EP3SE80F780C2 Equivalent & Substitute Parts

Part Overview

The EP3SE80F780C2 is a Stratix III E Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 80,000 logic elements, 488 I/O pins, and 6,843,392 bits of embedded RAM in a 780-FBGA package. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support, maintenance, and new design implementations where legacy compatibility is required.

Substiute Parts

EP3SE80F780C2

IntelIn Stock: 1096EP3SE80F780C2 Datasheet

Current PartRFQ

EP3SE80F780C2G

IntelIn Stock: 1229EP3SE80F780C2G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the EP3SE80F780C2 is determined by strict equivalence across the following critical parameters:

• Base product number (EP3SE80)
• Logic element count (80,000)
• I/O pin count (488)
• Embedded RAM capacity (6,843,392 bits)
• Package designation (780-FBGA)
• Supply voltage range (0.86V ~ 1.15V)
• Operating temperature range (0°C ~ 85°C)
• RoHS compliance status
• Moisture sensitivity level (MSL 3)

The EP3SE80F780C2G qualifies as a direct substitute based on identical electrical specifications, package footprint, and functional parameters. The primary distinction is packaging format and product status transition.

Parameter Comparison

Engineering Selection Recommendations

The EP3SE80F780C2G is a direct functional equivalent to the EP3SE80F780C2. Both devices share identical electrical characteristics, pin configurations, and package dimensions. The EP3SE80F780C2G maintains active product status with current manufacturing support, whereas the EP3SE80F780C2 is classified as obsolete. Both parts maintain RoHS compliance and equivalent moisture sensitivity specifications.

Selection between these parts should be based on availability, supply chain requirements, and packaging format preferences. The transition from tube to tray packaging in the EP3SE80F780C2G does not affect electrical performance or board-level compatibility. Inventory availability and lead time considerations may influence component selection for production environments.

Frequently Asked Questions (FAQ)

Q: Are EP3SE80F780C2 and EP3SE80F780C2G pin-compatible?

A: Yes. Both devices use the 780-FBGA package with identical pin assignments, voltage requirements, and signal definitions. PCB layouts designed for either part are interchangeable.

Q: What is the difference between tube and tray packaging?

A: Tube packaging contains components in a continuous plastic tube, while tray packaging uses segmented plastic trays. Both formats provide equivalent protection and moisture control (MSL 3). Selection depends on assembly line equipment compatibility and handling procedures.

Q: Can EP3SE80F780C2G be used as a direct replacement in existing designs?

A: Yes. The EP3SE80F780C2G provides identical electrical performance, logic capacity, I/O configuration, and thermal characteristics. No design modifications are required for substitution.

Q: Why is the EP3SE80F780C2 classified as obsolete?

A: Product obsolescence reflects Intel's manufacturing lifecycle decisions. The EP3SE80F780C2G remains in active production, providing continued support for this logic density and I/O configuration.

Q: Are there compliance differences between these parts?

A: No. Both parts maintain RoHS compliance, identical MSL ratings, and equivalent environmental specifications. Compliance documentation applies uniformly across both part numbers.