EP3C5F256I7 Equivalent & Substitute Parts

Part Overview

The EP3C5F256I7 is a Cyclone® III Field Programmable Gate Array (FPGA) IC manufactured by Intel, featuring 182 I/O pins and 256-ball fine-pitch ball grid array (FBGA) packaging. This embedded programmable logic device integrates 5136 logic elements and 423936 total RAM bits, designed for applications requiring reconfigurable digital logic at 1.15V to 1.25V supply voltage. The part operates across the industrial temperature range of -40°C to 100°C (junction temperature). As an active product with established supply availability, substitute parts are identified to provide procurement flexibility and alternative packaging options for system integration.

Substiute Parts

EP3C5F256I7

IntelIn Stock: 2797EP3C5F256I7 Datasheet

Current PartRFQ

EP3C5F256I7N

IntelIn Stock: 1897EP3C5F256I7N Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the EP3C5F256I7 is determined by strict equivalence across core electrical and mechanical parameters. The substitute part EP3C5F256I7N maintains identical functional specifications: same logic element count (5136), RAM capacity (423936 bits), I/O pin count (182), supply voltage range (1.15V ~ 1.25V), operating temperature range (-40°C ~ 100°C), package type (256-LBGA), and physical footprint (256-FBGA 17x17). The primary distinction between the main part and substitute is the packaging format (tube versus tray) and RoHS compliance status. Both parts belong to the Cyclone® III FPGA family and share identical base product designation (EP3C5), confirming functional interchangeability at the circuit level.

Parameter Comparison

Engineering Selection Recommendations

Selection between EP3C5F256I7 and EP3C5F256I7N is determined by regulatory and procurement requirements rather than functional performance. Both parts deliver identical electrical and mechanical characteristics within the Cyclone® III FPGA family. The EP3C5F256I7N is the appropriate choice for applications subject to RoHS compliance mandates, as it meets RoHS Compliant status. The EP3C5F256I7 remains suitable for applications without RoHS requirements. Packaging format selection (tube versus tray) depends on assembly line automation and inventory management protocols. Both parts maintain REACH Unaffected status and identical ECCN/HTSUS classifications, confirming regulatory equivalence for export and supply chain purposes.

Frequently Asked Questions (FAQ)

Q: Are EP3C5F256I7 and EP3C5F256I7N functionally identical? A: Yes. Both parts contain 5136 logic elements, 423936 RAM bits, 182 I/O pins, and operate at 1.15V to 1.25V across -40°C to 100°C. They share the same 256-FBGA (17x17) footprint and mounting characteristics.

Q: What is the difference between these two part numbers? A: The primary differences are RoHS compliance status (EP3C5F256I7N is RoHS Compliant; EP3C5F256I7 is non-compliant) and packaging format (EP3C5F256I7N ships in trays; EP3C5F256I7 ships in tubes).

Q: Can I substitute EP3C5F256I7N for EP3C5F256I7 on a PCB? A: Yes, at the circuit level. Both parts are pin-compatible and electrically equivalent. Substitution is valid provided your application does not require the specific packaging format of the original part.

Q: Does packaging format affect PCB assembly? A: Packaging format (tube versus tray) affects handling and automated pick-and-place processes but does not alter the component's electrical performance or PCB footprint requirements.

Q: Which part should I select for RoHS-regulated applications? A: Select EP3C5F256I7N, which carries RoHS Compliant certification. The EP3C5F256I7 is RoHS non-compliant and unsuitable for applications subject to RoHS directives.

Q: Are both parts currently available? A: Yes. EP3C5F256I7 has 2701 pieces in stock; EP3C5F256I7N has 1876 pieces in stock as new original inventory.