Equivalent & Substitute Parts for EP3SE50F484C2

Part Overview

The EP3SE50F484C2 is a Stratix III E Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capacity. This device features 47,500 logic elements, 5,760,000 RAM bits, and 296 I/O pins in a 484-FBGA package. The EP3SE50F484C2 is classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and procurement planning.

Substiute Parts

EP3SE50F484C2

IntelIn Stock: 813EP3SE50F484C2 Datasheet

Current PartRFQ

EP3SE50F484C2G

IntelIn Stock: 827EP3SE50F484C2G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the EP3SE50F484C2 are identified based on strict equivalence across the following critical parameters:

• Logic Architecture: Identical Stratix III E series platform
• Logic Density: 47,500 logic elements (no variation)
• Memory Configuration: 5,760,000 RAM bits (no variation)
• I/O Count: 296 I/O pins (no variation)
• Package Specification: 484-FBGA (23x23) form factor
• Electrical Characteristics: 0.86V ~ 1.15V supply voltage range
• Thermal Range: 0°C ~ 85°C operating temperature
• Compliance: RoHS compliant, MSL 3 rating

The EP3SE50F484C2G qualifies as a direct substitute based on identical electrical, logical, and mechanical specifications. The primary distinction is packaging format (Tray vs. standard packaging) and product status (Active vs. Obsolete).

Parameter Comparison

Engineering Selection Recommendations

The EP3SE50F484C2G is a direct functional equivalent to the EP3SE50F484C2. Both devices share identical electrical specifications, logic architecture, memory configuration, and I/O characteristics. The EP3SE50F484C2G carries Active product status, making it the preferred selection for new procurement and system support where the obsolete EP3SE50F484C2 is no longer available through standard distribution channels.

Both parts maintain RoHS compliance and identical MSL ratings, ensuring compatibility with current manufacturing and storage requirements. The difference in packaging format (Tray for EP3SE50F484C2G) does not affect functional performance or PCB integration.

Frequently Asked Questions (FAQ)

Q: Can EP3SE50F484C2G be used as a direct replacement for EP3SE50F484C2?

A: Yes. Both devices are electrically and functionally identical across all critical parameters: logic elements, RAM capacity, I/O count, supply voltage, operating temperature, and package dimensions. The EP3SE50F484C2G is the recommended substitute due to its Active product status.

Q: What is the difference between the two part numbers?

A: The primary differences are product status (Obsolete vs. Active) and packaging format (Standard vs. Tray). The "G" suffix in EP3SE50F484C2G indicates Tray packaging. All functional and electrical specifications are identical.

Q: Are there any compatibility concerns with PCB design or layout?

A: No. Both parts use the identical 484-FBGA (23x23) package footprint and pinout. PCB designs, solder profiles, and thermal management strategies require no modification.

Q: What is the MSL rating, and why does it matter?

A: Both parts carry MSL 3 (168 Hours), indicating moisture sensitivity. Components must be stored in controlled humidity environments and baked according to IPC standards before reflow soldering. This requirement applies equally to both part numbers.

Q: Is the EP3SE50F484C2G available in higher volumes?

A: The EP3SE50F484C2G carries Active product status with documented inventory availability, making it suitable for volume procurement. The EP3SE50F484C2, being Obsolete, has limited availability through authorized distributors.