EP3SE50F780I3 Equivalent & Substitute Parts

Part Overview

The EP3SE50F780I3 is a Stratix III E Field Programmable Gate Array (FPGA) manufactured by Intel, featuring 488 I/O pins in a 780-FBGA package. This device integrates 47,500 logic elements and 5,760,000 bits of embedded RAM, designed for high-density programmable logic applications in embedded systems.

The EP3SE50F780I3 carries an Obsolete product status. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support long-term production requirements for systems utilizing this FPGA architecture.

Substiute Parts

EP3SE50F780I3

IntelIn Stock: 16748EP3SE50F780I3 Datasheet

Current PartRFQ

EP3SE50F780I3G

IntelIn Stock: 1076EP3SE50F780I3G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the EP3SE50F780I3 is determined by strict equivalence across the following critical parameters:

• Identical logic element count (47,500)
• Identical embedded RAM capacity (5,760,000 bits)
• Identical I/O pin count (488)
• Identical LAB/CLB count (1,900)
• Matching voltage supply range (0.86V – 1.15V)
• Matching operating temperature range (-40°C to +100°C TJ)
• Identical package type and pinout (780-BBGA, FCBGA, 780-FBGA 29×29)
• Matching RoHS compliance status
• Matching MSL rating (3, 168 Hours)

The EP3SE50F780I3G qualifies as a direct substitute based on full parameter alignment across all electrical and mechanical specifications.

Parameter Comparison

Engineering Selection Recommendations

The EP3SE50F780I3G is the qualified substitute for the EP3SE50F780I3. Both parts maintain identical electrical and mechanical specifications, ensuring functional and physical compatibility in existing designs.

The primary distinction is product status: the EP3SE50F780I3 is classified as Obsolete, while the EP3SE50F780I3G maintains Active status. For new production runs and long-term supply chain planning, the EP3SE50F780I3G is the appropriate selection. Both parts carry RoHS Compliance certification and matching MSL ratings, confirming environmental and regulatory equivalence.

Frequently Asked Questions (FAQ)

Q: Can the EP3SE50F780I3G replace the EP3SE50F780I3 in existing designs?

A: Yes. Both parts are electrically and mechanically identical across all specified parameters, including logic element count, RAM capacity, I/O configuration, voltage supply range, operating temperature range, package type, and pinout. Direct substitution is supported without design modification.

Q: What is the significance of the product status difference?

A: The EP3SE50F780I3 is Obsolete, indicating Intel has discontinued production and support. The EP3SE50F780I3G is Active, meaning it remains in production with ongoing manufacturer support. For new designs and production continuity, the Active part is the recommended selection.

Q: Are the package specifications identical?

A: Yes. Both parts use the 780-FBGA package with 29×29 dimensions, classified as 780-BBGA, FCBGA. Pin assignments and mechanical footprints are identical, enabling direct PCB compatibility.

Q: Do both parts meet the same compliance requirements?

A: Yes. Both the EP3SE50F780I3 and EP3SE50F780I3G are RoHS Compliant with matching Moisture Sensitivity Level ratings (MSL 3, 168 Hours), confirming equivalent environmental and regulatory compliance.

Q: What are the critical parameters for substitution eligibility?

A: Substitution requires matching logic element count (47,500), embedded RAM capacity (5,760,000 bits), I/O pin count (488), voltage supply range (0.86V – 1.15V), operating temperature range (-40°C to +100°C TJ), package type (780-FBGA 29×29), and compliance certifications (RoHS, MSL).