: 744 (interface requirement)
• Total RAM Bits: 4,992,000 (memory capacity requirement)
• Package Type: 1152-FBGA (physical and electrical compatibility)
• Voltage Supply Range: 0.86V ~ 1.15V (power delivery compatibility)
• Operating Temperature Range: 0°C ~ 85°C (thermal operating envelope)
• RoHS Compliance: Required for regulatory alignment

The substitute part EP3SL110F1152C3G maintains identical electrical specifications, logic density, I/O configuration, and package footprint. The primary distinction is product status and packaging format, with the substitute available in active production status.

Parameter Comparison

Engineering Selection Recommendations

The EP3SL110F1152C3G is a direct functional equivalent to the EP3SL110F1152C3. Both devices share identical electrical specifications, logic capacity, I/O configuration, and thermal operating parameters. The substitute part is currently in active production status, ensuring availability and supply chain continuity.

Selection between these parts should be based on:

• Availability Requirements: The substitute (EP3SL110F1152C3G) is actively produced with confirmed inventory, whereas the main part is obsolete.
• Compliance Status: Both parts maintain RoHS compliance and identical moisture sensitivity ratings, suitable for regulated applications.
• Packaging Considerations: The substitute is supplied in Tray packaging format, which may differ from original procurement specifications.
• Design Compatibility: Identical pin configuration, voltage requirements, and thermal characteristics ensure direct PCB-level compatibility without design modification.

Frequently Asked Questions (FAQ)

Q: Can EP3SL110F1152C3G be used as a direct replacement for EP3SL110F1152C3?

A: Yes. Both parts are based on the same EP3SL110 base product and maintain identical logic element count (107,500), I/O pin count (744), RAM capacity (4,992,000 bits), voltage supply range (0.86V ~ 1.15V), and operating temperature range (0°C ~ 85°C). Pin-for-pin compatibility is confirmed.

Q: What is the primary difference between these two part numbers?

A: The main difference is product status. EP3SL110F1152C3 is obsolete, while EP3SL110F1152C3G is in active production. The substitute is also supplied in Tray packaging format.

Q: Are there any electrical or thermal differences between these parts?

A: No. Both parts have identical electrical specifications, including voltage supply range, operating temperature range, and functional capacity. They are thermally equivalent.

Q: Do both parts meet RoHS compliance requirements?

A: Yes. Both EP3SL110F1152C3 and EP3SL110F1152C3G are RoHS compliant and have identical Moisture Sensitivity Level ratings (MSL 3, 168 Hours).

Q: What packaging format is the substitute supplied in?

A: The EP3SL110F1152C3G is supplied in Tray packaging format. Verify packaging requirements for your procurement and assembly processes.

Q: Is the 1152-FBGA package footprint identical between both parts?

A: Yes. Both parts use the 1152-FBGA package with 35x35mm dimensions, ensuring identical PCB footprint and assembly compatibility.