Equivalent & Substitute Parts for EP3C5F256C7

Part Overview

The EP3C5F256C7 is a Cyclone® III Field Programmable Gate Array (FPGA) IC manufactured by Intel, featuring 182 I/O pins and 256-ball fine-pitch ball grid array (FBGA) packaging. This device is designed for embedded applications requiring programmable logic functionality with 5,136 logic elements and 423,936 total RAM bits. The part is currently in active production status. Identifying equivalent and substitute parts is necessary to ensure design flexibility, manage supply chain continuity, and accommodate inventory availability across different procurement channels.

Substiute Parts

EP3C5F256C7

IntelIn Stock: 1167EP3C5F256C7 Datasheet

Current PartRFQ

EP3C5F256C7N

IntelIn Stock: 1341EP3C5F256C7N Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the EP3C5F256C7 are identified based on strict equivalence across the following critical parameters:

• Base product number (EP3C5)
• Logic element count (5,136)
• RAM capacity (423,936 bits)
• I/O pin count (182)
• Supply voltage range (1.15V ~ 1.25V)
• Operating temperature range (0°C ~ 85°C)
• Package specification (256-LBGA, 17x17 form factor)
• Series designation (Cyclone® III)

The substitute part EP3C5F256C7N meets all these electrical and mechanical parameters, ensuring functional and physical compatibility in embedded FPGA applications.

Parameter Comparison

Engineering Selection Recommendations

Both EP3C5F256C7 and EP3C5F256C7N are functionally equivalent Cyclone® III FPGA devices with identical electrical specifications and package configurations. The primary distinction between these parts is regulatory compliance status. The EP3C5F256C7N carries RoHS Compliant certification, while the EP3C5F256C7 is RoHS non-compliant. For applications subject to RoHS directives or requiring compliance documentation, the EP3C5F256C7N is the appropriate selection. Both parts maintain identical REACH Unaffected status and Moisture Sensitivity Level 3 specifications. Selection between these parts should be based on regulatory requirements applicable to the end application and target market.

Frequently Asked Questions (FAQ)

Q: Are EP3C5F256C7 and EP3C5F256C7N pin-for-pin compatible?

A: Yes. Both parts feature identical 256-LBGA (17x17) packaging with 182 I/O pins in the same physical configuration, ensuring direct pin-for-pin compatibility.

Q: Can EP3C5F256C7N be used as a direct replacement for EP3C5F256C7?

A: Yes, provided that RoHS compliance requirements are met or not applicable to your application. All electrical parameters, logic capacity, memory, and thermal specifications are identical.

Q: What is the difference between the part numbers EP3C5F256C7 and EP3C5F256C7N?

A: The suffix "N" in EP3C5F256C7N indicates RoHS Compliant status. The base device specifications remain unchanged.

Q: Are there any thermal or electrical performance differences between these parts?

A: No. Both parts operate within the same voltage range (1.15V ~ 1.25V) and temperature range (0°C ~ 85°C), with identical logic element count, RAM capacity, and I/O configuration.

Q: What is Moisture Sensitivity Level 3, and does it affect part selection?

A: Moisture Sensitivity Level 3 indicates the part requires controlled storage conditions (168 hours maximum at 30°C/60% RH before reflow). Both parts carry this specification and require identical handling protocols.

Q: Should I prioritize EP3C5F256C7N over EP3C5F256C7 for new designs?

A: Selection depends on regulatory requirements. For applications requiring RoHS compliance, EP3C5F256C7N is the appropriate choice. For applications without RoHS mandates, either part is functionally suitable.