EP3SE80F780C3N Equivalent & Substitute Parts

Part Overview

The EP3SE80F780C3N is a Stratix® III E Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 80,000 logic elements, 488 I/O pins, and 6,843,392 total RAM bits in a 780-FBGA package. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support, maintenance, and new design implementations where legacy compatibility is required.

Substiute Parts

EP3SE80F780C3N

IntelIn Stock: 1911EP3SE80F780C3N Datasheet

Current PartRFQ

EP3SE80F780C3G

IntelIn Stock: 1138EP3SE80F780C3G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute components for the EP3SE80F780C3N are identified based on strict equivalence of the following critical parameters:

• Base Product Number: EP3SE80 (identical logic element and I/O architecture)
• Number of Logic Elements: 80,000 (functional capacity match)
• Number of I/O: 488 (pin count and signal routing equivalence)
• Total RAM Bits: 6,843,392 (embedded memory capacity)
• Package Type: 780-FBGA (physical and electrical compatibility)
• Voltage Supply Range: 0.86V ~ 1.15V (power delivery compatibility)
• Operating Temperature Range: 0°C ~ 85°C (thermal envelope)
• RoHS Compliance: RoHS Compliant (regulatory alignment)
• Moisture Sensitivity Level: 3 (168 Hours) (handling and storage requirements)

The EP3SE80F780C3G qualifies as a direct substitute based on identical base product number, logic element count, I/O configuration, and package specification. The primary distinction is product status and packaging format.

Parameter Comparison

Engineering Selection Recommendations

The EP3SE80F780C3G is electrically and mechanically equivalent to the EP3SE80F780C3N across all specified parameters. Selection between these components is determined by availability and product lifecycle status:

EP3SE80F780C3N is suitable for replacement applications and legacy system maintenance where existing inventory or archived documentation references this specific part number. Current inventory availability is 1,862 pieces.

EP3SE80F780C3G is the preferred selection for new designs and ongoing production due to active product status. This component maintains identical electrical specifications, logic capacity, I/O configuration, and thermal characteristics. Current inventory availability is 1,093 pieces. The packaging format difference (tray versus tube) affects handling and storage procedures but does not impact electrical or functional performance.

Both components satisfy RoHS compliance requirements and identical moisture sensitivity specifications, ensuring regulatory and environmental compatibility in equivalent applications.

Frequently Asked Questions (FAQ)

Q: Are EP3SE80F780C3N and EP3SE80F780C3G pin-compatible?

A: Yes. Both components feature 488 I/O pins in the 780-FBGA package configuration with identical pin assignments and electrical characteristics.

Q: Can EP3SE80F780C3G replace EP3SE80F780C3N in existing designs?

A: Yes. The EP3SE80F780C3G provides identical logic element count (80,000), RAM capacity (6,843,392 bits), supply voltage range (0.86V ~ 1.15V), and operating temperature specifications (0°C ~ 85°C). Functional equivalence is complete.

Q: What is the difference between the packaging formats?

A: EP3SE80F780C3N is supplied in tube packaging, while EP3SE80F780C3G is supplied in tray packaging. Both formats maintain identical moisture sensitivity level (MSL 3, 168 hours) and handling requirements. Packaging format selection depends on production workflow and inventory management procedures.

Q: Are both parts RoHS compliant?

A: Yes. Both EP3SE80F780C3N and EP3SE80F780C3G are RoHS compliant and suitable for applications requiring regulatory compliance.

Q: Why is EP3SE80F780C3N classified as obsolete?

A: Product status reflects Intel's lifecycle management. The EP3SE80F780C3G maintains active status and provides identical specifications, making it the recommended selection for new implementations.

Q: What are the critical parameters for substitution?

A: Substitution equivalence is determined by base product number (EP3SE80), logic element count (80,000), I/O configuration (488 pins), RAM capacity (6,843,392 bits), package type (780-FBGA), voltage range (0.86V ~ 1.15V), and operating temperature range (0°C ~ 85°C).